Systems, Devices, and/or Methods for Manufacturing Castings

ABSTRACT

Certain exemplary embodiments can provide a composition, system, machine, device, manufacture, circuit, and/or user interface adapted for, and/or a method and/or machine-readable medium comprising machine-implementable instructions for, activities that can comprise, after removing a cast device from a stack-lamination-derived mold, said cast device formed from a molding composition, applying a desired shape to said cast device to form a shaped cast device, said molding composition comprising: a ceramic composition comprising silica; an cycloaliphatic epoxy binder composition, said cycloaliphatic epoxy binder composition present in said molding composition in an amount up to 30% by weight of said molding composition; a silicone composition comprising a siloxane resin, said silicone composition present in said molding composition in an amount up to 30% by weight of said molding composition; and a solvent composition adapted to dissolve said cycloaliphatic epoxy binder composition and said silicone composition.

CROSS-REFERENCES TO RELATED APPLICATIONS

This application claims priority to, and incorporates herein in itsentirety, pending U.S. Provisional Patent Application Ser. No.61/100,427 (Attorney Docket 1021-040), filed 26 Sep. 2008.

BRIEF DESCRIPTION OF THE DRAWINGS

A wide variety of potential practical and useful embodiments will bemore readily understood through the following detailed description ofcertain exemplary embodiments, with reference to the accompanyingexemplary drawings in which:

FIG. 1 is a flowchart of an exemplary method;

FIG. 2 is a flow diagram of exemplary items fabricated using anexemplary method;

FIG. 3 is a perspective view of an exemplary casting that illustratesaspect ratio;

FIG. 4 is an assembly view of an exemplary assembly;

FIG. 5A is a top view of an exemplary stack lamination mold;

FIGS. 5B-5E are exemplary alternative cross-sectional views of anexemplary stack lamination mold taken at section lines 5-5 of FIG. 5A;

FIG. 6 is an unassembled cross-sectional view of an alternativeexemplary stack lamination mold taken at section lines 5-5 of FIG. 5A;

FIG. 7 is a cross-sectional view of an exemplary alternative stacklamination mold taken at section lines 5-5 of FIG. 5A;

FIG. 8 is a perspective view of an exemplary laminated mold;

FIG. 9 is a cross-section of an exemplary mold taken along lines 9-9 ofFIG. 8;

FIG. 10A is a top view an exemplary layer having a redundant array ofshapes;

FIG. 10B is a top view of an exemplary layer having a non-redundantcollection of shapes;

FIG. 11 is a top view of an exemplary stacked lamination mold;

FIG. 12 is a cross-sectional view of an exemplary mold taken at sectionlines 12-12 of FIG. 11;

FIG. 13 is a side view of an exemplary cast part formed using theexemplary mold of FIG. 11;

FIG. 14 is a top view of an exemplary laminated mold;

FIG. 15 is a cross-sectional view of an exemplary mold taken at sectionlines 15-15 of FIG. 14;

FIG. 16 is a perspective view of an exemplary cast part formed using theexemplary mold of FIG. 14;

FIG. 17 is a top view of an exemplary planar laminated mold having anarray of openings;

FIG. 18 is a top view of an exemplary flexible casting or mold insertmolded using the laminated mold of FIG. 17;

FIG. 19 is a top view of an exemplary mold fixture;

FIG. 20 is a top view of an exemplary planar laminated mold;

FIG. 21 is a top view of an exemplary flexible casting or mold insertmolded using the laminated mold of FIG. 20;

FIG. 22 is a top view of an exemplary mold fixture;

FIG. 23 is a perspective view of an exemplary laminated mold;

FIG. 24 is a close-up perspective view of an exemplary singlecylindrical cavity of an exemplary mold;

FIG. 25 is a perspective view of an exemplary cast part;

FIG. 26 is a flowchart of an exemplary method;

FIG. 27 is a perspective view of a plurality of exemplary layers;

FIG. 28 is a perspective view of an exemplary laminating fixture;

FIG. 29 is a top view of stack lamination mold that defines an array ofcavities;

FIG. 30 is a cross-section of a cavity taken along section lines 30-30of FIG. 29;

FIG. 31 is a perspective view of an exemplary single corrugatedfeedhorn;

FIG. 32 is a side view of an exemplary casting fixture;

FIG. 33 is a side view of an exemplary section of cylindrical tubingthat demonstrates the shape of an exemplary fluidic channel;

FIG. 34 is a top view of an exemplary micro-machined layer;

FIG. 35 is a cross-sectional view of a laminated slit taken alongsection lines 35-35 of FIG. 34;

FIG. 36 is a side view of a portion of an exemplary flexible cavityinsert;

FIG. 37 is a top view of an exemplary base plate;

FIG. 38 is a front view of a single exemplary flexible cavity insertassembly;

FIG. 39 is a front view of flexible cavity inserts;

FIG. 40 is a top view of a top plate;

FIG. 41 is a flowchart of an exemplary embodiment of a method;

FIG. 42A is a top view of an exemplary laminated stack;

FIG. 42B is a cross-sectional view, taken at section lines 42-42 of FIG.42A, of an exemplary laminated stack;

FIG. 43 is side view of an exemplary mold and casting;

FIG. 44 is a top view of an exemplary casting fixture;

FIG. 45 is a front view of the exemplary casting fixture of FIG. 44;

FIG. 46 is a top view of a portion of an exemplary grid pattern;

FIG. 47 is an assembly view of components of an exemplary pixilatedgamma camera;

FIG. 48A is a top view of an array of generic microdevices;

FIG. 48B is a cross-sectional view of an exemplary microdevice, taken atsection lines 48-48 of FIG. 48A, in the open state;

FIG. 49 is a cross-sectional view of the exemplary microdevice of FIG.48B, taken at section lines 48-48 of FIG. 48A, in the closed state;

FIG. 50 is a cross-sectional view of an alternative exemplarymicrodevice, taken at section lines 48-48 of FIG. 48A, and shown with aninlet valve open;

FIG. 51 is a cross-sectional view of the alternative exemplarymicrodevice of FIG. 50, taken at section lines 48-48 of FIG. 48A, andshown with an outlet valve open;

FIG. 52 is a top view of an exemplary microwell array;

FIG. 53 is a cross-sectional view taken at lines 52-52 of FIG. 52 of anexemplary microwell;

FIG. 54 is a cross-sectional view taken at lines 52-52 of FIG. 52 of analternative exemplary microwell;

FIG. 55 is a top view of exemplary microwell;

FIG. 56 is a cross-sectional view of an exemplary microwell, taken atlines 55-55 of FIG. 55;

FIG. 57 illustrates an exemplary embodiment of a microstructure derivedfrom a finite element analysis (FEA) and formed via an exemplary methoddescribed herein;

FIG. 58 is a perspective view of an exemplary embodiment of opposinginterlocking microstructures formed via an exemplary method describedherein;

FIG. 59 is a perspective view of an exemplary embodiment of a latticemicrostructure formed via an exemplary method described herein;

FIG. 60 is a perspective view of an exemplary embodiment of a compositemicrostructure formed via an exemplary method described herein;

FIG. 61 is a flowchart of an exemplary embodiment of a basic sequence ofan exemplary method described herein;

FIG. 62 is a block diagram of an exemplary embodiment of a basicsequence of an exemplary method described herein;

FIG. 63 is a perspective view of an exemplary embodiment of a simplifiedmicrostructure formed via an exemplary method described herein;

FIG. 64 is a perspective view of an exemplary embodiment of amacro-scale surface comprising a plurality of microstructures, thesurface and microstructures formed via an exemplary method describedherein;

FIG. 65 is a photomicrograph of exemplary columnar microstructuresformed via an exemplary method described herein;

FIG. 66 is a photomicrograph of exemplary cast microstructures formedvia an exemplary method described herein;

FIG. 67 is a photomicrograph of an exemplary 7-layer microstructureformed via an exemplary method described herein;

FIG. 68 is a photomicrograph of an exemplary array of microstructuresformed via an exemplary method described herein;

FIG. 69 is a photomicrograph of a surface of an exemplary microstructureformed via an exemplary method described herein;

FIG. 70 illustrates some exemplary embodiments of tessellation;

FIG. 71 illustrates some exemplary embodiments of fractal patterns;

FIG. 72 illustrates an exemplary output of an exemplary finite elementanalysis;

FIG. 73 shows a perspective view of an exemplary isogrid structure;

FIG. 74 is a perspective view of an exemplary embodiment of an isogrid74000;

FIG. 75A and FIG. 75B are a top and side views, respectively of anexemplary embodiment of a male interlocking isogrid 75100;

FIG. 75C and FIG. 75D are a top and side views, respectively of anexemplary embodiment of a female interlocking isogrid 75200;

FIG. 76 is a block diagram of an exemplary embodiment of an informationdevice 76000;

FIG. 77A is a top view of an exemplary embodiment of a system 77000comprising an isogrid tiling positioner;

FIG. 77B is a front view of an exemplary embodiment of the system 77000of FIG. 77A;

FIG. 78A is a top view of an exemplary embodiment of a system 78000comprising an channeled isogrid;

FIG. 78B is a front view of an exemplary embodiment of the system 78000of FIG. 78A;

FIG. 79A is a top view of an exemplary embodiment of a system 79000comprising an isogrid attached to a face plate;

FIG. 79B is a front view of an exemplary embodiment of system 79000 ofFIG. 79A;

FIG. 79C is a front view of an exemplary embodiment of system 79000 ofFIG. 79A;

FIG. 80A is a top view of an exemplary embodiment of a system 80000comprising an isogrid stacking positioner;

FIG. 80B is a front view of an exemplary embodiment of system 80000 ofFIG. 80A;

FIG. 80C is a front view of an exemplary embodiment of system 80000 ofFIG. 80A;

FIG. 81A is a top view of an exemplary embodiment of a system 81000comprising an isogrid stacking positioner;

FIG. 81B is a front view of an exemplary embodiment of system 81000 ofFIG. 81A;

FIG. 82A is a top view of an exemplary embodiment of a system 82000comprising an isogrid stacking positioner;

FIG. 82B is a front view of an exemplary embodiment of system 82000 ofFIG. 82A;

FIG. 82C is a front view of an exemplary embodiment of system 82000 ofFIG. 82A;

FIG. 83A is a top view of an exemplary embodiment of a system 83000comprising a fillet joining two ligaments at a node;

FIG. 83B is a front view of an exemplary embodiment of system 83000 ofFIG. 83A;

FIG. 84 is a top view of an exemplary embodiment of a system 84000comprising a substantially circular node;

FIG. 85 is a top view of an exemplary embodiment of a system 85000comprising an isogrid tiling positioner;

FIG. 86 is a top view of an exemplary embodiment of a system 86000comprising an interlocking isogrid tiling positioner;

FIG. 87 is a flowchart of an exemplary embodiment of a method;

FIG. 88 is a flowchart of an exemplary embodiment of a method;

FIG. 89 is a flowchart of an exemplary embodiment of a method;

FIG. 90 is a block diagram of an exemplary embodiment of an informationdevice;

FIG. 91 is a perspective view of an exemplary embodiment of a foilstructure;

FIG. 92 is a perspective view of an exemplary embodiment of a metallicfoil stack that includes a plurality of inserted spherical mold inserts;

FIG. 93 is a perspective view of an exemplary embodiment of a metallicfoil stack fixture;

FIG. 94 is a perspective view of an exemplary embodiment of a mold of ametallic foil stack fixture containing a laminated stack of metallicfoils;

FIG. 95 is a perspective view of an exemplary embodiment of a metallicfoil stack fixture on an exemplary vibration table;

FIG. 96 is a perspective view of an exemplary embodiment of a green castpart;

FIG. 97 is a front view of an exemplary embodiment of a green cast part;

FIG. 98 is a perspective view of an exemplary embodiment of a green castpart;

FIG. 99 is a close-up perspective view of an exemplary embodiment of agreen cast part that includes an inserted metallic foil mold insert,taken at section B of FIG. 98;

FIG. 100 is a perspective view of an exemplary embodiment of a greencast part;

FIG. 101 is a perspective view of an exemplary embodiment of a greencast part being shaped;

FIG. 102 is a perspective view of an exemplary embodiment of a shapedcast part;

FIG. 103 is a perspective view of an exemplary embodiment of a shapedcast part and showing a reinforcing metallic foil mold insert;

FIG. 104 is a perspective view of an exemplary embodiment of a shapedcast part attached to an exemplary device not formed via a stacklamination mold;

FIG. 105 is a perspective view of an exemplary embodiment of aturbo-machine;

FIG. 106 is a schematic diagram of an exemplary embodiment of aturbo-machine, and

FIG. 107 is a perspective view of an exemplary embodiment of aturbo-machine part.

DETAILED DESCRIPTION

Certain exemplary embodiments can combine certain techniques of stacklamination with certain molding processes to manufacture a finalproduct. As a result of the stack lamination techniques, precisionmicro-scale cavities of predetermined shapes can be engineered into thestack lamination. Rather than have the stack lamination embody the finalproduct, however, the stack lamination can be used as an intermediate ina casting or molding process.

In certain exemplary embodiments, the stack lamination (“laminatedmold”) can be made up of layers comprising metallic, polymeric, and/orceramic material. The mold can be a positive replication of apredetermined end product or a negative replication thereof. The moldcan be filled with a first cast material and allowed to solidify. Afirst cast product can be demolded from the mold. The first castmaterial can comprise a flexible polymer such as silicone rubber.

Certain exemplary embodiments of a method can further includesurrounding the first cast product with a second casting material andallowing the second cast material to solidify. Still further, a secondcast product can be demolded from the first cast product.

Some exemplary embodiments can further include positioning an insertinto the cavity prior to filling the mold with the first cast material,wherein the insert occupies only a portion of the space defined by thecavity. The second cast product can be nonplanar. The end product and/orthe mold cavity can have an aspect ratio greater that 100:1. The endproduct can be attached to the substrate or it can be a free-standingstructure.

In certain exemplary embodiments, the master mold can be fabricatedusing diverse micro-machining methods, which can allow hybridintegration of various disciplines. In certain exemplary embodiments,the master mold can be fabricated using high-precision lithographictechniques, which can allow production of accurate molds, castings, andfeatures having virtually any shape.

In certain exemplary embodiments, layers for master mold fabrication canbe produced by using low cost materials and low cost manufacturingmethods such as photo-chemical machining. In certain exemplaryembodiments, the layers used for master mold fabrication can havesub-cavities with controlled depths and shapes. These cavities can beused to produce integrated micro-features in cast objects.

In certain exemplary embodiments, the master molds can be produced overlarge areas. This allows the production of large batches of castmicro-devices or large macro devices with incorporated arrays of microfeatures. In certain exemplary embodiments, master molds and castingscan be produced having extremely high-aspect ratios. Aspect ratio'sgreater than 400:1 can be achieved using photo-chemical machiningcombined with precision stack lamination.

In certain exemplary embodiments, hundreds to thousands of individualstructures can be batch produced simultaneously, eliminating the need toproduce 3D micro-structures one at a time. In certain exemplaryembodiments, many diverse materials can be used to create advanced moldsand/or cast devices. This can greatly enhance design and fabricationopportunities for low cost, application specific devices. Materials caninclude, but are not limited to, polymers, epoxy resins, polyesters,acrylics, ceramics, powder metals, castable metals, urethanes, silicon,and/or rubber etc. Materials can also be integrated for production of“smart” materials needed for fabricating advanced MEMS devices. Smartmaterials would include those having functional properties such as forexample conductivity, electrostrictivity, piezoelectricity, magnetic,elastic, thermal, density, and/or chemical resistivity, etc.

In certain exemplary embodiments, the micro devices and/or structurescan be produced as free form or attached structures. This can beachieved through molding and casting designs or through secondarymachining techniques. In certain exemplary embodiments, micro devicescan be produced outside of clean room facilities, thereby potentiallylowering production overhead costs.

In certain exemplary embodiments, by using lithographic techniques forproducing master molds and/or micro devices, arrays of devices or microfeatures can be accurately integrated and aligned with standardmicroelectronics. In certain exemplary embodiments, through thefabrication method used for producing the master molds, highly accurate,three dimensional engineering and production of micro scale devices canbe possible. In certain exemplary embodiments, through the use offlexible molds, highly accurate, three dimensional engineering andproduction of non-planar, micro scale devices is possible. Non-planarshapes can include, but are not limited to, curves, arcs, diameters,spherical radii, inside and outside diameters of cylinders, etc.

FIG. 1 is a flowchart of an exemplary embodiment of a method 1000. Atactivity 1010, a mold design is determined. At activity 1020, the layersof the mold (“laminations”) are fabricated. At activity 1030, thelaminations are stacked and assembled into a mold (a derived mold couldbe produced at this point as shown in FIG. 1). At activity 1060, a firstcasting is cast. At activity 1070, the first casting is demolded.

FIG. 2 is a flow diagram of exemplary items fabricated during a method2000. Layers 2010 can be stacked to form a mold or stacked lamination2020. A molding or casting material can be applied to mold 2020 tocreate a molding or casting 2030, that can be demolded from mold 2020.

FIG. 3 is a perspective view of an exemplary molding 3000 thatdemonstrates a parameter referred to herein as “aspect ratio” which isdescribed below. Molded block 3010 has numerous through-holes 3020, eachhaving a height H and a diameter or width W. For the purposes of thisapplication, aspect ratio is defined as the ratio of height to width orH/W of a feature, and can apply to any “negative” structural feature,such as a space, channel, through-hole, cavity, etc., and can apply to a“positive” feature, such as a wall, projection, protrusion, etc., withthe height of the feature measured along the Z-axis. Note that allfeatures can be “bordered” by at least one “wall”. For a positivefeature, the wall is part of the feature. For a negative feature, thewall at least partially defines the feature.

FIG. 3 also demonstrates the X-, Y-, and Z-directions or axes. For thepurposes of this application, the dimensions measured in the X- andY-directions define a top surface of a structure (such as a layer, astack lamination mold, or negative and/or positive replications thereof)when viewed from the top of the structure. The Z-direction is the thirddimension perpendicular to the X-Y plane, and corresponds to the line ofsight when viewing a point on a top surface of a structure from directlyabove that point.

Certain embodiments of a method can control aspect ratios for some orall features in a laminated mold, derived mold, and/or cast item(casting). The ability to attain relatively high aspect ratios can beaffected by a feature's geometric shape, size, material, and/orproximity to another feature. This ability can be enhanced using certainembodiments. For example, through-features of a mold, derived mold,and/or final part, having a width or diameter of approximately 5microns, can have a dimension along the Z axis (height) of approximately100 microns, or approximately 500 microns, or any value in the rangethere between (implying an aspect ratio of approximately 20:1, 100:1, orany value in the range therebetween, including, for example:

-   -   20:1 to 30:1, 20:1 to 40:1, 20:1 to 50:1, 20:1 to 60:1, 20:1 to        70:1, 20:1 to 80:1, 20:1 to 90:1, 20:1 to 100:1,    -   30:1 to 40:1, 30:1 to 50:1, 30:1 to 60:1, 30:1 to 70:1, 30:1 to        80:1, 30:1 to 90:1, 30:1 to 100:1,    -   40:1 to 50:1, 40:1 to 60:1, 40:1 to 70:1, 40:1 to 80:1, 40:1 to        90:1, 40:1 to 100:1,    -   50:1 to 60:1, 50:1 to 70:1, 50:1 to 80:1, 50:1 to 90:1, 50:1 to        100:1,    -   60:1 to 70:1, 60:1 to 80:1, 60:1 to 90:1, 60:1 to 100:1,    -   70:1 to 80:1, 70:1 to 90:1, 70:1 to 100:1,    -   80:1 to 90:1, 80:1 to 100:1, etc).

As another example, a through slit having a width of approximately 20microns can have a height of approximately 800 microns, or approximately1600 microns, or any value in the range therebetween (implying an aspectratio of approximately 40:1, 80:1, or any value in the rangetherebetween, including, for example:

-   -   40:1 to 50:1, 40:1 to 60:1, 40:1 to 70:1, 40:1 to 80:1,    -   50:1 to 60:1, 50:1 to 70:1, 50:1 to 80:1,    -   60:1 to 70:1, 60:1 to 80:1,    -   70:1 to 80:1, etc).

As yet another example, the same approximately 20 micron slit can beseparated by an approximately 15 micron wide wall in an array, where thewall can have a dimension along the Z axis (height) of approximately 800microns, or approximately 1600 microns, or any value in the rangetherebetween (implying an aspect ratio of approximately 53:1, 114:1, orany value in the range therebetween, including, for example:

-   -   53:1 to 60:1, 53:1 to 70:1, 53:1 to 80:1, 53:1 to 90:1, 53:1 to        100:1, 53:1 to 110:1, 53:1 to 114:1,    -   60:1 to 70:1, 60:1 to 80:1, 60:1 to 90:1, 60:1 to 100:1, 60:1 to        110:1, 60:1 to 114:1,    -   70:1 to 80:1, 70:1 to 90:1, 70:1 to 100:1, 70:1 to 110:1, 70:1        to 114:1,    -   80:1 to 90:1, 80:1 to 100:1, 90:1 to 110:1, 90:1 to 114:1,    -   90:1 to 100:1, 90:1 to 110:1, 90:1 to 114:1,    -   100:1 to 110:1, 100:1 to 114:1, etc.).

Still another example is an array of square-shaped openings having sidesthat are approximately 0.850 millimeters wide, each opening separated byapproximately 0.150 millimeter walls, with a dimension along the Z axisof approximately 30 centimeters. In this example the approximately 0.850square openings have an aspect ratio of approximately 353:1, and theapproximately 0.150 walls have an aspect ratio of approximately 2000:1,with lesser aspect ratios possible. Thus, the aspect ratio of theopenings can be approximately 10:1, or approximately 350:1, or any valuein the range therebetween, including for example:

-   -   10:1 to 20:1, 10:1 to 30:1, 10:1 to 40:1, 10:1 to 50:1, 10:1 to        60:1, 10:1 to 70:1, 10:1 to 80:1, 10:1 to 90:1, 10:1 to 100:1,        10:1 to 150:1, 10:1 to 200:1, 10:1 to 250:1, 10:1 to 300:1, 10:1        to 350:1,    -   20:1 to 30:1, 20:1 to 40:1, 20:1 to 50:1, 20:1 to 60:1, 20:1 to        70:1, 20:1 to 80:1, 20:1 to 90:1, 20:1 to 100:1, 20:1 to 150:1,        20:1 to 200:1, 20:1 to 250:1, 20:1 to 300:1, 20:1 to 350:1,    -   30:1 to 40:1, 30:1 to 50:1, 30:1 to 60:1, 30:1 to 70:1, 30:1 to        80:1, 30:1 to 90:1, 30:1 to 100:1, 30:1 to 150:1, 30:1 to 200:1,        30:1 to 250:1, 30:1 to 300:1, 30:1 to 350:1,    -   40:1 to 50:1, 40:1 to 60:1, 40:1 to 70:1, 40:1 to 80:1, 40:1 to        90:1, 40:1 to 100:1, 40:1 to 150:1, 40:1 to 200:1, 40:1 to        250:1, 40:1 to 300:1, 40:1 to 350:1,    -   50:1 to 60:1, 50:1 to 70:1, 50:1 to 80:1, 50:1 to 90:1, 50:1 to        100:1, 50:1 to 150:1, 50:1 to 200:1, 50:1 to 250:1, 50:1 to        300:1, 50:1 to 350:1,    -   75:1 to 80:1, 75:1 to 90:1, 75:1 to 100:1, 75:1 to 150:1, 75:1        to 200:1, 75:1 to 250:1, 75:1 to 300:1, 75:1 to 350:1,    -   100:1 to 150:1, 100:1 to 200:1, 100:1 to 250:1, 100:1 to 300:1,        100:1 to 350:1,    -   150:1 to 200:1, 150:1 to 250:1, 150:1 to 300:1, 150:1 to 350:1,    -   200:1 to 250:1, 200:1 to 300:1, 200:1 to 350:1,    -   250:1 to 300:1, 250:1 to 350:1,    -   300:1 to 350:1, etc.

Moreover, the aspect ratio of the walls can be approximately 10:1, orapproximately 2000:1, or any value in the range therebetween, includingfor example:

-   -   10:1 to 20:1, 10:1 to 30:1, 10:1 to 40:1, 10:1 to 50:1, 10:1 to        100:1, 10:1 to 200:1, 10:1 to 500:1, 10:1 to 1000:1, 10:1 to        2000:1,    -   20:1 to 30:1, 20:1 to 40:1, 20:1 to 50:1, 20:1 to 100:1, 20:1 to        200:1, 20:1 to 500:1, 20:1 to 1000:1, 20:1 to 2000:1,    -   30:1 to 40:1, 30:1 to 50:1, 30:1 to 100:1, 30:1 to 200:1, 30:1        to 500:1, 30:1 to 1000:1, 30:1 to 2000:1,    -   40:1 to 50:1, 40:1 to 100:1, 40:1 to 200:1, 40:1 to 500:1, 40:1        to 1000:1, 40:1 to 2000:1,    -   50:1 to 100:1, 50:1 to 200:1, 50:1 to 500:1, 50:1 to 1000:1,        50:1 to 2000:1,    -   100:1 to 200:1, 100:1 to 500:1, 100:1 to 1000:1, 100:1 to        2000:1,    -   200:1 to 500:1, 200:1 to 1000:1, 200:1 to 2000:1,    -   500:1 to 1000:1, 500:1 to 2000:1,    -   1000:1 to 2000:1, etc.

Another example of aspect ratio is the space between solid (positive)features of a mold, derived mold, and/or casting. For example, as viewedfrom the top, a casting can have two or more solid rectangles measuringapproximately 50 microns wide by approximately 100 microns deep with anapproximately 5 micron space therebetween (either width-wise ordepth-wise). The rectangles can have a height of 100 microns, or 500microns, or any value in the range therebetween (implying an aspectratio of 20:1, or 100:1, or any value therebetween, including, forexample:

-   -   20:1 to 30:1, 20:1 to 40:1, 20:1 to 50:1, 20:1 to 60:1, 20:1 to        70:1, 20:1 to 80:1, 20:1 to 90:1, 20:1 to 100:1,    -   30:1 to 40:1, 30:1 to 50:1, 30:1 to 60:1, 30:1 to 70:1, 30:1 to        80:1, 30:1 to 90:1, 30:1 to 100:1,    -   40:1 to 50:1, 40:1 to 60:1, 40:1 to 70:1, 40:1 to 80:1, 40:1 to        90:1, 40:1 to 100:1,    -   50:1 to 60:1, 50:1 to 70:1, 50:1 to 80:1, 50:1 to 90:1, 50:1 to        100:1,    -   60:1 to 70:1, 60:1 to 80:1, 60:1 to 90:1, 60:1 to 100:1,    -   70:1 to 80:1, 70:1 to 90:1, 70:1 to 100:1,    -   80:1 to 90:1, 80:1 to 100:1, etc).

In another example the same rectangles can have a space there between ofapproximately 20 microns, and the rectangles can have dimensions alongthe Z axis of approximately 800 microns, or approximately 5000 microns,or any value therebetween (implying an aspect ratio of approximately40:1, or 250:1, or any value therebetween, including, for example:

-   -   40:1 to 50:1, 40:1 to 75:1, 40:1 to 100:1, 40:1 to 150:1, 40:1        to 200:1, 40:1 to 250:1,    -   75:1 to 100:1, 75:1 to 150:1, 75:1 to 200:1, 75:1 to 250:1,    -   100:1 to 150:1, 100:1 to 200:1, 100:1 to 250:1,    -   150:1 to 200:1, 150:1 to 250:1,    -   200:1 to 250:1, etc).

FIG. 4 is an assembly view of an exemplary assembly 4000 that includesmold 4010 and cast part 4020 formed from mold 4010. Because certainexemplary embodiments can utilize lithographically-derivedmicro-machining techniques (or in some cases,non-lithographically-derived micro-machining techniques, such as lasermachining) combined with molding and/or casting, laminated molds can beconceived as negatives 4010 or positives 4020 of the desired endproduct. The terms “negative” or “positive” replications can besubjective terms assigned to different stages of reaching an endproduct. For certain embodiments, any intermediate or the end productcan be considered a negative or positive replication depending on asubject's point of view. For the purpose of this application, a“positive’ replication is an object (whether an intermediate or an endproduct) that geometrically resembles at least a portion of the spatialform of the end product. Conversely, a “negative” replication is a moldthat geometrically defines at least a portion of the spatial form of theend product. The following parameters are described for the purpose ofdemonstrating some of the potential design parameters of certainembodiments of a method.

Layer Thickness

One design parameter can be the thickness of the micro-machined layersof the stack lamination mold. According to certain exemplaryembodiments, to achieve high-aspect ratios, multiple micro-machinedfoils or layers can be stacked in succession and bonded together. Incertain exemplary embodiments, the layer thickness can have adimensional role in creating the desired shape in the third dimension.FIG. 5A is a top view of an exemplary stack lamination mold 5000. FIGS.5B-5E are exemplary alternative cross-sectional views of exemplary stacklamination mold 5000 taken at section lines 5-5 of FIG. 5A. As shown inFIG. 5B and FIG. 5D, respectively, stacks 5010 and 5020 utilizerelatively thick layers. As shown in FIG. 5C and FIG. 5E, respectively,stacks 5030 and 5040 utilize relatively thinner layers in succession tosmooth out resolution along the z-axis. Specific layers can havemultiple functions that can be achieved through their thickness or otherincorporated features described herein.

Cross-Sectional Shape of Layer

One design parameter can be the cross sectional shape of a given layerin the mold. Through the use of etching and/or deposition techniques,many cross sectional shapes can be obtained. FIG. 6 is an unassembledcross-sectional view of an alternative exemplary stack lamination mold5000 taken at section lines 5-5 of FIG. 5A. Each of exemplary layers6010, 6020, 6030, and 6040 of FIG. 6 define an exemplary through-feature6012, 6022, 6032, 6042, respectively, each having a different shape,orientation, and/or configuration. These through-features 6012, 6022,6032, 6042 are bordered by one or more “sidewalls” 6014, 6024, 6034, and6044, respectively, as they are commonly referred to in the field oflithographic micro-machining.

Etching disciplines that can be utilized for a layer of the mold can bebroadly categorized as isotropic (non-linear) or anisotropic (linear),depending on the shape of the remaining sidewalls. Isotropic oftenrefers to those techniques that produce one or more radial or hourglassed shaped sidewalls, such as those shown in layer 6010. Anisotropictechniques produce one or more sidewalls that are more verticallystraight, such as those shown in layer 6020.

Additionally, the shape of a feature that can be etched through a foilof the mold can be controlled by the depth of etching on each surfaceand/or the configuration of the photo-mask. In the case ofphoto-chemical-machining, a term such as 90/10 etching is typically usedto describe the practice of etching 90% through the foil thickness, fromone side of the foil, and finishing the etching through the remaining10% from the other side, such as shown on layer 6030. Other etch ratioscan be obtained, such as 80/20, 70/30, and/or 65/35, etc., for variousfoils and/or various features on a given foil.

Also, the practice of displacing the positional alignment of featuresfrom the top mask to the bottom mask can be used to alter the sidewallconditions for a layer of the mold, such as shown in layer 6040.

By using these and/or other specific conditions as design parameters,layers can be placed to contribute to the net shape of the 3-dimensionalstructure, and/or provide specific function to that region of thedevice. For example, an hourglass sidewall could be used as a fluidchannel and/or to provide structural features to the device. FIG. 7 is across-sectional view of an alternative exemplary stack lamination moldtaken at section line 5-5 of FIG. 5A. FIG. 7 shows a laminated mold 5000having layers 7010, 7020, 7030, 7040 that define cavity 7060. To achievethis, layers 7010, 7020 are etched anisotropically to have straightsidewalls, while layer 7030 is thicker than the other layers and isetched isotropically to form the complex shaped cross-section shown.

Cross-Sectional Surface Condition of Layer

Another design parameter when creating advanced three-dimensionalstructures can be the cross-sectional surface condition of the layersused to create a laminated mold. As is the case with sidewall shape,surface condition can be used to provide additional function to astructure or a particular region of the structure. FIG. 8 is aperspective view of a generic laminated mold 8000. FIG. 9 is across-section of mold 8000 taken at lines 9-9 of FIG. 8. Any sidewallsurface, top or bottom surface can be created with one or more specificfinish conditions on all layers or on selected layers, such as forexample, forming a relatively rough surface on at least a portion of asidewall 9100 of certain through-features 9200 of layer 9300. As anotherexample, chemical and/or ion etching can be used to produce very smooth,polished surfaces through the use of selected materials and/orprocessing techniques. Similarly, these etching methods can also bemanipulated to produce very rough surfaces.

Secondary techniques, such as electro-plating and/or passive chemicaltreatments can also be applied to micromachined surfaces (such as alayer of the mold) to alter the finish. Certain secondary techniques(for example, lapping or superfinishing) can also be applied tonon-micromachined surfaces, such as the top or bottom surfaces of alayer. In any event, using standard profile measuring techniques,described as “roughness average” (R_(a)) or “arithmetic average” (AA),the following approximate ranges for surface finish (or surfaceconditions) are attainable using micromachining and/or one or moresecondary techniques according to certain embodiments (units inmicrons):

-   -   50 to any of: 25, 12.5, 6.3, 3.2, 1.6, 0.80, 0.40, 0.20, 0.10,        0.050, 0.025,    -   25 to any of: 12.5, 6.3, 3.2, 1.6, 0.80, 0.40, 0.20, 0.10,        0.050, 0.025,    -   12.5 to any of: 6.3, 3.2, 1.6, 0.80, 0.40, 0.20, 0.10, 0.050,        0.025,    -   6.3 to any of: 3.2, 1.6, 0.80, 0.40, 0.20, 0.10, 0.050, 0.025,    -   3.2 to any of: 1.6, 0.80, 0.40, 0.20, 0.10, 0.050, 0.025,    -   1.6 to any of: 0.80, 0.40, 0.20, 0.10, 0.050, 0.025,    -   0.80 to any of: 0.40, 0.20, 0.10, 0.050, 0.025,    -   0.40 to any of: 0.20, 0.10, 0.050, 0.025,    -   0.20 to any of: 0.10, 0.050, 0.025,    -   0.10 to any of: 0.050, 0.025,    -   0.050 to any of: 0.025, etc.

Additional Layer Features

Certain exemplary embodiments can include layer features that can becreated through the use of lithographic etching and/or deposition. Theseembodiments can include the size, shape, and/or positional orientationof features relative to the X- and/or Y-axes of a layer and/or theirrelationship to features on neighboring layers along the Z-axis of theassembled laminated mold. These parameters can define certain geometricaspects of the structure. For example, FIG. 10A is a top view of a layer10010 having a pattern of repeating features (a redundant array ofshapes), and FIG. 10B is a top view of a layer 10020 having a variety ofdifferently shaped features (a non-redundant collection of shapes).Although not shown, a layer can have both redundant and non-redundantfeatures. The terms “redundant” and/or “non-redundant” can refer toeither positive or negative features.

Thus, these parameters also can define the shapes and/or spatial formsof features, the number of features in a given area, secondarystructures and/or spaces incorporated on or around a feature, and/or thespaces between features. The control of spacing between features canprovide additional functionality and, for instance, allow integration ofdevices with micro-electronics. For example, conductive micro featurescould be arrayed (redundantly or non-redundantly) to align accuratelywith application specific integrated circuits (ASIC) to controlfeatures. Also, features could be arrayed for applications wherenon-linear spacing between features could enhance device functionality.For example, filtration elements could be arrayed in such a way as tomatch the flow and pressure profile of a fluid passing over or through afiltration media. The spacing of the filtration elements could bearrayed to compensate for the non-linear movement of the fluid.

Cavity Definition Using Lithography

A cavity formed in accordance with certain exemplary embodiments canassume a shape and/or spatial form that includes one or morepredetermined “protruding undercuts”. Imaginably rotating the X-Y planeabout its origin to any particular fixed orientation, a cavity isdefined as having a “protruding undercut” when a first section of thecavity taken perpendicular to the Z-axis (i.e., parallel to the X-Yplane) has a predetermined dimension in the X- and/or Y-directiongreater than the corresponding dimension in the X- and/or Y-direction ofa second section of the cavity taken perpendicular to the Z-axis, thesecond section further along in the direction of eventual demolding of acast part relative to the mold (assuming the demolding operationinvolves pulling the cast part free from the mold). That is, theX-dimension of the first section is intentionally greater than theX-dimension of the second section by a predetermined amount, or theY-dimension of the first section is intentionally greater than theY-dimension of the second section by a predetermined amount, or both. Instill other words, for the purposes of this patent application, the termprotruding undercut has a directional component to its definition.

FIG. 11 is a top view of an exemplary stacked laminated mold 11000. FIG.12 is a cross-sectional view of a mold 11000 taken at section lines12-12 of FIG. 11, and showing the layers 12010-12060 of mold 11000 thatcooperatively define a cavity having protruding undercuts 12022 and12042. Direction A is the relative direction in which a part cast usingmold 11000 will be demolded, and/or pulled away, from mold 11000. FIG.12 also shows that certain layers 12020, 12040 of mold 11000 have beenformed by controlled depth etching. As shown in FIG. 12, mold 11000defines an internal mold surface 12070, which is defined in part byprotruding undercuts 12022 and 12042. FIG. 13 is a side view of a castpart 13000 formed using mold 11000. As shown in FIG. 13, cast part 13000defines an external part periphery or surface 13100, which is defined inpart by 3-dimensional micro-features 13400 and 13600 that substantiallyspatially invertedly replicate protruding undercuts 12022 and 12042.

To make layers for certain embodiments of a laminated mold, such aslayers 2010 of FIG. 2, a photo-sensitive resist material coating (notshown) can be applied to one or more of the major surfaces (i.e., eitherof the relatively large planar “top” or “bottom” surfaces) of amicro-machining blank. After the blank has been provided with aphoto-resist material coating on its surfaces, “mask tools” or“negatives” or “negative masks”, containing a negative image of thedesired pattern of openings and registration features to be etched inthe blank, can be applied in alignment with each other and in intimatecontact with the surfaces of the blank (photo-resist materials are alsoavailable for positive patterns). The mask tools or negatives can bemade from glass, which has a relatively low thermal expansioncoefficient. Materials other than glass can be used provided that suchmaterials transmit radiation such as ultraviolet light and have areasonably low coefficient of thermal expansion, or are utilized in acarefully thermally-controlled environment. The mask tools can beconfigured to provide an opening of any desired shape and furtherconfigured to provide substantially any desired pattern of openings.

The resulting sandwich of two negative masks aligned in registration andflanking both surfaces of the blank then can be exposed to radiation,typically in the form of ultraviolet light projected on both surfacesthrough the negative masks, to expose the photo-resist coatings to theradiation. Typically, the photo-resist that is exposed to theultraviolet light is sensitized while the photo-resist that is notexposed is not sensitized because the light is blocked by each negativemasks' features. The negative masks then can be removed and a developersolution can be applied to the surfaces of the blank to develop theexposed (sensitized) photo-resist material.

Once the photo-resist is developed, the blanks can be micro-machinedusing one or more of the techniques described herein. For example, whenusing photo-chemical-machining, an etching solution can react with andremove the layer material not covered by the photo-resist to form theprecision openings in the layer. Once etching or machining is complete,the remaining unsensitized photo-resist can be removed using a chemicalstripping solution.

Sub-Cavities on Layers

Cavities can include sub-cavities, which can be engineered andincorporated into the molding and casting scheme using several methods.FIG. 14 is a top view of a laminated mold 14000. FIG. 15 is across-sectional view of mold 14000 taken at section lines 15-15 of FIG.14, and showing the sub-cavities 15010 within layer 15030 of mold 14000.Note that because layer 15030 is sandwiched between layers 15020 and15040, sub-cavities 15010 can be considered “sandwiched”, becausesub-cavities are at least partially bounded by a ceiling layer (e.g.,15020) and a floor layer (e.g., 15040). Note that, although not shown, asub-cavity can extend to one or more outer edges of its layer, therebyforming, for example, a sandwiched channel, vent, sprew, etc. FIG. 16 isa perspective view of cast part 16000 formed using mold 14000, andhaving protrusions 16010 that reflectively (invertedly) replicatesandwiched sub-cavities 15010.

Because cast part can very accurately reflect the geometries ofsub-cavities, such sub-cavities can be used to produce secondaryfeatures that can be incorporated with a desired structure. Examples ofsecondary features include fluid channels passing through or betweenfeatures, protrusions such as fixation members (similar to Velcro-typehooks), reservoirs, and/or abrasive surfaces. Moreover, a secondaryfeature can have a wall which can have predetermined surface finish, asdescribed herein.

There are a number of methods for producing sub-cavities in a laminatedmold. For example, in the field of photo-chemical-machining, thepractice of partially etching features to a specified depth is commonlyreferred to as “controlled depth etching” or CDE. CDE features can beincorporated around the periphery of an etched feature, such as athrough-diameter. Because the CDE feature is partially etched on, forexample, the top surface of the layer, it can become a closed cavitywhen an additional layer is placed on top.

Another method could be to fully etch the sub-cavity feature through thethickness of the layer. A cavity then can be created when theetched-through feature is sandwiched between layers without thefeatures, such as is shown in FIG. 15.

Combinations of micro-machining techniques can be used to createsub-cavities. For example, photo-chemical-machining (PCM) can be used tocreate the etched-through feature in the layer, while ion etching couldbe applied as a secondary process to produce the sub-cavities. Bycombined etching techniques, the sub-cavities can be etched with muchfiner detail than that of PCM.

Micro-Structures, Features, and Arrays on Non-Planar Surfaces

Certain exemplary embodiments can allow the production of complexthree-dimensional micro-devices on contoured surfaces through the use ofa flexible cavity mold insert.

One activity of such a process can be the creation of a planar laminatedmold (stack lamination), which can define the surface or 3-dimensionalstructures. A second mold (derived mold) can be produced from thelamination using a flexible molding material such as silicone RTV. Thederived mold can be produced having a thin backing or membrane layer,which can act as a substrate for the 3-dimensional surface or features.The membrane then can be mechanically attached to the contoured surfaceof a mold insert, which can define the casting's final shape with theincorporated 3-dimensional features or surface.

Because a mold can be derived from a series of previous molds, anyderived mold can be considered to be descended from each mold in thatseries. Thus, a given derived mold can have a “parent” mold, andpotentially a “grandparent” mold, etc. Likewise, from a stack laminationcan descend a first derived, descendant, or child mold, from which asecond derived, descendent, or grandchild mold can be descended, and soforth. Thus, as used herein to describe the relationship between moldsand castings, the root verbs “derive” and “descend” are considered to besynonymous.

As an example, FIG. 17 is a top view of a planar laminated mold 17010having an array of openings 17020. FIG. 18 is a top view of a flexiblecasting or mold insert 18010 molded using laminated mold 17010. Flexiblemold insert 18010 has an array of appendages 18020 corresponding to thearray of openings 17020, and a backing layer 18030 of a controlledpredetermined thickness.

FIG. 19 is a top view of a mold fixture 19010 having an outer diameter19020 and an inner diameter 19030. Placed around a cylinder or mandrel19040 within mold fixture 19010 is flexible mold insert 18010, defininga pour region 19050.

Upon filling pour region 19050, a casting is formed that defines acylindrical tube having a pattern of cavities accessible from its innerdiameter and corresponding to and formed by the array of appendages18020 of flexible mold insert 18010.

As another example, FIG. 20 is a top view of a planar laminated mold20010 having an array of openings 20020. FIG. 21 is a top view of aflexible casting or mold insert 21010 molded using laminated mold 20010.Flexible mold insert 21010 has an array of appendages 21020corresponding to the array of openings 20020, and a backing layer 21030of a controlled predetermined thickness.

FIG. 22 is a top view of a mold fixture 22010 having an outer diameter22020 and an inner diameter 22030. Placed around the inside diameter22030 within mold fixture 22010 is flexible mold insert 21010, defininga pour region 22050.

Upon filling pour region 22050, a casting is formed that defines acylindrical tube having a pattern of cavities accessible from its outerdiameter and corresponding to and formed by the array of appendages21020 of flexible mold insert 21010.

Through these and related approaches, the 3-dimensional structure orsurface can be built-up at the planar stage, and can be compensated forany distortions caused by forming the membrane to the contoured surface.The fabrication of the laminated mold can use specific or combinedmicro-machining techniques for producing the layers that define theaspect-ratio and 3-dimensional geometry. Micro-surfaces and/orstructures can be transferred to many contours and/or shapes. Forexample, micro-patterns can be transferred to the inside and/or outsidediameter of cylinders or tubes. Specific examples demonstrating thecapabilities of this method are provided later in this document.

Cavity Inserts

The term mold insert is used herein to describe a micro-machined patternthat is used for molding and/or fabrication of a cast micro-device,part, and/or item. The laminated or derived mold described in thisdocument also can be considered a mold insert. Cavity inserts aredescribed here as a subset of a mold insert. Cavity inserts are objectsand/or assemblies that can be placed within a cavity section of a moldbut that do not take up the entire cavity space, and that providefurther features to a 3-dimensional mold.

As an example, FIG. 23 is a perspective view of a laminated mold 23010having an array of cylindrical cavities 23020, each extending from topto bottom of mold 23010. FIG. 24 is a close-up perspective view of asingle cylindrical cavity 23020 of mold 23010. Suspended and extendingwithin cavity 23020 are a number of cavity inserts 23030. FIG. 25 is aperspective view of a cast part 25010 having numerous cavities 25020formed by cavity inserts 23030.

A cavity insert can also be produced using certain embodiments. This isfurther explained later in the section on non-planar molds. An insertcan be a portion of a mold in the sense that the insert will be removedfrom the cast product to leave a space having a predetermined shapewithin the product. An insert alternatively can become part of a finalmolded product. For instance, if it is desirable to have a composite endproduct, then a process can be engineered to leave an insert in place inthe final molded product.

As an example of a cavity insert, a 3-dimensional mold insert can beproduced using one or more embodiments, the insert having an array ofcavities that are through-diameters. The cast part derived from thismold can reverse the cavities of the mold as solid diameters having theshape, size and height defined by the mold. To further enhancefunctionality, cavity inserts can be added to the mold before the finalcasting is produced. In this case, the cavity insert can be a wireformed in the shape of a spring. The spring can have the physicaldimensions required to fit within a cavity opening of the mold, and canbe held in position with a secondary fixture scheme. The spring-shapedcavity insert can be removed from the cast part after the final castingprocess is completed. Thus, the cavity section of the mold can definethe solid shape of the casting while the cavity insert can form achannel through the solid body in the shape and width of the insert (thespring). The cavity can serve as, for example, a reservoir and/or afluid flow restrictor.

The examples given above demonstrate the basic principle of a cavityinsert. Additional design and fabrication advances can be realized byusing this method to create cavity inserts. For example,photo-chemical-machining can be used to create a mold that has largercavity openings, while reactive-ion-etching can be used to create finerfeatures on a cavity insert.

Fabricating the Laminated Mold

Certain exemplary embodiments can involve the fabrication of a laminatedmold which is used directly and/or as an intermediate mold in one ormore subsequent casting and/or molding processes.

FIG. 26 is a block diagram illustrating various devices formed during anexemplary method 26000 for fabricating a laminated mold havingmicro-machined layers that can be patterned and/or etched, and stackedto create a 3-dimensional mold. The laminated mold can be produced as anegative or positive replication of the desired finished casting. Forthe purpose of creating a laminated mold, any of three elements can beimplemented:

-   -   1) creating a lithographic mask 26010 defining the features of        each unique layer,    -   2) using lithographic micro-machining techniques and/or        micro-machining techniques to produce patterned layers 26020,        and/or    -   3) aligning, stacking, and/or laminating the patterned layers        into a stack 26030 in order to achieve the desired 3-dimensional        cavity shape, aspect ratios, and/or mold parameters desired for        a laminated mold 26040.

Lithographic Techniques

Using lithography as a basis for layer fabrication, parts and/orfeatures can be designed as diameters, squares, rectangles, hexagons,and/or any other shape and/or combination of shapes. The combinations ofany number of shapes can result in non-redundant design arrays (i.e.patterns in which not all shapes, sizes, and/or spacings are identical,as shown in FIG. 10). Lithographic features can represent solid orthrough aspects of the final part. Such feature designs can be usefulfor fabricating micro-structures, surfaces, and/or any other structurethat can employ a redundant and/or non-redundant design for certainmicro-structural aspects. Large area, dense arrays can be producedthrough the lithographic process, thereby enabling creation of deviceswith sub-features and/or the repeatable production of multiple devicesin a batch format. Note that such repeatable batch production can occurwithout substantial degradation of the mold.

Lithography can also allow the creation of very accurate featuretolerances since those features can be derived from a potentiallyhigh-resolution photographic mask. The tolerance accuracy can includeline-width resolution and/or positional accuracy of the plotted featuresover the desired area. In certain embodiments, such tolerance accuracycan enable micro-scale fabrication and/or accurate integration ofcreated micro-mechanical devices with microelectronics.

Photographic masks can assist with achieving high accuracy when chemicalor ion-etched, or deposition-processed layers are being used to form alaminated mold through stack lamination. Because dimensional changes canoccur during the final casting process in a mold, compensation factorscan be engineered at the photo-mask stage, which can be transferred intothe mold design and fabrication. These compensation factors can helpachieve needed accuracy and predictability throughout the molding andcasting process.

Photographic masks can have a wide range of potential feature sizes andpositional accuracies. For example, when using an IGI Maskwrite 800photoplotter, an active plotting area of 22.8×31.5 inches, minimumfeature size of 5 microns, and positional accuracy of +−1 micron withina 15×15 inch area is possible. Using higher resolution lithographicsystems for mask generation, such as those employed for electron beamlithography, feature sizes as small as 0.25 microns are achievable, withpositional tolerances similar to the Maskwrite plotter, within an areaof 6×6 inches.

Layer Machining and Material Options

Another aspect to fabricating the laminated mold can be the particulartechnique or techniques used to machine or mill-out the features orpatterns from the layer material. In certain embodiments, combininglithographic imaging and micro-machining techniques can improve thedesign and fabrication of high-aspect-ratio, 3-dimensional structures.Some of the micro machining techniques that can be used to fabricatelayers for a laminated mold include photo-etching, laser machining,reactive ion etching, electroplating, vapor deposition, bulkmicro-machining, surface micro-machining, and/or conventional machining.

In certain exemplary embodiments, a laminated mold need only embody themechanical features (e.g., size, shape, thickness, etc.) of the finalcasting. That is, it does not have to embody the specific functionalproperties (i.e. density, conductivity) that are desired to fulfill theapplication of the final casting. This means that any suitabletechniques or materials can be used to produce the layers of the mold.

Thus, there can be a wide variety of material and fabrication options,which can allow for a wide variety of engineered features of a layer,laminated mold, and/or derived mold. For instance, althoughphoto-chemical machining can be limited to metallic foils, by usinglaser machining or reactive ion etching, the choice of materials canbecome greatly expanded. With regard to laser machining, Resonetics,Inc. of Nashua, N.H. commercially provides laser machining services andsystems. For laser machining, a very wide range of materials can beprocessed using UV and infra-red laser sources. These materials includeceramics, metals, plastics, polymers, and/or inorganics. Lasermicro-machining processes also can extend the limits of chemicalmachining with regards to feature size and/or accuracy. With little orno restriction on feature geometry, sizes on the order of 2 microns canbe achievable using laser machining.

When a wide variety of materials are available for making the laminatedmold, process-compatibility issues can be resolved when choosing thematerial from which to create the mold. An example of this would be tomatch the thermal properties of casting materials with those of thelaminated mold, in instances where elevated temperatures are needed inthe casting or molding process. Also the de-molding properties of themold and/or casting material can be relevant to the survival of themold. This, for example, might lead one to laser-machine the layers froma material such as Teflon, instead of a metal. The laser machiningprocess could be compatible with the Teflon and the Teflon could havegreater de-molding capabilities than a metallic stack lamination.

In certain exemplary embodiments, only a single laminated stack isneeded to produce molds or castings. Also, in certain exemplaryembodiments, molds and/or castings can be produced without the need fora clean-room processing environment.

For certain exemplary embodiments, the ability to create a singlelaminated mold and then cast the final parts can allow for using muchthinner foils or advanced etching methods for producing the individuallayers. Since feature size can be limited by the thickness of each foil,using thinner foils can allow finer features to be etched.

Certain exemplary embodiments can combine various micro-machiningtechniques to create layers that have very specific functional featuresthat can be placed in predetermined locations along the Z-axis of themold assembly. For example, photo-chemical-machining can be used toprovide larger features and high resolution ion-etching for finerfeatures.

Various methods, as described above, can be used to produce layers for alaminated mold. The following examples are given to demonstratedimensional feature resolution, positional accuracy, and/or featureaccuracy of the layers.

Ion etching: when using a Commonwealth Scientific Millitron 8000 etchingsystem, for example, a uniform etch area of 18 inches by 18 inches isachievable. Feature widths from 0.5 microns and above are attainable,depending on the lithographic masks and imaging techniques used. Afeature, for example a 5 micron wide slot, etched to a depth of 10microns can be etched to a tolerance of +−1.25 microns in width, and+−0.1 microns in depth. The positional tolerance of features would bethe same as those produced on the lithographic masks.

Photo-chemical-machining: when using an Attotech XL 547 etching system,for example, a uniform etch area of 20 inches by 25 inches isachievable. Etched through-feature widths from 20 microns and above areattainable, with solid features widths of 15 microns and above alsobeing attainable. A feature, for example a 30 micron diameter etchedthrough 25 microns of copper, can be etched to a tolerance of +−2.5microns or 10% of the foil thickness. The positional tolerance of suchfeatures would be the same as those produced on the lithographic masks.

Laser micromachining: when using a PIVOTAL laser micromachining system,for example, a uniform machining area of 3 inches by 3 inches isachievable. Machined through-feature sizes from 5 microns and above areattainable. A feature, for example a 5 micron wide slit machined through25 microns of stainless steel, can be machined to a tolerance of +−1micron. Positional tolerance of +−3 microns is achievable over the 3inch by 3 inch area.

Electro-forming: depending on the size limitations of the photographicmasks used for this process, electro-forming over areas as large as 60inches by 60 inches is attainable. Electro-formed layers havingthickness of 2 microns to 100 microns is achievable. A feature, forexample a 5 micron wide slit, 15 microns deep, can be formed to atolerance of +−1 micron. Positional tolerance of features would be thesame as those produced on the lithographic masks.

Layer Assembly and Lamination

As described above, in certain exemplary embodiments, layers can bedesigned and produced so that feature shape and placement from layer tolayer define the desired geometry along the X-, Y-, and/or Z-axes of amold. The total number (and thickness) of layers in the assembly candefine the overall height and aspect ratio of the feature. A feature canbe either the solid shape or the space between given structuralcomponents.

What follows are several exemplary methods of bonding the layerstogether to form the laminated mold. One exemplary method used to bondlayers together is a metal-to-metal brazing technique. This techniquecan provide a durable mold that can survive high volume productioncasting and/or can provide efficient release properties from thecastings. Prior to assembly, the layers can have 0.00003 inches of aeutectic braze alloy deposited on the top and bottom surfaces of thelayers, using standard electro-plating techniques. An example of a brazematerial is CuSil™, which is comprised of copper and silver, with thepercentage of each being variable for specific applications. CuSil™ canbe designed specifically to lower the temperatures needed to flow thealloy during the brazing process.

One of the potential concerns during the laminating process is tomaintain accurate registration of the assembly layers, and/or controlthe movement of the layers and the bonding fixture when brought to theelevated temperatures needed to flow the braze material. Several methodscan be used to achieve this registration and/or control. The first caninvolve the practice of having two or more alignment features on thelayers. FIG. 27 is a perspective view of a plurality of exemplary layers27000. As illustrated in FIG. 27, one such alignment feature can be adiameter 27010, and the other alignment feature can be an elongated slot27020. The slot and the diameter can be positioned on each layer onehundred eighty degrees opposed, for example, and can be parallel inorientation with the grain and/or perpendicular to the plane of thelayer material.

FIG. 28 is a perspective view of an exemplary laminating fixture 28000,which can be fabricated from graphite, for example, and can have twographite diameter pins 28010 that can be fixed to the lamination fixtureat the same distance apart as the diameter 27010 and slot 27020 on theetched layers 27000. The layers can be placed over the pins 28010 sothat each layer is orientated accurately to the layer below, using theslot and diameter to align each layer. Alternatively, two or morediameters can be provided on the layers 27000, each of which correspondsto a pin of laminating fixture 28000.

During the brazing process, the layered assembly can be heated in ahydrogen atmosphere to a temperature of 825 degrees Celsius, which cancause the CuSil™ braze to flow. As the temperatures elevate, the layersand the fixture material can expand. The slotted alignment feature 27020can allow the fixture 28000 material to expand or move at a dissimilarrate than the layers, by the presence of the elongated slot on the layer27000. The slot 27020 can be greater in length than the diameter of pin28010 in the fixture. The additional length of the slot can bedetermined by the different coefficient for expansion between thegraphite and the assembly layers.

Other methods for maintaining the layer alignment during a heatedbonding process can include fabricating the bonding fixture from thesame material as the assembly layers, which can thus limit thedissimilar movement of the layers and fixture. The alignment and bondingfixture can also be made so that the alignment pins fit nearly perfectlyto alignment features on the layers, but the pins in the fixture areallowed to float while being held perpendicular to the face of thealignment fixture.

In order to minimize positional errors when bonding layers (stackingerrors), tolerances on certain features can be controlled. Referring toFIG. 27, the positional accuracy of features 27010 and 27020 can becontrolled by the photographic masks used to produce the layers(exemplary tolerances for masks are provided in the section titled“Lithographic Techniques”, above). The geometric size and tolerance offeatures 27010 and 27020 can be governed by the layer thickness and/ormicromachining method used to produce them (exemplary tolerances forvarious micromachining techniques are provided in the section titled“Layer Machining and Material Options”, above).

When producing a laminated mold, numerous factors can be an influence onthe overall tolerances of the features of the mold and/or the casting.For example, when using a stacking fixture, any of the laminatingfixture's surface flatness, the laminating fixture's perpendicularity,and the laminating fixture's parallelism can be an influence. Also, thedimensional tolerance of the alignment feature(s) of a layer and/or thepositional tolerance of that feature(s) can be an influence. Forexample, if an alignment pin, protrusion, or other “male” feature willengage a corresponding hole, indentation, or “female” feature to assistin aligning two or more layers, the dimensional tolerance and/orvocational tolerance of male and/or female feature can be an influenceon the overall tolerances.

For example, referring to FIG. 28, bonding fixture 28000 can includealignment pins 28010 fitted into the top surface of fixture 28000. In aparticular experiment, through the use of a surface grinding process,followed by a planetary lapping and polishing process, the sides and topsurface of bonding fixture 28000 were parallel and perpendicular to atolerance of +−2 microns, with the top surface finish being opticallyflat to +−one half the wavelength of visible light (400 to 700nanometers), or about 200 to 350 nanometers. The positional accuracy ofthe alignment pins and the machined diameters through fixture 28000 was+−5 microns, and the pins were perpendicular to the surface of thefixture to +−2 microns, measured at a pin height of 2 to 5 millimeters.The surface of the described fixture measured 6×6 inches, and wasproduced using an SIP 5000 Swiss jig boring milling center. Hardenedsteel alignment pins, having a diameter of 0.092 inches, were preciselyground to a tolerance of +−1.25 microns using a standard grindingoperation.

The process of laminating the layers can include placing the processedlayers over the alignment pins until the desired number of layers havebeen assembled. The assembled layers and fixture then can be placed in abrazing furnace with uniform weight applied to the top of the fixture.The furnace temperature can be raised to a temperature of 825 degreesCelsius, in a hydrogen atmosphere (a vacuum atmosphere has also beenshown to work) for 45 minutes. This temperature can be sufficient toallow the braze material to uniformly flow and connect the layerstogether at all contact points. The fixture then can be cooled in thehydrogen atmosphere for 2 hours and removed for disassembly. Thegraphite pins can be removed, freeing the bonded structure from thelamination fixture.

The brazed lamination now can be ready for the final process step, whichcan be to coat the entire assembly with a hard nickel surface. Thenickel coating can be applied to the laminated assembly usingelectro-plating techniques, which can deposits 0.0001 inches of nickel.The nickel-plated surface can act as an interface material that canenhance the release and durability properties of the assembled mold.

Another exemplary method that can be used to bond layers can make use ofa thermo-cured epoxy rather than metal-to-metal brazing. Prior toassembly, the layers can be coated with an epoxy, MAGNA-TACO model E645,diluted 22:1 with acetone. The thinned epoxy can be applied to the topand bottom surfaces of the layers using a standard atomizing spray gun.The layers can be spray coated in such a way that the coverage of theepoxy will bond the layers without filling the micro-machined features.A dot coverage of 50% has shown to work. The parameters for dilution andcoverage can be provided by the epoxy manufacture, such as the BeaconChemical Company.

The layers then can be assembled to a bonding fixture using, forexample, the same technique described in the braze process. Theassembled fixture then can be placed in a heated platen press, such as aCarver model #4122. The assembled layers and fixture can be compressedto 40 pounds per square inch and held at a temperature of 350 degrees F.for 3 hours, and allowed to cool to room temperature under constantpressure. The assembly then can be removed from the fixture using, forexample, the same technique used for the brazed assembly.

In certain embodiments, the technique described in the second examplecan be considerably less expensive and time consuming than that used forthe first. Using the epoxy process, savings can be realized due to thecost of the plating and the additional requirement imposed by thehydrogen braze process compared to epoxy stack laminating. The masterderived from the first example can provide more efficient de-moldingproperties and also can survive a greater number of castings than theepoxy bonded mold. The epoxy-bonded mold can demonstrate a costeffective alternative to brazing and can be used for prototyping or whensmaller production quantities are required.

Casting and Molding Process

Exemplary embodiments can involve the creation of a high-resolutioncasting mold, having high-aspect-ratio, as well as 3-dimensionalfeatures and shapes. A precision stack lamination, comprised ofmicro-machined layers, can be used as a laminated mold. The laminatedmold can be used to produce advanced micro-devices and structures(a.k.a., “micro-electro-mechanical structures” and “MEMS”) and/or can beused to create second (or greater) generation derived molds.

The following paragraphs describe the casting process in terms of thematerials, fixtures, and/or methods that can be used to producesecond-generation molds and final castings.

Mold Duplication and Replication

For certain exemplary embodiments, the process options for producingmolds and cast parts can be numerable. For example, molds can be made asnegative 4010 or positive 4020 replications of the desired cast part asshown in FIG. 4. If the mold is made as a positive, a second-generationmold can be created. If the mold is made as a negative, the final partcan be cast directly from the mold.

For certain exemplary embodiments, the process used to create the layersfor the laminated mold can be a determining factor. For example, someproduction situations can require a second- (or even third) generationderived version of the laminated mold.

In certain situations, process parameters can be greatly enhanced bycombining molding and casting materials having certain predeterminedvalues for physical properties such as durometer, elasticity, etc. Forexample, if the cast part is extremely rigid, with poor releaseproperties, a second-generation consumable mold can be used to createthe final casting. Further specific examples of this practice, and howthey relate to 3-dimensional micro-fabrication are described later inthis document.

Feature size and positional accuracy for molds and produced parts can becompensated for at the layer production stage of the process. Forexample, known material properties such as thermal expansion orshrinkage can be accurately accounted for due to, for example, theaccuracy levels of the photographic masks and/or laser machining used toproduce mold layers. Feature resolution, using various mold making andcasting materials, can be accurately replicated for features having asize of 1 micron and greater. Surface finishes have also been reproducedand accurately replicated. For example, layers have been used to form alaminated mold which was used to produce a derived silicone RTV mold.The surface finish of a 0.0015 inch thick stainless steel layer(specified finish as 8-10 micro inches RA max) and a 0.002 inch thickcopper layer (specified finish as 8-20 micro inches RA max) were easilyidentified on the molded surfaces of the derived RTV mold. The surfaceswere observed at 400× magnification using a Nikon MM11 measuring scope.The same surface finishes were also easily identified when cast partswere produced from the derived mold using a casting alloy CERROBASE™.Very smooth surface finishes, such as those found on glass, have alsobeen reproduced in molds and castings.

Materials for Molds and Castings

For certain exemplary embodiments, there can be hundreds, if notthousands of material options for mold making and casting. Describedbelow are some potential considerations regarding the selection of moldand casting materials that can meet the requirements of, for instance,3-dimensional MEMS.

To insure the accuracy and repeatability of certain cast micro-devices,the casting material can have the capability to resolve the fine3-dimensional feature geometries of the laminated mold. Typicaldimensions of MEMS can range from microns to millimeters. Otherstructures having micro features can have much larger dimensions.

For certain embodiments, the mold's cavity geometry can influence therelease properties between the mold and the casting, thereby potentiallyimplicating the flexibility (and/or measured durometer) of the materialsused. Other material compatibility issues also can be considered whenusing a casting process.

Certain exemplary embodiments of a process have been developed in orderto enable the production of 3-dimensional micro-structures from a widerange of materials, tailored to specific applications. The ability touse various materials for molds and castings can greatly expand theproduct possibilities using this technique.

One material that has been successfully used for creating castings froma laminated mold is an elastomeric product, referred to generally as RTVsilicone rubber, although other materials could also be successfuldepending on process or product requirements. A wide range ofsilicone-based materials designed for various casting applications arecommercially available through the Dow Corning Corporation of Midland,Mich. For example, the Silastic® brand products have proven successful,possibly because of their resolution capability, releasecharacteristics, flexibility, durability, and/or the fact that they workin a wide range of process temperatures.

Although other types of silicone rubber products could be used, each ofthe Dow Corning Silastic® brand products that have been used consists oftwo components; a liquid silicone rubber and a catalyst or curing agent.Of the Dow Corning Silastic® brand products, there are two basic curingtypes: condensation, and addition cure. The two types can allow for arange of variations in material viscosities and cure times. The threeprimary products used in the earliest tests are Silastic® J RTV SiliconeRubber, Silastic® M RTV Silicone Rubber, and Silastic® S RTV SiliconeRubber. Product specifications are provided in several of the examplesat the end of this document.

The Dow Corning Silastic® products used thus far have similarspecifications regarding shrinkage, which increases from nil up to 0.3percent if the silicone casting is vulcanized. Vulcanization can beaccomplished by heating the silicone to a specific elevated temperature(above the casting temperature) for a period of 2 hours. Vulcanizing canbe particularly useful when the casting is to be used as a regeneratedmold, and will be subjected to multiple castings.

In addition to RTV silicone rubber, urethanes and other materials alsohave properties that can be desirable for laminated molds, derivedmolds, and/or castings, depending on the specific requirement. Forexample, when producing certain 3-dimensional micro-structures withextreme aspect ratios, very fine features, or extreme under-cuts,de-molding can be difficult. In certain situations, the rigidity of themold also can be relevant, especially in certain cases where moldfeatures have high-aspect ratios. For example, the practice ofsacrificing or dissolving laminated second or third generation molds canbe used when castings require very rigid molds, and/or where thede-molding of castings becomes impossible.

There are several families of materials that can be used for producinglaminated molds, derived molds, and/or final cast devices including, forexample:

-   -   Acrylics: such as, for example, PMMA acrylic powder, resins,        and/or composites, as well as methacrylates such as butyl,        lauryl, stearyl, isobutyl, hydroxethyl, hydroxpropyl, glycidyl        and/or ethyl, etc.    -   Plastic polymerics: such as, for example, ABS, acetyl, acrylic,        alkyd, fluorothermoplastic, liquid crystal polymer, styrene        acrylonitrile, polybutylene terephthalate, thermoplastic        elastomer, polyketone, polypropylene, polyethylene, polystyrene,        PVC, polyester, polyurethane, thermoplastic rubber, and/or        polyamide, etc.    -   Thermo-set plastics: such as, for example, phenolic, vinyl        ester, urea, and/or amelamine, etc.    -   Rubber: such as, for example, elastomer, natural rubber, nitrile        rubber, silicone rubber, acrylic rubber, neoprene, butyl rubber,        fluorosilicone, TFE, SBR, and/or styrene butadiene, etc.    -   Ceramics: such as, for example, silicon carbide, alumina,        silicon carbide, zirconium oxide, and/or fused silica, calcium        sulfate, luminescent optical ceramics, bio-ceramics, and/or        plaster, etc.    -   Alloys: such as, for example, aluminum, copper, bronze, brass,        cadmium, chromium, gold, iron, lead, palladium, silver,        sterling, stainless, zinc platinum, titanium, magnesium,        anatomy, bismuth, nickel, and/or tin, etc.    -   Wax: such as, for example, injection wax, and/or plastic        injection wax, etc.

There can be many material options within these groups that can beutilized when employing certain embodiments. For example, in certainembodiments, metals and metal alloys can be primarily used as structuralmaterials of final devices, but also can add to function. Exemplaryfunctional properties of metals and/or alloys can include conductivity,magnetism, and/or shape memory.

Polymers also can be used as structural and/or functional materials formicro-devices. Exemplary functional properties can include elasticity,optical, bio-compatibility, and/or chemical resistivity, to name a few.Materials having dual (or more) functionality, often referred to asengineered “smart” materials, could be incorporated into a final moldedproduct or a mold. Additional functionality could utilize electrostatic,mechanical, thermal, fluidic, acoustic, magnetic, dynamic, and/orpiezo-electric properties. Ceramics materials also can be used forapplications where specialty requirements may be needed, such as certainhigh-temperature environments. Depending on the material that is chosen,there can be many alternative methods to solidify the casting material.The term “solidify” includes, but is not limited to, methods such ascuring, vulcanizing, heat-treating, and/or chemically treating, etc.

Mold Fixtures, Planar and Contoured

For certain exemplary embodiments, there can be a wide range ofengineering options available when designing a casting mold. The castingprocess and geometry of the final product can determine certain detailsand features of the mold. Options can be available for filling and/orventing a mold, and/or for releasing the casting from the mold.

Two basic approaches have been used for demonstrating the certainexemplary methods for mold design and fabrication. These approaches canbe categorized as using a single-piece open-face mold or a two-partclosed mold.

In certain exemplary embodiments, each of the mold types can includeinserting, aligning, and assembling the laminated mold (or duplicatecopy) in a fixture. The fixture can serve several purposes, includingbounding and/or defining the area in which to pour the casting material,capturing the casting material during the curing process, allowing theescape of air and/or off-gases while the casting material is degassed,and/or enabling mechanical integration with the casting apparatus.

The fixture can be configured in such a way that all sides surroundingthe mold insert are equal and common, in order to, for example, equalizeand limit the effects of thermal or mechanical stresses put on the moldduring the casting process. The mold fixture also can accommodate thede-molding of the casting.

Certain exemplary embodiments of this method can provide the ability tomold 3-dimensional structures and surfaces on contoured surfaces. Thebasic technique is described earlier in this document in the designparameter section. One element of the technique can be a flexible moldinsert that can be fixed to a contoured surface as shown in FIGS. 19 and22. The mold insert can be made with a membrane or backing thicknessthat can allow for integration with various fixture schemes that candefine the contoured shape.

For non-planar molds, the contour of the mold fixture can be produced bystandard machining methods such as milling, grinding, and/or CNCmachining, etc. The flexible mold insert can be attached to the surfaceof the mold using any of several methods. One such method is to epoxybond the flexible insert to the fixture using an epoxy that can beapplied with a uniform thickness, which can be thin enough toaccommodate the mold design. Other parameters that can be consideredwhen choosing the material to fix a membrane to a fixture includedurability, material compatibility, and/or temperature compatibility,etc. A detailed description of a non-planar mold is given as an examplefurther on.

Casting and Molding Processes

Various techniques can be used for injecting or filling cavity moldswith casting materials, including injection molding, centrifugalcasting, and/or vibration filling. An objective in any of thesetechniques can be to fill the cavity with the casting material in such away that all of the air is forced out of the mold before the castmaterial has solidified. The method used for filling the cavity mold candepend on the geometry of the casting, the casting material, and/or therelease properties of the mold and/or the cast part.

As has been described earlier, an open face mold, using flexible RTVrubber has been found to work effectively. In certain embodiments, anopen face mold can eliminate the need for having carefully designedentrance sprue and venting ports. The open face mold can be configuredto create an intermediate structure that can have a controlled backingthickness which can serve any of several purposes: 1) it can be an opencavity section in the casting mold which can serve as an entrance pointin which to fill the mold; 2) it can serve as a degassing port for theair evacuation during the vacuum casting process; 3) it can create abacking to which the cast part or parts can be attached and/or which canbe grasped to assist in de-molding the casting from the flexible mold.

In casting processes in which the casting material is heated, the moldtemperature and the cooling of the casting can be carefully controlled.For example, when casting a lead casting alloy such as CERROBASE, thealloy can be held at a temperature of 285 degrees F., while the moldmaterial can be preheated 25-30 degrees higher (310-315 degrees F.). Themolten alloy can be poured and held at or above the melting point untilit is placed in the vacuum environment. The mold then can be placed in avacuum bell jar, and held in an atmosphere of 28 inches of mercury for3-4 minutes. This can remove any air pockets from the molten metalbefore the alloy begins to solidify. As soon as the air has beenevacuated, the mold can be immediately quenched or submersed in coldwater to rapidly cool the molten metal. This can help minimize shrinkageof the cast metal.

In certain exemplary embodiments, no vent holes or slots are provided inthe mold, and instead, air can be evacuated from the mold prior toinjection. In certain exemplary embodiments, temperature variation andits effect on the micro-structure can be addressed via enhanced heatingand cooling controls in or around the mold. In certain exemplaryembodiments, heat can be eliminated from the curing process by replacingthe molding materials with photo-curing materials.

Some of the methods that can be used for micro-molding and castinginclude micro-injection molding, powder injection molding, metalinjection molding, photo molding, hot embossing, micro-transfer molding,jet molding, pressure casting, vacuum casting, and/or spin casting, etc.Any of these methods can make use of a laminated or derived moldproduced using this method.

De-Molding and Finish Machining

A controlled backing thickness can be incorporated into the casting tocreate an intermediate structure. One purpose of the intermediate can beto create a rigid substrate or backing, that allows the casting to begrasped for removal from the mold without distorting the casting. Thethickness of the backing can be inversely related to the geometry of thepattern or features being cast. For example, fine grid patterns canrequire a thicker backing while coarse patterns can have a thinnerbacking The backing can be designed to have a shape and thickness thatcan be used to efficiently grasp and/or pull the cast part from themold.

Following de-molding, the intermediate can be machined to remove thebacking from the casting. Because the thickness of the backing can beclosely controlled, the backing can be removed from the cast structureby using various precision machining processes. These processes caninclude wire and electrode EDM (electrode discharge machining), surfacegrinding, lapping, and/or fly cutting etc.

In instances where extremely fine, fragile patterns have been cast, adissolvable filler or potting material can be poured and cured in thecast structure prior to the removal of the backing from the grid. Thefiller can be used to stabilize the casting features and eliminatepossible damage caused by the machining process. The filler can beremoved after machining-off the backing A machinable wax has been foundto be effective for filling, machining, and dissolving from the casting.

In some part designs, de-molding the casting from the mold might not bepossible, due to extreme draft angles or extremely fine features. Inthese cases, the mold can remain intact with the cast part or can besacrificed by dissolving the mold from casting.

EXAMPLES

A wide range of three-dimensional micro-devices can be fabricatedthrough the use of one or more embodiments of various fabricationprocesses, as demonstrated in some of the following examples.

Example 1 Sub-Millimeter Feedhorn Array

This example demonstrates fabrication of an array of complex3-dimensional cavity features having high aspect ratio. This examplemakes use of a second-generation derived mold for producing the finalpart, which is an array of sub-millimeter feedhorns. A feedhorn is atype of antenna that can be used to transmit or receive electromagneticsignals in the microwave and millimeter-wave portion of the spectrum. Athigher frequencies (shorter wavelengths) the dimensions can become verysmall (millimeters and sub-millimeter) and fabrication can becomedifficult.

Using certain exemplary embodiments, a single horn, an array of hundredsor thousands of identical horns, and/or an array of hundreds orthousands of different horns can be fabricated.

FIG. 29 is a top view of stack lamination mold 29000 that defines anarray of cavities 29010 for fabricating feedhorns. FIG. 30 is across-section of a cavity 29010 taken along section lines 30-30 of FIG.29. As shown, cavity 29010 is corrugated, having alternating cavityslots 30010 separated by mold ridges 30020 of decreasing dimensions,that can be held to close tolerances.

In an exemplary embodiment, an array of feedhorns contains one thousandtwenty identical corrugated feedhorns, each designed to operate at 500GHz, and the overall dimensions of the feed horn array are 98millimeters wide by 91 millimeters high by 7.6 millimeters deep. Thefabrication of this exemplary array can begin with the creation of alaminated mold, comprised of micro-machined layers, and assembled into aprecision stack lamination.

Step 1: Creating the laminated mold: The laminated mold in this examplewas made of 100 layers of 0.003″ thick beryllium copper (BeCu) sheetsthat were chemically etched and then laminated together using an epoxybonding process. Infinite Graphics, Inc. of Minneapolis, Minn. wascontracted to produce the photo-masks needed for etching the layers. Themasks were configured with one thousand twenty diameters having acenter-to-center spacing of 2.5 millimeters. An IGI Lazerwrite photoplotter was used to create the masks, which were plotted on silverhalite emulsion film. The plotter resolution accuracy was certified to0.5 micrometers and pattern positional accuracy of plus or minus 0.40micrometers per lineal inch. The layers were designed so that horndiameters were different from layer to layer, so that when the layerswere assembled, the layers achieved the desired cross-section taper,slot, and ridge features shown in simplified form in FIG. 30. A total of100 layers were used to create a stacked assembly 7.6 millimeters thick.The layers were processed by Tech Etch, Inc. of Plymouth, Mass., usingstandard photo-etching techniques and were etched in such a way that thecross-sectional shape of the etched walls for each layer areperpendicular to the top and bottom surfaces of the layer (commonlyreferred to as straight sidewalls).

In this example, the method chosen to bond the etched layers togetherused a thermo-cured epoxy (MAGNA-TAC model E645), using the process andfixturing described earlier in the section on layer assembly andlamination. The assembled fixture was then placed in a 12 inch×12 inchheated platen press, Carver model No. 4122. The fixture was compressedto 40 pounds per square inch and held at a temperature of 350 degrees F.for 3 hours, then allowed to cool to room temperature under constantpressure. The assembly was then removed from the fixture and thealignment pins removed, leaving the bonded stack lamination. Thelaminated mold (stack lamination) was then used to produce the finalcasting mold.

Step 2: Creating the casting mold: The second step of the process wasthe assembly of the final casting mold, which used the precision stacklamination made during step 1 as a laminated mold. The casting moldcreated was a negative version of the lamination, as shown inperspective view for a single feed horn 31000 in FIG. 31. Also shown isa feedhorn ridge 31010 that can correspond to a cavity slot 30010, and afeedhorn base 31020.

For this example, Silastic® J RTV Silicone Rubber was used to make thefinal casting mold. This product was chosen because it is flexibleenough to allow easy release from the laminated mold without damagingthe undercut slots and rings inside the feedhorns, and because of itshigh-resolution capability. Described below are the productspecifications.

Silastic® J:

Durometer Hardness: 56 Shore A points

Tensile Strength, psi: 900 Linear Coefficient of Thermal Expansion:6.2×10⁻⁴

Cure Time at 25 C: 24 hours

The Silastic® J Silicone RTV was prepared in accordance with themanufacturer's recommendations. This included mixing the silicone andthe curing agent and evacuating air (degassing) from the material priorto filling the mold-making fixture. At the time the example wasprepared, the most effective way of degassing the Silicone prior tofilling the mold fixture was to mix the two parts of the Silicone andplace them in a bell jar and evacuate the air using a dual stage vacuumpump. The material was pumped down to an atmosphere of 28 inches ofmercury and held for 5 minutes beyond the break point of the material.The Silicone was then ready to pour into the mold fixture.

As shown in the side view of FIG. 32, an open-face fixture 32000 wasprepared, the fixture having a precision-machined aluminum ring 32010,precision ground glass plate 32030, rubber gaskets 32040, 32050 and thelaminated mold 32060. The base 32020 of the fixture was thick Plexiglas.On top of the Plexiglas base was a glass substrate 32030. Rubber gasket32040 separated the glass base and the glass substrate. An additionalrubber gasket 32050 was placed on the top surface of the glass substrate32030 and the laminated mold 32060 was placed on the top gasket. Therubber gaskets were used to prevent unwanted flashing of material duringcasting. A precision-machined aluminum ring 32010 was placed over thelaminated mold subassembly and interfaced with the lower rubber gasket32040.

Generally, the height of the ring and dimensions of the above pieces candepend upon the dimensions of the specific structure to be cast. Thering portion 32010 of the fixture assembly served several purposes,including bounding and defining the area in which to pour mold material,capturing the material during the curing process, and providing an airescape while the mold material was degassed using vacuum. The fixturewas configured in a way that all sides surrounding the laminated mold32060 were equal and common, in order to equalize and limit the effectsof thermal or mechanical stresses put on the lamination from the moldmaterial.

An open-face mold was used for this example. The mold insert and moldingfixture were assembled and filled with the silicone RTV, then the airwas evacuated again using a bell jar and vacuum pump in an atmosphere of28 inches of mercury. After allowing sufficient time for the air to beremoved from the silicone, the mold was then heat-cured by placing it ina furnace heated to and held at a constant temperature of 70 degrees F.for 16 hours prior to separating the laminated mold from the derived RTVmold. The molding fixture was then prepared for disassembly, taking careto remove the laminated mold from the RTV mold without damaging thelamination, since the lamination can be used multiple times to createadditional RTV molds.

The resulting RTV mold was a negative version of the entire feedhornarray consisting of an array of one thousand twenty negative feedhorns,similar to the simplified single horn 31010 shown in perspective view inFIG. 31.

Step 3: Casting the feedhorn array: In this example, the cast feedhornarrays were made of a silver loaded epoxy, which is electricallyconductive. In certain exemplary embodiments, binders and/or metallic(or other) powders can be combined and/or engineered to satisfy specificapplication and/or process specifications. The conductive epoxy chosenfor this example provided the electrical conductivity needed tointegrate the feedhorn array with an electronic infrared detector array.

The conductive epoxy was purchased from the company BONDLINE™ of SanJose, Calif., which designs and manufactures engineered epoxies usingpowdered metals. Certain of its composite metal epoxies can be cured atroom temperature, have high shear strength, low coefficient of thermalexpansion, and viscosities suited for high-resolution casting.

Exemplary embodiments can utilize various techniques for injecting orfilling cavity molds with casting materials. In this example, a pressurecasting method was used.

The BONDLINE™ epoxy was supplied fully mixed and loaded with the silvermetallic powder, in a semi-frozen state. The loaded epoxy was firstnormalized to room temperature and then pre-heated per themanufacturer's specification. In the pre-heated state the epoxy wasuncured and ready to be cast. The uncured epoxy was then poured into theopen-face mold to fill the entire mold cavity. The mold was then placedin a pressurized vessel with an applied pressure of 50 psi using drynitrogen, and held for one hour, which provided sufficient time for theepoxy to cure. The mold was then removed from the pressure vessel andplaced in an oven for 6 hours at 225 degrees F., which fully cured theconductive epoxy.

Step 4. Demolding and finish machining: After the cast epoxy had beencured, it was ready for disassembly and demolding from the castingfixture and mold. The mold material (RTV silicone) was chosen to beflexible enough to allow the cast feedhorn array to be removed from thecasting mold without damaging the undercuts formed by the slots andridges. When done carefully, the mold could be reused several times tomake additional feedhorn arrays.

The backing thickness 31020 of the RTV mold shown in FIG. 31 came intoplay during the de-molding process. The backing was cast thick enough toallow easy grasping to assist with separating the casting mold from thecast piece. In this example, the RTV casting mold was flexible andallowed easy separation without damaging the undercut slots and ringsinside the cast feedhorns.

Depending on the piece being cast, machining, coating, and/or otherfinish work can be desirable after de-molding. In this example, a finalgrinding operation was used on the top surface (pour side of the mold)of the feedhorn array because an open face mold was used. This finalgrinding operation could have been eliminated by using a closed,two-part mold.

Example 2 Individual Feedhorns Produced in a Batch Process

This example makes use of certain exemplary embodiments to demonstratethe production of sub-millimeter feedhorns in a batch process. Theexample uses the same part design and fabrication process described inexample 1, with several modifications detailed below.

Process Modifications: The process detailed in example 1 was used toproduce an array of one thousand twenty feedhorns. The firstmodification to the process was the casting material used to produce thearray. The casting material for this example was a two-part castingpolymer sold through the Synair Corporation of Chattanooga, Tenn.Product model “Mark 15 Por-A-Kast” was used to cast the feedhorn arrayand was mixed and prepared per the manufacturer's specifications. Thepolymer was also cast using the pressure filling method described inexample 1.

The next modification was a surface treatment applied to the castpolymer array. A conductive gold surface was deposited onto the polymerarray in order to integrate the feedhorns with the detector electronics.The gold surface was applied in two stages. The first stage was theapplication of 0.5 microns of conduction gold, which was sputter-coatedusing standard vacuum deposition techniques. The first gold surface wasused for a conductive surface to allow a second stage electro-depositionor plating of gold to be applied. The second gold plating was appliedwith a thickness of 2 microns using pure conductive gold.

The final modification was to dice or cut the feedhorns from the castand plated array into individual feedhorns, that were then suitable fordetector integration. A standard dicing saw, used for wafer cutting, wasused to cut the feedhorns from the cast array.

Example 3 Array of 3-Dimensional Micro-Structures

Process steps 1 and 2 described in example 1 were used to produce alarge area array of micro-structures, which are described as negativesof the feedhorn cavities, shown as a single feedhorn in FIG. 31. Thelaminated mold and molding fixture was used to cast the micro-structuresusing Dow Corning's Silastic® M RTV Silicone Rubber. This product waschosen because it is flexible enough to release from the mold insert,without damaging the circular steps in the structure, but has thehardness needed to maintain the microstructures in a standing positionafter being released from the mold. Described below are the productspecifications.

Silastic® M

Durometer Hardness: 59 Shore A points

Tensile Strength, psi: 650

Linear Coefficient of Thermal Expansion: 6.2×10⁻⁴

Cure Time at 25 C: 16 hours

The Silicone RTV was prepared in accordance with the manufacturer'srecommendations, using the process described earlier in example 1, step2. The laminated mold and molding fixture were assembled and filled withthe silicone RTV, using the process described earlier in example 1, step2. The molding fixture was then prepared for disassembly, taking care toseparate the mold insert from the cast silicone array. The resultingcasting was an array consisting of one thousand twenty 3-dimensionalmicro-structures. The shape and dimension of a single structure is shownin simplified form in FIG. 31.

Example # 4 Cylindrical Tubing with Micro-Fluidic Channels on the InsideDiameter

Certain exemplary embodiments have been used to produce a 2.5 centimeterlength of clear urethane tubing, having 3-dimensional micro-fluidchannels on the inside diameter of the tubing. The fluidic tubing wasproduced using a flexible cavity insert with a controlled backingthickness. The following example demonstrates how the cavity insert canenable the production of three-dimensional features on the inside andoutside diameters of cylindrical tubing.

Step 1: Creating the mold insert: The first step in the process was tofabricate the micro-machined layers used to produce the cavity insert.The cast tubing was 2.5 centimeters long, having a 3.0 millimeteroutside diameter and a 2.0 millimeter inside diameter, with 50three-dimensional micro-fluidic channels, equally spaced around theinterior diameter of the tube. FIG. 33 shows a side view of the tubing33000, the wall of which defines numerous fluidic channels 33010.Although each fluidic channel could have different dimensions, in thisexample each channel was 0.075 mm in diameter at the entrance of thechannel from the tube, and each channel extended 0.075 mm deep. Eachchannel tapered to a diameter of 0.050 mm, the taper beginning 0.025 mmfrom the bottom of each channel.

Photo-chemical machining was used to fabricate the layers for thelaminated mold. FIG. 34 is a top view of a such a laminated mold 34000,which was created using several photo masks, one of which with a similartop view. Mold 34000 includes an array of fluidic channels 34010 In thisparticular experiment, the length of channels 34010 was approximately 25millimeters, and the width of each collection of channels wasapproximately 6.6 millimeters.

FIG. 35 is a cross-section of mold 34000 taken at section lines 35-35 ofFIG. 34. To the cross-sectional shape of channel 34010, a first copperfoil 35010 having a thickness of 0.025 mm, and a second copper foil35020 having a thickness of 0.050 mm, were chemically etched and thenlaminated together using a metal-to-metal brazing process. Each of thelayers used in the laminated mold assembly used a separate photo-mask.The masks used for layer 35020 were configured with a 9.50×0.075 mmrectangular open slot, arrayed redundantly in 50 places, a portion ofwhich are illustrated in FIG. 34. To achieve the desired taper, twomasks were used for layer 35010. The bottom mask was configured with a9.50×0.075 mm rectangular open slot and the top mask was configured witha 9.50×0.050 rectangular open slot, each of the slots were alsoredundantly arrayed in 50 places. The photo-masks were produced to thesame specifications, by the same vendor as those described in example 1,step 1.

The layers were designed so that the slot placement was identical fromlayer to layer, which when assembled, produced the cross-sectional shapefor the channels as shown in FIG. 35. The final thickness of thelamination was specified at 0.083 millimeters, which required one 0.025layer of copper foil, and one 0.050 thick layer of copper foil, leavinga total thickness amount of 0.002 millimeters for braze material on eachside of each etched layer. The layers were photo-etched by the samevendor, and same sidewall condition as those described in example 1,step 1. The method chosen to bond the grid layers together was ametal-to-metal brazing technique described earlier, in detail as one oftwo exemplary methods of bonding layers together (eutectic braze alloy)

Step 2: Creating the flexible cavity insert: The next step of theprocess was to create a flexible cavity insert from the brazed layeredassembly. FIG. 36 is a side view of cavity insert 36000, which wasproduced from the brazed assembly with a backing 36010 having athickness of 0.050 millimeters. The cavity insert 36000 was producedusing Silastic® S RTV Silicone Rubber as the base material. The RTVSilicone Rubber was used because of its resolution capability, releaseproperties, dimensional repeatability, and its flexibility to form theinsert to a round pin that would be assembled to the final moldingfixture. The material properties of Silastic® S are shown below.

Silastic® S

Durometer Hardness: 26 Shore A points

Tensile Strength, psi: 1000 Linear Coefficient of Thermal Expansion:6.2×10⁻⁴

Cure Time at 25 C: 24 hours

The casting fixture used to create the RTV cavity insert was similar tothat shown in FIG. 32 and is described in detail in the prior examples.A modification was made to the fixture assembly, which was a top thatwas placed over the pour area of the mold fixture. This top was placedand located to close the mold after air evacuation and reduce thebacking thickness 36010 of the RTV insert to a thickness of 0.050millimeters, shown in FIG. 36. The Silastic® S RTV Silicone Rubber usedfor the cavity insert fabrication was prepared in accordance with themanufacturers recommendations, using the process described earlier inexample 1, step 2.

Step 3: Assembling the molding fixture: The final molding fixture wasthen ready to be assembled. The molding fixture included a base plate(FIG. 37), the cavity inserts (FIG. 38), and a top plate (FIG. 40). FIG.37 is a top view of the base plate 37000, which was made from a 0.25inch aluminum plate that was ground flat and machined using standard CNCmachining techniques. The base had six machined diameters 37010 throughthe plate. These six diameters would accept the cavity insert pinsdescribed later. The plate also had machined diameters through theplate, which would accept dowel pins 37020 that were used to align andassemble the top plate and the base plate, as well as 4 bolt diameters37030 to hold the top and bottom plates together.

FIG. 38 is a side view of an insert fixture 38000, that includes theflexible cavity insert 36000 attached to a 3 centimeter long, 1.900millimeter diameter steel pin 38010. The pin 38010 was ground to thedesired dimensions using standard machine grinding techniques. The RTVcavity insert 36000 was cut to the proper size before being attached tothe pin. The RTV insert 36000 was attached to outside diameter of thepin 38010 using a controlled layer of two-part epoxy.

FIG. 39 is a side view of several insert fixtures 39000 that have beenattached to a base plate 37000. Each insert 36000 was attached itscorresponding pin 38010 so that the end of pin 38010 could be assembledto a corresponding machined diameter 37010 of base plate 37000 withoutinterference from insert 36000. Once each insert 36000 was attachedaround the diameter of its corresponding pin 38010 and the pin placed inthe corresponding through-diameter of base plate 37010, the pin was heldperpendicular to base plate 37000 and in alignment with a top plate ofthe fixture.

FIG. 40 is a top view of a top plate 40000 of the fixture, which wasalso fabricated of aluminum and machined using CNC techniques. Therewere six 3.0 millimeter diameters 40010 milled through the thickness ofplate 40000, which was 3.0 centimeters thick. Diameters 40010 definedthe cavity areas of the mold that would be filled during the finalcasting process, and aligned to the pins assembled to the base plate.Also incorporated into the top plate were bolt features 40020 and dowelfeatures 40030 needed to align and assemble the top plate 40000 to thebase plate 37000. The thickness of top plate 40000 was specified toslightly exceed the desired length of the final cast tubing, which wascut to its final length after casting. The casting fixture was thenassembled, first by assembling the cavity insert 38000 to the base plate37000, followed by assembling the top plate 40000 to the base usingbolts and dowels. The top view of a representative cavity section for anassembled fixture is shown in FIG. 19.

Step 4: Casting the fluidic tubes: Several fluidic tubes were producedusing the assembled casting fixture. A clear urethane was used for thefinal casting because of its high-resolution, low shrink factor, andtransparent properties, which allowed for final inspection of theinterior diameter features through the clear wall of the tube. Thecasting material was purchased from the Alumilite Corporation ofKalamazoo, Mich., under the product name Water Clear urethane castingsystem. The manufacturer described the cured properties as follows:

Hardness, Shore D: 82

Density (gm/cc) 1.04 Shrinkage (in/in/) maximum 0.005 Cure Time (150degrees F.) 16 hr

The urethane was prepared in accordance with the manufacturer'srecommendations. This included the mixing and evacuation of air(degassing) from the material prior to filling the mold. The mosteffective way found for degassing the urethane prior to filling the moldfixture was to mix parts A and B, place them in a bell jar, and evacuatethe air using a dual stage vacuum pump. The mixture was pumped down toan atmosphere of 28 inches of mercury and held for 15 minutes beyond thebreak point of the material The urethane was then ready to pour into themold fixture.

The assembled mold fixture was heated to 125 degrees F. prior to fillingthe cavities with the urethane. The pre-heating of the mold helped theurethane to flow and fill the cavities of the mold, and aided in thedegassing process. The cavity sections of the mold were then filled withthe urethane, and the air was evacuated again using a bell jar andvacuum pump in an atmosphere of 28 inches of mercury. After allowingsufficient time for the air to be removed from the urethane, the moldwas then removed from the vacuum bell jar and placed in an oven. Themold was heated and held at a constant temperature of 150-180 degrees F.for 16 hours prior to separating the cast tubes from the mold. Themolding fixture was then disassembled and the cast tubes were separatedfrom the cavity inserts. The inserts were first removed from the baseplate of the fixture. The tubes were easily separated from the cavityinsert assembly due to the flexibility and release properties of thesilicone RTV, combined with the hardness of the urethane tubes.

Example # 5 Tubing with Micro-Fluidic Channels on the Outside Diameter

Example # 4 described the method used for producing cast urethane tubingwith micro-fluidic features on the inside diameter of the tube. Thecurrent example demonstrates how that process can be altered to producetubing with the micro-fluidic channels on the outside diameter of thetubing. This example uses a similar part design and the fabricationprocess described in example 4, with several modifications detailedbelow.

One process modification involved step 3, assembling the moldingfixture. For this step, a modification was made to the fixture designthat enabled the molded features to be similar to that shown in FIGS.20-22. The first modification was in the size of the machined diametersin the base plate and the top plate of the fixture described in example4. The flexible RTV cavity insert that was attached to a pin in example4 was instead attached to the inside diameters of the top fixture plate,similar to that shown in FIG. 22. In order to accommodate the existingRTV cavity insert, the cavity diameters of the top plate were milled toa size of 1.900 millimeters. The RTV cavity insert was then attached tothe milled diameter of the top plate using the same epoxy techniquedescribed in example 4. The base plate of the fixture was also modifiedto accept a 1.0 millimeter diameter pin, and was assembled similar tothe that shown in FIG. 22. The same casting process was used asdescribed in example 4. After following the final casting process, withthe altered molding fixture, the urethane tubes were produced having thesame fluidic channels located on the outside diameter of the cast tube.

Additional Embodiments X-Ray and Gamma-Ray Collimators, Grids, andDetector Arrays

Certain exemplary embodiments can provide methods for fabricating gridstructures having high-resolution and high-aspect ratio, which can beused for radiation collimators, scatter reduction grids, and/or detectorarray grids. Such devices can be used in the field of radiography to,for example, enhance image contrast and quality by filtering out andabsorbing scattered radiation (sometimes referred to as “off-axis”radiation and/or “secondary” radiation).

Certain embodiments of such devices can be used in nearly every type ofimaging, including astronomy, land imaging, medical imaging, magneticresonance imaging, tomography, fluoroscopy, non-destructive inspection,non-destructive testing, optical scanning (e.g., scanning, digitalcopying, optical printing, optical plate-making, faxing, and so forth),photography, ultra-violet imaging, etc. Thus, certain embodiments ofsuch devices can be comprised in telescopes, satellites, imagingmachines, inspection machines, testing machines, scanners, copiers,printers, facsimile machines, cameras, etc. Moreover, these machines canprocess images using analog and/or digital techniques.

For the purposes of this description, the term “collimator” is usedgenerally to describe what may also be referred to as a radiationcollimator, x-ray grid, scatter reduction grid, detector array grid, orany other grid used in an imaging apparatus and/or process.

Certain collimators fabricated according to one or more exemplaryembodiments can be placed between the object and the image receptor toabsorb and reduce the effects of scattered x-rays. Moreover, in certainexemplary embodiments, such collimators can be used in a stationaryfashion, like those used in SPECT (Single Photon Emission ComputedTomography) imaging, or can be moved in a reciprocating or oscillatingmotion during the exposure cycle to obscure the grid lines from theimage, as is usually done in x-ray imaging systems. Grids that are movedare known as Potter-Bucky grids.

X-ray grid configurations can be specified by grid ratio, which can bedefined as the ratio of the height of the grid to the distance betweenthe septa. The density, grid ratio, cell configuration, and/or thicknessof the structure can have a direct impact on the grid's ability toabsorb off-axis radiation and/or on the energy level of the x-rays thatthe grid can block.

Certain exemplary embodiments can allow for the use of variousmaterials, including high-density grid materials. Also, certainexemplary can make use of a production mold, which can be derived from alaminated mold.

Numerous additional aspects can be fabricated according to certainexemplary embodiments. For example, the laminated mold can be producedfrom a stack lamination or other method, as discussed above. Moreover,X-ray absorbent material, such as lead, lead alloys, dense metalliccomposites, and/or epoxies loaded with dense metallic powders can becast into a mold to produce x-ray absorbing grids. High-temperatureceramic materials also can be cast using a production mold.

In addition, the open cells of the ceramic grid structure can be filledwith detector materials that can be accurately registered to acollimator. The molds and grids can be fabricated having high-resolutiongrid geometries that can be made in parallel or focused configurations.The mold can remain assembled to the cast grid to provide structuralintegrity for grids with very fine septal walls, or can be removed usingseveral methods, and produce an air-cell grid structure.

FIG. 41 is a block diagram illustrating an exemplary embodiment of amethod 41000 Method 41000 can include the following activities:

-   1) creating a lithographic mask 41010 defining the features of each    unique layer,-   2) using lithographic micro-machining techniques and/or    micro-machining techniques to produce patterned layers 41020, and-   3) aligning, stacking, and/or laminating the patterned layers 41030    in order to achieve the desired 3-dimensional cavity shape,    high-aspect ratios, and/or other device features desired for the    laminated mold 41040,-   4) fabricating a casting mold 41050 derived from the laminated mold,    and/or-   5) casting x-ray grids (or other parts) 41060 using the derived    casting mold.

The following discussion describes in detail exemplary activitiesinvolved in fabricating certain exemplary embodiments of a laminatedmold, fabricating a derived mold from the laminated mold, and finallycasting a collimator from the derived mold. Certain variations in theoverall process, its activities, and the resulting collimator are notedthroughout.

In certain exemplary embodiments, the final collimator can be customizedas a result of the casting process. For instance, conventionalcollimators have two separated flat major sides that are parallel toeach other, thereby forming a flat, generally planar grid structure.Although certain exemplary embodiments includes methods for formingthese collimators, exemplary embodiments of the invention also can beused to form non-planar collimators.

An exemplary embodiment of a method can begin with the acquisition,purchase, and/or fabrication of a first collimator. This firstcollimator can serve as the master collimator from which one or moremolds can be formed. The master collimator can be made by any means,including stack lamination, but there is no limitation with respect tohow the first or master collimator can be made. Also, as will beexplained in more detail, because the master collimator is notnecessarily going to be a collimator used in radiography, it is possibleto customize this master collimator to facilitate mold formation.

The mold itself can be fabricated of many materials. When formed of aflexible material, for example, it is possible to use the mold to make anon-planar collimator. The material of the mold can be customizedaccording to cost and performance requirements. In some embodiments, itis possible to make a mold of material that is substantially transparentto radiation transmission. The mold could be left embedded in the finalcast collimator. This particular variation can be applicable when thefinal collimator has very narrow septal walls and the mold is needed toprovide support and definition for the collimator. The mold generallyalso can be reused to form multiple final (or second) collimators toachieve economies of manufacturing scale.

Radiation Opaque Casting Materials for Collimators and Grids

A broad selection of base materials can be used for the fabrication ofparts, such as x-ray collimators and scatter reduction grids. Onepotential characteristic of a grid material is sufficient absorptioncapacity so that it can block selective x-rays or gamma photons fromreaching an image detector. In certain embodiments, this characteristiccan require high density and/or high atomic number (high z) materials.Certain exemplary embodiments can utilize lead, tungsten, and/or variouslead alloys for grid fabrication, but also can include the practice ofloading various binders or alloys with dense powder metals, such astungsten. The binders can be epoxies, polymers, and/or dense alloyswhich are described in detail below.

For certain exemplary embodiments, lead can be used for casting purposesbecause of its high density and low melting point, which can allow themolten lead to be poured or injected into a mold. In certain situations,however, pure lead can shrink and/or pull away from molds when itsolidifies, which can inhibit the casting of fine features. This can beovercome by using lead alloys, made from high-density materials, whichcan allow the metal alloy to flow at lower temperatures than pure leadwhile reducing shrink factors.

A typical chief component in a lead alloy is bismuth, a heavy, coarsecrystalline metal that can expand by 3.3% of its volume when itsolidifies. The presence of bismuth can expand and/or push the alloyinto the fine features of the mold, thus enabling the duplication offine features. The chart below shows the physical properties of purelead and two lead alloys that were used to produce collimators. Thealloys were obtained from Cerro Metal Products Co. of Bellefonte, Pa.

Many other alloys exist that can be used to address specific casting andapplication requirements.

MELT DENSITY BASE MATERIAL COMPOSITION POINT (g/cc) Pure Lead Pb 621.7degrees F. 11.35 CERROBASE ™ 55.5% BI, 44.5% Pb 255 degrees F. 10.44CERROLOW- 44.7% BI, 22.6% 117 degrees F. 9.16 117 ™ Pb, 19.1% In, 8.3%Sn, 5.3% Cd,

The physical properties of lead alloys can be more process-compatiblewhen compared to pure lead, primarily because of the much lower meltingpoint. For example, the low melt point of CERROBASE™ can allow the useof rubber-based molds, which can be helpful when casting fine-featuredpieces. This can be offset in part by a slightly lower density (about8%). The somewhat lower density, can be compensated for, however, bydesigning the grid structure with an increased thickness and/or slightlywider septal walls.

Also, the alloy can be loaded with dense powder metals, such astungsten, gold, and/or tantalum, etc., to increase density. Similarly,epoxy binders can be loaded with a metallic powder such as, for example,powdered tungsten, which has a density of 19.35 grams per cubiccentimeter. In this approach, tungsten particles ranging in size from1-150 microns, can be mixed and distributed into a binder material. Thebinder material can be loaded with the tungsten powder at sufficientamounts needed to achieve densities ranging between 8 and 14 grams percubic centimeter. The tungsten powder is commercially available throughthe Kulite Tungsten Corporation of East Rutherford N.J., in variousparticle sizes, at a current cost of approximately $20-$25 dollars perpound.

The binders and metallic powders can be combined and engineered tosatisfy specific application and process issues. For example, tungstenpowder can be added to various epoxies and used for casting.

The company BONDLINE™ of San Jose, Calif., designs and manufacturesengineered adhesives, such as epoxies, using powdered metals. Suchcomposite metal epoxies can be cured at room temperature, can have highshear strength, low coefficient of thermal expansion, and viscositiesthat can be suited for high-resolution casting. Powdered materialscombined with epoxy can be stronger than lead or lead alloys, but can besomewhat lower in density, having net density ranging from 7-8 grams percubic centimeter. This density range can be acceptable for somecollimator applications. In applications where material density iscritical the practice of loading a lead alloy can be used. For example,tungsten powder can be combined with CERROBASE™ to raise the net densityof the casting material from 10.44 up to 14.0 grams per cubiccentimeter.

Certain exemplary embodiments also include the casting of gridstructures from ceramic materials, such as alumina, silicon carbide,zirconium oxide, and/or fused silica. Such ceramic grid structures canbe used to segment radiation imaging detector elements, such asscintillators. The Cotronics Corporation of Brooklyn, N.Y., manufacturesand commercially distributes Rescor™ Cer-Cast ceramics that can be castat room temperature, can have working times of 30-45 minutes, can havecure times of 16 hours, and can withstand temperatures ranging from 2300to 4000 degrees F.

Additional Embodiments Anti-Scatter Grids for Mammography and GeneralRadiography

One or more exemplary embodiments can provide cellular air cross gridsfor blocking scattered X-ray radiation in mammography applications. Suchcross grids can be interposed between the breast and the film-screen ordigital detector. In some situations, such cross grids can tend to passonly the primary, information-containing radiation to the film-screenwhile absorbing secondary and/or scattered radiation which typicallycontains no useful information about the breast being irradiated.

Certain exemplary embodiments can provide focused grids. Grids can bemade to focus to a line or a point. That is, each wall defining the gridcan be placed at a unique angle, so that if an imaginary plane wereextended from each seemingly parallel wall, all such planes wouldconverge on a line or a point at a specific distance above the gridcenter—the distance of that point from the grid known as the grid focaldistance. A focused grid can allow the primary radiation from the x-raysource to pass through the grid, producing the desired image, while theoff-axis scattered rays are absorbed by the walls of the grid (known asseptal walls).

In certain embodiments, the septal walls can be thick enough to absorbthe scattered x-rays, but also can be as thin as possible to optimizethe transmission ratio (i.e., the percentage of open cell area to thetotal grid area including septal walls) and minimize grid artifacts (theshadow pattern of grid lines on the x-ray image) in the radiograph.

The relation of the height of the septal walls to the distance betweenthe walls can be known as the grid ratio. Higher grid ratios can yield ahigher scatter reduction capability, and thus a higher ContrastImprovement Factor (CIF), which can be defined as the ratio of the imagecontrast with and without a grid. A higher grid ratio can require,however, a longer exposure time to obtain the same contrast, thuspotentially exposing the patient to more radiation. This dose penalty,known as the Bucky factor (BF), is given by BF=CIF/Tp, where Tp is thefraction of primary radiation transmitted. Certain exemplary embodimentscan provide a grid design that arrives at an optimal and/or near-optimalcombination of these measures.

One or more exemplary embodiments can include fine-celled, focused,and/or large area molded cross-grids, which can be sturdily formed froma laminated mold formed of laminated layers of metal selectively etchedby chemical milling or photo-etching techniques to provide open focusedpassages through the laminated stack of etched metal layers. In certainapplications, such molded and/or cast cross grids can maximize contrastand accuracy of the resulting mammograms when produced with a standardradiation dosage.

In certain exemplary embodiments, the laminated mold for the moldedcross grids can be fabricated using adhesive or diffusion bonding tojoin abutting edges of thin partition portions of the laminated abuttinglayers with minimum intrusion of bonding material into the open focusedpassages.

Exemplary embodiments can utilize any of a wide number of differentmaterials to fabricate such molded and/or cast cross grids. A specificapplication can result in any of the following materials being mostappropriate, depending on, for example, the net density and the cell andsepta size requirements:

-   -   Lead or lead alloy alone can offer a density of 9-11 grams per        cc;    -   Lead alloy can be loaded with a dense composite (e.g., tungsten,        tantalum, and/or gold, etc.) powder to form a composite having a        density of 12-15 grams per cc;    -   Polymer can be loaded with a dense composite (e.g., lead,        tungsten, tantalum, and/or gold, etc.) powder to form a        composite having a density of 8-9 grams per cc;    -   The cast grid made of lead alloy or any of the above        combinations can be encapsulated in a low density polymer such        that the transmission is minimally affected but scatter is        significantly reduced.

In addition, certain embodiments can be employed to fabricate gridsand/or collimators for which the mold can be pre-loaded with densepowder, followed by alloy or polymer. Alternatively, polymer or alloycan be pre-loaded with dense powder then injected into the mold. Incertain embodiments, the casting can be removed from a flexible mold. Inother embodiments, the mold can be dissolved or consumed to de-mold thecasting. In certain embodiments, a master can be removed layer-by-layerfrom rigid mold. Alternatively, the lost wax approach can be used inwhich the model is dissolvable wax, dissolvable PMMA, dissolvablepolyurethane, dissolvable high-resolution ceramic, and/or some otherdissolvable material.

Additional Embodiments Computed Tomography Collimator and Detector Array

Certain exemplary embodiments can provide a system that includes anx-ray source, a scatter collimator, and a radiation detector arrayhaving a plurality of reflective scintillators. Such a system can beused for computer-assisted tomography (“CT”). Computed tomography isoften performed using a CT scanner, which can also be known as a CATscanner. In certain embodiments, the CT scanner can look like a largedoughnut, having a square outer perimeter and a round hole. The patientcan be positioned in a prone position on a table that can be adjusted upand down, and can be slid into and out of the hole of the CT scanner.Within the chassis of the CT scanner is an x-ray tube on a rotatinggantry which can rotate around the patient's body to produce the images.On the opposite side of the gantry from the x-ray tube can be mounted anarray of x-ray detectors.

In certain exemplary embodiments, the x-ray source can project afan-shaped beam, which can be collimated to lie within an X-Y plane of aCartesian coordinate system, referred to as the “imaging plane”. Thex-ray beam can pass through the object being imaged, such as a patient.The beam, after being attenuated by the object, can impinge upon thearray of radiation detectors. The intensity of the attenuated beamradiation received at the detector array can be dependent upon theattenuation of the x-ray beam by the object. Each detector element ofthe array can produce a separate electrical signal that can provide ameasurement of the beam attenuation at the detector location. Theattenuation measurements from all the detectors can be acquiredseparately to produce an x-ray transmission profile of the object.

For certain exemplary embodiments, the detector array can include aplurality of detector elements, and can be configured to attach to thehousing. The detector elements can include scintillation elements, orscintillators, which can be coated with a light-retaining material.Moreover, in certain exemplary embodiments, the scintillators can becoated with a dielectric coating to contain within the scintillators anylight events generated in the scintillators. Such coated scintillatorscan reduce detector element output gain loss, and thereby can extend theoperational life of a detector element and/or array, withoutsignificantly increasing the costs of detector elements or detectorarrays.

In certain exemplary embodiments, the x-ray source and the detectorarray can be rotated with a gantry within the imaging plane and aroundthe object to be imaged so that the angle at which the x-ray beamintersects the object can constantly change. A group of x-rayattenuation measurements, i.e., projection data, from the detector arrayat one gantry angle can be referred to as a “view”, and a “scan” of theobject can comprise a set of views made at different gantry anglesduring one revolution of the x-ray source and detector. In an axialscan, the projection data can be processed to construct an image thatcorresponds to a two-dimensional slice taken through the object.

In certain exemplary embodiments, images can be reconstructed from a setof projection data according to the “filtered back projectiontechnique”. This process can convert the attenuation measurements from ascan into integers called “CT numbers” or “Hounsfield units”, which canbe used to control the brightness of a corresponding pixel on a cathoderay tube display.

In certain exemplary embodiments, detector elements can be configured toperform optimally when impinged by x-rays traveling a straight path fromthe x-ray source to the detector elements. Particularly, exemplarydetector elements can include scintillation crystals that can generatelight events when impinged by an x-ray beam. These light events can beoutput from each detector element and can be directed tophotoelectrically responsive materials in order to produce an electricalsignal representative of the attenuated beam radiation received at thedetector element. The light events can be output to photomultipliers orphotodiodes that can produce individual analog outputs. Exemplarydetector elements can output a strong signal in response to impact by astraight path x-ray beam.

Without a collimator, X-rays can scatter when passing through the objectbeing imaged. Particularly, the object can cause some, but not all,x-rays to deviate from the straight path between the x-ray source andthe detector. Therefore, detector elements can be impinged by x-raybeams at varying angles. System performance can be degraded whendetector elements are impinged by these scattered x-rays. When adetector element is subjected to multiple x-rays at varying angles, thescintillation crystal can generate multiple light events. The lightevents corresponding to the scattered x-rays can generate noise in thescintillation crystal output, and thus can cause artifacts in theresulting image of the object.

To, for example, reduce the effects of scattered x-rays, scattercollimators can be disposed between the object of interest and thedetector array. Such collimators can be constructed of x-ray absorbentmaterial and can be positioned so that scattered x-rays aresubstantially absorbed before impinging upon the detector array. Suchscatter collimators can be properly aligned with both the x-ray sourceand the detector elements so that substantially only straight pathx-rays impinge on the detector elements. Also, such scatter collimatorscan shield from x-ray radiation damage certain detector elements thatcan be sensitive at certain locations, such as the detector elementedges.

Certain exemplary embodiments of a scatter collimator can include aplurality of substantially parallel attenuating blades and a pluralityof substantially parallel attenuating wires located within a housing. Incertain exemplary embodiments, the attenuating blades, and thus theopenings between adjacent attenuating blades, can be orientedsubstantially on a radial line emanating from the x-ray source. That is,each blade and opening can be focally aligned. The blades also can beradially aligned with the x-ray source. That is, each blade can beequidistant from the x-ray source. Scattered x-rays, that is, x-raysdiverted from radial lines, can be attenuated by the blades. Theattenuating wires can be oriented substantially perpendicular to theblades. The wires and blades thus can form a two-dimensional shieldinggrid for attenuating scattered x-rays and shielding the detector array.

At least one embodiment of the invention can include a feature thatprovides any of at least 5 functions: 1) separation of the collimator bya predetermined distance from an array of radiation detection elements;2) alignment of the collimator to the array of radiation detectionelements (or vice versa); 3) attachment of the collimator to the arrayof radiation detection elements; 4) attach the collimator to a gantry orother detector sub-assembly; and/or 5) align the collimator to a gantryor other detector sub-assembly.

As an illustrative example, one embodiment of such a feature couldresemble “stilts” that can be formed independently or integrally to acollimator and that can separate the collimator by a predetermineddistance from an array of radiation detection elements. In anotherembodiment, one or more of the stilts could serve as an alignment pin toalign the collimator with the array of radiation detection elements. Inanother embodiment, one or more of the stilts could include and/orinterface with an attachment mechanism to attach the collimator to thearray of radiation detection elements. For example, an end of a stiltcould slide into, via an interference fit, a socket of the array ofradiation detection elements. As example, a stilt could include ahemispherical protrusion that snaps into a corresponding hemisphericalindentation in a socket of the array of radiation detection elements.

As another illustrative example, one embodiment of such a feature couldinvert the description of the previous paragraph by providing “holes” inthe collimator that interface with “stilts” attached to or integral withthe radiation detection elements.

As yet another illustrative example, an embodiment of the feature couldbe manifested in a collimator having an array of through-holes, eachhaving a square cross-section. At one end of all or certainthrough-holes could be the feature, such as a groove that extends arounda perimeter of the square through-hole. A radiation detection elementcould have a square outer perimeter that includes a lip havingcorresponding dimensions to the groove that allows the radiationdetection element to snap into the through-hole of the collimator via aninterference fit, thereby fixing the position of the radiation detectionelement with respect to the collimator, aligning the radiation detectionelement with the collimator, and attaching the radiation detectionelement to the collimator.

Moreover, a modular collection of radiation detection elements,potentially cast according to an embodiment, could attach to acollimator via one or more attachment features, any of which could beformed independently of, or integrally with, either the radiationdetection module and/or the collimator.

Depending on the embodiment, the scatter collimator can include bladesand wires, open air cells, and/or encapsulated cells. Certain exemplaryembodiments can be fabricated as a true cross grid having septa in bothradial and axial directions. The cross-grid structure can be aligned inthe radial and axial directions or it can be rotated. Thus, the crossgrid can be aligned in two orthogonal directions.

Depending on the grid design, it might not be practical and/or possibleto remove the mold from the cast grid because of its shape or size,e.g., if very thin septa or severe undercuts are involved. In suchcases, a material with a low x-ray absorptivity can be used for the moldand the final grid can be left encapsulated within the mold. Materialsused for encapsulation can include, but are not limited to,polyurethanes, acrylics, foam, plastics etc.

Because certain exemplary embodiments can utilize photolithography increating the laminated mold, great flexibility can be possible indesigning the shape of the open cells. Thus, round, square, hexagonal,and/or other shapes can be incorporated. Furthermore, the cells do notall need to be identical (a “redundant pattern”). Instead, they can varyin size, shape, and/or location (“non-redundant” pattern) as desired bythe designer. In addition, because of the precision stack lamination ofindividual layers that can be employed in fabricating the master, thecell shapes can vary in the third dimension, potentially resulting infocused, tapered, and/or other shaped sidewalls going through the cell.

Because the cell shape can vary in the third dimension (i.e. goingthrough the cell), the septa wall shape can also vary. For example, thesepta can have straight, tapered, focused, bulging, and/or otherpossible shapes. Furthermore, the septa do not all need to be identical(a “redundant pattern”). Instead, they can vary in cross-sectional shape(“non-redundant” pattern) as desired by the designer.

Certain exemplary embodiments can provide a collimator or section of acollimator as a single cast piece, which can be inherently stronger thaneither a laminated structure or an assembly of precisely machinedindividual pieces. Such a cast collimator can be designed to withstandany mechanical damage from the significant g-forces involved in thegantry structure that can rotate as fast as 4 revolutions per second.Furthermore, such a cast structure can be substantially physicallystable with respect to the alignment between collimator cells anddetector elements.

Some exemplary embodiments can provide a collimator or section of acollimator as a single cast collimator in which cells and/or cell wallscan be focused in the radial direction, and/or in which cells and/orcells walls can be accurately aligned in the axial direction.

Conversely, certain exemplary embodiments can provide a collimator orsection of a collimator as a single cast collimator in which cellsand/or cell walls can be focused (by stacking layers having slightlyoffset openings) in the axial direction, and/or in which cells and/orcells walls can be curved (and focused) in the radial direction.

Exemplary embodiments can utilize any of a wide number of differentmaterials to fabricate the scatter collimator. A specific applicationcan result in any of the following materials being most appropriate,depending on, for example, the net density and the cell and septa sizerequirements. Lead or lead alloy alone can offer a density of 9-11 gramsper cc;

-   -   Lead alloy can be loaded with a dense composite (e.g., tungsten,        tantalum, and/or gold, etc.) powder to form a composite having a        density of 12-15 grams per cc;    -   Polymer can be loaded with a dense composite (e.g., lead,        tungsten, tantalum, and/or gold, etc.) powder to form a        composite having a density of 8-9 grams per cc;    -   The cast grid made of lead alloy or any of the above        combinations can be encapsulated in a low density polymer such        that the transmission is minimally affected but scatter is        significantly reduced.

In addition, certain embodiments can be employed to fabricate gridsand/or collimators for which the mold can be pre-loaded with densepowder, followed by alloy or polymer. Alternatively, polymer or alloycan be pre-loaded with dense powder then injected into the mold. Incertain embodiments, the casting can be removed from a flexible mold. Inother embodiments, the mold can be dissolved or consumed to de-mold thecasting. In certain embodiments, a master can be removed layer-by-layerfrom rigid mold. Alternatively, the lost wax approach can be used inwhich the model is dissolvable wax, dissolvable PMMA, dissolvablepolyurethane, dissolvable high-resolution ceramic, and/or some otherdissolvable material.

The above description and examples have covered a number of aspects ofcertain exemplary embodiments of the invention including, for example,cell size and shape, different materials and densities, planar andnon-planar orientations, and focused and unfocused collimators.

Additional Embodiments Nuclear Medicine (SPECT) Collimator and DetectorArray

In conventional X-ray or CT examinations, the radiation is emitted by amachine and then passes through the patient's body. In nuclear medicineexams, however, a radioactive material is introduced into the patient'sbody (by injection, inhalation or swallowing), and is then detected by amachine, such as a gamma camera or a scintillation camera.

The camera can have a detector and means to compute the detected image.The detector can have at least one a scintillator crystal, whichtypically is planar. The scintillator can absorb the gamma radioactiveradiation, and emit a luminous scintillation in response, which can bedetected by an array of photomultiplier tubes of the detector. Thecomputation means can determine the coordinates of a locus ofinteraction of the gamma rays in the scintillator, which can reveal theprojected image of the body.

Because the radiation source in the patient can emit radiationomnidirectionally, a collimator can be located between the body and thescintillator. This collimator can prevent the transmission of thoseradioactive rays that are not propagating in a chosen direction.

Certain embodiments can be used to fabricate structures useful fornuclear medicine. For example, collimators used in nuclear medicine,including pinhole, parallel-hole, diverging, and converging collimators,can be fabricated according to one or more exemplary methods.

As another example, exemplary methods can be used to fabricate highprecision, high attenuation collimators with design flexibility forhole-format, which can improve the performance of pixelated gammadetectors.

Certain exemplary embodiments of certain casting techniques can beapplied to the fabrication of other components in detector systems. FIG.47 is an assembly view of components of a typical pixelated gammacamera. Embodiments of certain casting techniques can be used to producecollimator 47010, scintillator crystals segmentation structure 47020,and optical interface 47030 between scintillator array (not visible) andphoto-multiplier tubes 47040.

In an exemplary embodiment, collimator 47010 can be fabricated fromlead, scintillator crystals segmentation structure 47020 can befabricated from a ceramic, and optical interface 47030 can be fabricatedfrom acrylic.

In certain exemplary embodiments, through the use of a commonfabrication process, two or more of these components can be made to thesame precision and/or positional accuracy. Moreover, two or more ofthese components can be designed to optimize and/or manage seams and/ordead spaces between elements, thereby potentially improving detectorefficiency for a given choice of spatial resolution. For example, in apixelated camera with non-matched detector and collimator, if thedetector's open area fraction (the fraction of the detector surface thatis made up of converter rather than inter-converter gap) is 0.75, andthe collimator's open area fraction (the fraction of the collimatorsurface that is hole rather than septum) is 0.75, the overall open areafraction is approximately (0.75)=0.56. For a similar camera in which thecollimator holes are directly aligned with the pixel converters, theopen area fraction is 0.75, giving a 33% increase in detectionefficiency without reduction in spatial resolution.

Certain embodiments can provide parallel hole collimators and/orcollimators having non-parallel holes, such as fan beam, cone beam,and/or slant hole collimators. Because certain embodiments usephotolithography in creating the master, flexibility is possible indesigning the shape, spacing, and/or location of the open cells. Forexample, round, square, hexagonal, or other shapes can be incorporated.In addition, because certain embodiments use precision stack laminationof individual layers to fabricate a laminated mold, the cell shapes canvary in the third dimension, resulting in focused, tapered, and/or othershaped sidewalls going through the cell. Furthermore, the cells do notall need to be identical (“redundant”). Instead, they can vary in size,shape or location (“non-redundant”) as desired by the designer, which insome circumstances can compensate for edge effects. Also, because aflexible mold can be used with certain embodiments, collimators havingnon-planar surfaces can be fabricated. In some cases, both surfaces arenon-planar. However, certain embodiments also allow one or more surfacesto be planar and others non-planar if desired.

Certain embodiments can fabricate a collimator, or section of acollimator, as a single cast piece, which can make the collimator lesssusceptible to mechanical damage, more structurally stable, and/or allowmore accurate alignment of the collimator with the detector.

Certain embodiments can utilize any of a number of different materialsto fabricate a collimator or other component of an imaging system. Aspecific application could result in any of the following materialsbeing chosen, depending, in the case of a collimator, on the net densityand the cell and septa size requirements:

-   -   Lead or lead alloy alone can offer a density of 9-11 grams per        cc    -   Polymer can be loaded with tungsten powder to form a composite        having a density comparable to lead or lead alloys    -   Polymer can also be combined with other dense powder composites        such as tantalum or gold to yield a density comparable to lead        or lead alloys    -   Polymer can be combined with two or more dense powders to form a        composite having a density comparable to lead or lead alloys    -   Lead alloy can be loaded with tungsten powder to form a        composite having a density of 12-15 grams per cc    -   Lead alloy can be loaded with another dense composites        (tantalum, gold, other) to form a composite having a density of        12-15 grams per cc    -   Lead alloy can be combined with two or more dense powders to        form composites having a density of 12-15 grams per cc (atomic        number and attenuation)    -   The cast grid made of lead alloy or any of the above        combinations can be encapsulated in a low-density material such        that the transmission is minimally affected but scatter is        reduced.

Thus, depending on the specific application, certain embodiments cancreate any of a wide range of densities for the cast parts. For example,by adding tungsten (or other very dense powders) to lead alloys, netdensities greater than that of lead can be achieved. In certainsituations, the use of dense particles can provide high “z” properties(a measure of radiation absorption). For certain embodiments, asradiation absorption improves, finer septa walls can be made, which canincrease imaging resolution and/or efficiency.

In addition, certain embodiments can be employed to fabricate gridsand/or collimators for which the mold can be pre-loaded with densepowder, followed by alloy or polymer. Alternatively, polymer or alloycan be pre-loaded with dense powder then injected into the mold. Incertain embodiments, the casting can be removed from a flexible mold. Inother embodiments, the mold can be dissolved or consumed to de-mold thecasting. In certain embodiments, a master can be removed layer-by-layerfrom rigid mold. Alternatively, the lost wax approach can be used inwhich the model is dissolvable wax, dissolvable PMMA, dissolvablepolyurethane, dissolvable high-resolution ceramic, and/or some otherdissolvable material.

With certain embodiments, the stack-laminated master does not need toembody the net density of the final grid. Instead, it can haveapproximately the same mechanical shape and size. Similarly, the finalgrid can be cast from relatively low cost materials such as lead alloysor polymers. Furthermore, these final grids can be loaded with tungstenor other dense powders. As discussed previously, using certainembodiments of the invention, multiple molds can be made from a singlemaster and multiple grids can be cast at a time, if desired. Such anapproach can lead to consistency of dimensions and/or geometries of themolds and/or grids.

Because of the inherent precision of the lithographic process, certainembodiments can prevent and/or minimize assembly build up error,including error buildup across the surface of the grid and/or assemblybuildup error as can occur in collimators in which each grid isindividually assembled from photo-etched layers. In addition, processerrors can be compensated for in designing the laminated mold.

Example 6 Lead Collimator for Gamma Camera Nuclear Medicine Application

Step 1: Creating the laminated mold: In this exemplary process, 0.05 mmthick copper foils were chemically etched and then laminated togetherusing a metal-to-metal brazing process, for producing a laminated mold.Photo-masks were configured with a 2.0×2.0 millimeter square open cell,with a 0.170 mm septal wall separating the cells. The cells were arrayedhaving 10 rows and 10 columns, with a 2 mm border around the cell array.Photo-masks were produced to the same specifications, by the same vendoras those described in example 1, step 1.

The layers were designed so that the cell placement was identical fromlayer to layer, which when assembled, produced a parallelcross-sectional shape. FIG. 42A is a top view of an x-ray grid 42000having an array of cells 42002 separated by septal walls 42004. FIG. 42Bis a cross-sectional view of x-ray grid 42000 taken along section lines42-42 of FIG. 42B showing that the placement of cells 42002 can also bedissimilar from layer to layer 42010-42050, so that when assembled,cells 42002 are focused specifically to a point source 42060 at a knowndistance from x-ray grid 42000.

The total number of layers in the stack lamination defined the thicknessof the casting mold and final cast grid. The final thickness of thelamination was specified at 0.118 inches, which required 57 layers ofcopper foil, leaving a total thickness amount of 0.00007 inches betweeneach layer for a braze material. The layers were processed by Tech Etchof Plymouth Mass., using standard photo-etching techniques and wereetched in such a way that the cross-sectional shape of the etched wallswere perpendicular to the top and bottom surfaces of the foil (commonlyreferred to as straight sidewalls).

The method chosen to bond the grid layers together was a metal-to-metalbrazing technique described earlier in detail as one of two exemplarymethods of bonding layers together (eutectic braze alloy). The brazedlamination was then electro-plated with a coating of hard nickel, alsodescribed earlier.

Step 2: Creating a derived mold: An RTV mold was made from the stacklaminated mold from step 1. Silastic® M RTV Silicone Rubber was chosenas the base material for the derived mold. This particular material wasused to demonstrate the resolution capability, release properties,multiple castings, and dimensional repeatability of the derived moldfrom the laminated mold. Silastic M has the hardest durometer of theSilastic® family of mold making materials. The derived mold wasconfigured as an open face mold.

The fixture used to create the derived casting mold is shown in FIG. 32and was comprised of a precision machined aluminum ring 32010, precisionground glass plates 32020 and 32030, rubber gaskets 32040 and 32050, andthe laminated mold 32060. The base of the fixture 32020 was a 5 inchsquare of 1 inch thick Plexiglas. On the top surface of the Plexiglasbase was a 1″ thick, 3 inch diameter glass substrate 32030. The base andthe glass substrate were separated by a 1/16 inch thick, 4.5 inchdiameter rubber gasket 32040. An additional 3.0 inch rubber gasket 32050was placed on the top surface of the glass substrate 32030. The rubbergaskets helped prevent unwanted flashing of molten material whencasting. The laminated mold 32060 was placed on the top gasket.

The shape and thickness of the glass created the entrance area where thecasting material was poured into the mold. The material formed in thiscavity was referred to as a controlled backing It served as a releaseaid for the final casting, and could later be removed from the castingin a final machining process. A precision machined aluminum ring 32010having a 4.5 inch outside diameter and a 4 inch inside diameter wasplaced over the master subassembly and interfaced with the lower 4.5inch diameter rubber gasket.

As illustrated in FIG. 32, the height of the ring was configured so thatthe distance from the top surface of the master to the top of the ringwas twice the distance from the base of the fixture to the top of thelaminated mold. The additional height allowed the RTV material to riseup during the degassing process. The ring portion of the fixtureassembly was used to locate the pouring of the mold material into theassembly, captivate the material during the curing process, and providean air escape while the mold material was degassed using vacuum. Thefixture was configured in such a way that all sides surrounding thelaminated mold were equal and common, in order to limit the effects orstresses put on the lamination from the mold material.

The Silastic® M RTV Silicone Rubber used for the mold fabrication wasprepared in accordance with the manufacturer's recommendations, usingthe process described earlier in example 1, step 2.

The laminated mold was characterized, before and after the mold-makingprocess, by measuring the average pitch distance of the cells, theseptal wall widths, overall distance of the open grid area, and thefinished thickness of the part. These dimensions were also measured onthe derived casting mold and compared with the laminated mold before andafter the mold-making process. The following chart lists the dimensionsof the lamination before and after the mold-making and the samedimensions of the derived RTV mold. All dimensions were taken using aNikon MM-11 measuring scope at 200× magnification. These dimensionsdemonstrated the survivability of the master and the dimensionalrepeatability of the mold.

Master Lamination RTV Mold Master Lamination Grid Feature (beforemold-making) Silastic ® M (after mold-making) Septal Wall Width (mm)0.170 0.161 0.170 Cell Width (mm) 2.000 × 2.000 2.010 × 2.010 2.000 ×2.000 Cell Pitch (mm) 2.170 × 2.170 2.171 × 2.171 2.170 × 2.170 Patternarea (mm) 21.530 × 21.530 21.549 × 21.549 21.530 × 21.530 Thickness (mm)2.862 2.833 2.862

Step 3: Casting the final collimator: A fine-featured lead collimatorwas produced from the derived RTV silicone mold described in step 2.FIG. 43 is a side view of an assembly 43000 that includes an open facemold 43010 that was used to produce a casting 43020 from CERROBASE™alloy. Casting 43020 was dimensionally measured and compared to thelaminated mold 43010. The backing 43030 of casting 43020 was 6millimeters in thickness and was removed using a machining process.

Grid Features Master Lamination Cast Collimator Septal Wall Width (mm)0.170 0.165 Cell Width (mm) 2.000 × 2.000 2.005 × 2.005 Cell Pitch (mm)2.170 × 2.170 2.170 × 2.170

The first step of the casting process was to pre-heat the derived RTVmold to a temperature of 275 degrees F., which was 20 degrees above themelting point of the CERROBASE™ alloy. The mold was placed on a heatedaluminum substrate, which maintained the mold at approximately 275degrees F. when it was placed in the vacuum bell jar.

In certain casting procedures, the material can be forced into the moldin a rapid fashion, and cooled and removed quickly. In this case, thecasting process was somewhat slowed in order to fully fill and evacuatethe air from the complex cavity geometry of the mold. The CERROBASE™ wasthen heated in an electric melting pot to a temperature of 400 degreesF., which melted the alloy sufficiently above its melt point to remainmolten during the casting process.

The next step was to pour the molten alloy into the mold, in such a wayas to aid in the displacement of any air in the cavity. This wasaccomplished by tilting the mold at a slight angle and beginning thepour at the lowest point in the cavity section of the mold. It was foundthat if the mold was placed in a flat orientation while pouring themolten alloy, significant amounts of air were trapped, creating problemsin the degassing phase of the process. Instead, once the mold wassufficiently filled with the molten alloy, the mold was slightlyvibrated or tapped in order to expel the largest pockets of air. Themold, on the heated aluminum substrate, was then placed in the vacuumbell jar, pumped down to atmosphere of 25-28 inches of mercury for 2minutes, which was sufficient time to evacuate any remaining airpockets. The mold was then removed from the vacuum bell jar andsubmersed in a quenching tank filled with water cooled to a temperatureof 50 degrees F. The rapid quench produced a fine crystalline grainstructure when the casting material solidified. The casting was thenremoved from the flexible mold by grasping the backing 43030, bymechanical means or by hand, and breaking the casting free of the moldusing an even rotational force, releasing the casting gradually from themold.

The final process step was removing the backing 43030 from the attachedsurface of the grid casting 43020 to the line shown in FIG. 43. Prior toremoving the backing, the grid structure of the final casting 43020 wasfilled or potted with a machinable wax, which provided the structuralintegrity needed to machine the backing without distorting the finewalls of the grid casting. The wax was sold under the product nameMASTER™ Water Soluble Wax by the Kindt-Collins Corporation, ofCleveland, Ohio. The wax was melted at a temperature of 160-180 degreesF., and poured into the open cells of the cast grid. Using the sametechnique described above, the wax potted casting was placed in vacuumbell jar and air evacuated before being cooled. The wax was cooled toroom temperature and was then ready for the machining of the backing.

A conventional surface grinder was used to first rough cut the backingfrom the lead alloy casting. The remaining casting was then placed on alapping machine and lapped on the non-backing side of the casting usinga fine abrasive compound and lapping wheel. The non-backing side of thecasting was lapped first so that the surface was flat and parallel towithin 0.010-0.015 millimeters to the adjacent cast grid cells. Therough-cut backing surface was then lapped using the same abrasive wheeland compound so that it was flat and parallel to within 0.100-0.015millimeters of the non-backing side of the casting. A thickness of 2.750millimeters was targeted as the final casting thickness. Upon completionof the lapping process, the casting was placed in an acid solution,comprised of 5% dilute HCl and water, with mild agitation until the waxwas fully dissolved from the cells of the casting.

In an alternative embodiment, individual castings could also be stacked,aligned, and/or bonded to achieve thicker, higher aspect ratiocollimators. Such collimators, potentially having a thicknesses measuredin centimeters, can be used in nuclear medicine.

Example 7 Non-Planar Collimator

A non-planar collimator can have several applications, such as, forexample, in a CT environment. To create such an example of such acollimator, the following process was followed:

Step 1: Creating a laminated mold: For this example, a laminated moldwas designed and fabricated using the same process and vendors describedin Example 1, step 1. The laminated mold was designed to serve as thebasis for a derived non-planar casting mold. The laminated mold wasdesigned and fabricated with outside dimensions of 73.66 mm×46.66 mm, a5 mm border around a grid area having 52×18 open cell array. The cellswere 1 mm×1.980 mm separated by 0.203 septal walls.

The layers for the laminated mold were bonded using the same processdescribed in Example 1, step 1 (thermo-cured epoxy). The dimensions ofthe laminated mold were specified to represent a typical collimator forCT x-ray scanning Silastic® J RTV Silicone Rubber was chosen as a basematerial to create a derived non-planar casting mold because of itsdurometer which allowed it to more easily be formed into a non-planarconfiguration. The laminated mold and fixture was configured as an openface mold.

Step 2: Creating a derived non-planar mold: Silastic® J RTV SiliconeRubber was used for the derived mold fabrication and was prepared inaccordance with the manufacturers recommendations, using the processdescribed earlier in example 1, step 2. FIG. 44 is a top view of castingassembly 44000. FIG. 45 is a side view of casting assembly 44000.

The derived RTV mold 44010 was then formed into a non-planarconfiguration as shown in FIG. 45. The surface 44020 of casting fixturebase 44030 defined a 1-meter radius arc to which mold 44010 wasattached. A 1-meter radius was chosen because it is a common distancefrom the x-ray tube to the collimator in a CT scanner. Mold 44010 wasfastened to the convex surface 44020 of casting base 44030 with a hightemperature epoxy adhesive. A pour frame 44040 was placed around castingfixture base 44030. Pour frame 44040 had an open top to allow pouringthe casting material to a desired fill level and to allow evacuating theair from the casting material.

The laminated mold was characterized, before and after producing thederived non-planar mold, by measuring the average pitch distance of thecells, the septal wall widths, overall distance of the open grid area,and the finished thickness of the part. These dimensions were alsomeasured on the derived non-planar mold and compared with the masterbefore and after the mold-making process. The following chart lists thedimensions of the master lamination before and after the mold-making andthe same dimensions of the RTV mold in the planar state and curvedstate. All dimensions are in millimeters and were taken using a NikonMM-11 measuring scope at 200× magnification.

Master Lamination RTV Mold RTV Mold Grid (before mold- (planar) (curved)Features making) Silastic ® J Silastic ® J Septal Wall 0.203 0.183 0.193* Cell Width 1.980 × 1.000 2.000 × 1.020 2.000 × 1.020 Cell Pitch2.183 × 1.203 2.183 × 1.203 2.183 × 1.213 Pattern area 39.091 × 62.35339.111 × 62.373 39.111 × 62.883 Thickness 7.620 7.544 7.544 *measured inthe direction of curvature.

Step 3: Casting a non-planar collimator: The derived non-planar RTV molddescribed in step 2, was used to create castings. Using the derivednon-planar mold, the castings were produced from CERROBASE™ alloy andwere dimensionally measured and compared to the laminated mold.

Grid Features Master Lamination Cast Collimator Septal Wall Width (mm)0.203 0.197* Cell Width (mm) 1.000 × 1.980 1.006 × 1.986 Cell Pitch (mm)1.203 × 2.183 1.203 × 2.183 *measured in the direction of curvature.

The process used to fill the derived non-planar mold with the castingalloy and the de-molding of the casting was the same process describedin Example 6.

The final process step included the removal of the backing from the gridcasting. A wire EDM (electrode discharge machining) process was found tobe the most effective way to remove the backing from the casting,primarily due to the curved configuration of the casting. The wire EDMprocess used an electrically charged wire to burn or cut through thecasting material, while putting no physical forces on the parts. In thiscase, a fine 0.003 inch molybdenum wire was used to cut the part, at acutting speed of 1 linear inch per minute. This EDM configuration waschosen to limit the amount of recast material left behind on the cutsurface of the part, leaving the finished septal walls with a smoothsurface finish. The casting was fixtured and orientated so that theradial cutting of the backing was held parallel to the curved surface ofthe casting, which was a 1 meter radius.

Example 8 Mammography Scatter Reduction Grid

Another exemplary application of embodiments is the fabrication of amammography scatter reduction grid. In this example, a derived clearurethane mold for a fine-featured focused grid was made using aphoto-etched stack lamination for the master model. For making thismold, the master was designed and fabricated using the laminationprocess detailed in Example 7. A clear urethane casting material waschosen as an example of a cast grid in which the mold was left intactwith the casting as an integral part of the grid structure. Thisprovided added strength and eliminated the need for a fragile or angledcasting to be removed from the mold.

Step 1: Creating a laminated mold: The laminated mold was fabricatedfrom photo-etched layers of copper. The mold was designed to have a 63mm outside diameter, a 5 mm border around the outside of the part, and afocused 53 mm grid area. FIG. 46 is a top view of a grid area 46000,which was comprised of hexagonal cells 46010 that were 0.445 mm wide,separated by 0.038 mm septal walls 46020. The cells were focused fromthe center of the grid pattern to a focal point of 60 centimeters,similar to that shown in FIG. 42B. The grid was made from 35 layers of0.050 mm thick stainless steel, which when assembled created a 4:1 gridratio. Each grid layer utilized a separate photo-mask in which the cellsare arrayed out from the center of the grid pattern at a slightly largerdistance from layer to layer. This created the focused geometry as shownin FIG. 42B. With this cell configuration, the final casting produced ahexagonal focused grid with a transmission of about 82%. The photo-masksand etched layers were produced using the same vendors and processesdescribed in example 1, steel.

Step 2: Creating a derived urethane mold: Urethane mold material waschosen for its high-resolution, low shrink factor, and low density.Because of its low density, the urethane is somewhat transparent to thetransmission of x-rays. The mold material, properties, and processparameters were as described earlier in example 4, step 4.

The fixture used to create the derived urethane casting mold was thesame as that described in Example 6, step 2.

Before assembling the mold fixture, the laminated mold was sprayed witha mold release, Stoner E236. The fixture was assembled as shown in FIG.32 and heated to 125 degrees F. Then it was filled with the Water Clearurethane and processed using the same parameters described in example 4,step 4. The laminated mold was characterized, before and after makingthe derived mold, by measuring the average pitch distance of the cells,the septal wall widths, overall distance of the open grid area, and thefinished thickness of the lamination. These dimensions were alsomeasured on the derived urethane casting mold and compared with thelamination before and after the mold-making process. The following chartlists the dimensions of the lamination before and after the mold-makingand the same dimensions of the urethane mold. All dimensions were inmillimeters and were taken using a Nikon MM-11 measuring scope at 200×magnification.

Master Urethane Casting Master Grid Lamination (after System Lamination(after Features mold-making) Water Clear mold-making) Septal Wall 0.0380.037 0.038 Width Cell Width 0.445 (hexagonal) 0.446 (hexagonal) 0.445(hexagonal) Cell Pitch 0.483 0.483 0.483 Pattern 53.000 52.735 53.000area (mm2) Thickness 1.750 1.729 1.750

Step 3: Casting the anti-scatter grid: A focused scatter reduction gridwas produced by casting a lead alloy, CERROLOW-117™ alloy into thederived urethane mold described in step 2. The backing thickness of thecasting was 2 millimeters and was removed using a surface grindingprocess.

The first step of the process was to pre-heat the derived urethane moldto a temperature of 137 degrees F., which was 20 degrees above the 117degree melting point of the CERROLOW™ alloy. The mold was placed on aheated aluminum substrate, which maintained the mold to approximately117 degrees F. when it was placed in the vacuum bell jar. The CERROLOW™was then heated in an electric melting pot to a temperature of 120degrees F., which melted the alloy sufficiently above the melt point ofthe material, keeping the material molten during the casting process.The process steps for filling the mold were the same as those describedin Example 6, step 3.

The CERROLOW™ alloy was chosen for casting because of its highresolution capability, low melting point, and relatively high density.The urethane mold was left remaining to provide structural integrity forthe fine lead alloy features. The urethane is also somewhat transparentto x-rays because of its low density (1 g/cm³) compared to the castingalloy.

Example 9 Collimator with Tungsten Loaded Alloy Variation of Example 6

Additional collimator samples have been produced using the same processdescribed in Example 6 above, with the exception of the casting alloyand that it was loaded with tungsten powder prior to the castingprocess. The tungsten powder (KMP115) was purchased through the KuliteTungsten Corporation of East Rutherford, N.J. CERROLOW™ alloy was loadedto raise the net density of the alloy from a density of 9.16 grams percubic centimeter to 13 grams per cubic centimeter.

In certain radiological applications, elimination of secondary scatteredradiation, also known as Compton scatter, and shielding can be anobjective. The base density of the CERROLOW™ alloy can be sufficient onits own to absorb the scattered radiation, but the presence of thetungsten particles in the septal walls can increase the density andimprove the scatter reduction performance of the part. The casting wasdimensionally measured and compared to the laminated mold used to createthe derived RTV mold.

Grid Features Master Lamination Cast Collimator Material CopperCERROLOW-117 Plus Tungsten Powder Density (g/cc) 8.96  12.50  SeptalWall Width 0.038 0.036 Cell Width 0.445 (hexagonal) 0.447 (hexagonal)Cell Pitch 0.483 0.483 *all dimensions are in millimeters.

Prior to casting, the tungsten powder was loaded or mixed into theCERROLOW™ alloy. The first step was to super-heat the alloy to 2-3 timesits melting point temperature (between 234-351 degrees F.), and tomaintain this temperature. The tungsten powder, having particle sizesranging from 1-15 microns in size, was measured by weight to 50% of thebase alloy weight in a furnace crucible. A resin-based, lead-compatiblesoldering flux was added to the tungsten powder to serve as a wettingagent when combining the powder and the alloy. The resin flux wasobtained from the Indium Corporation of America of Utica N.Y., under thename Indalloy Flux # 5RMA.

The flux and the powder were heated to a temperature of 200 degrees F.and mixed together after the flux became liquid. The heated CERROLOW™alloy and the fluxed powder then were combined and mixed using ahigh-shear mixer at a constant temperature of 220 degrees F. The netdensity of the alloy loaded with the powder was measured at 12.5 gramsper cubic centimeter. The loaded alloy was molded into the derived RTVmold, and finished machined using the same process described in Example6.

Example 10 Collimator Structure Cast from a Ceramic Variation of Example7

This example demonstrates a structure that could be co-aligned with acast collimator. The structure could be filled with detector materials,such as a scintillator, for pixilation purposes. Ceramic was chosen forhigh temperature processing of the scintillator materials, which arenormally crystals.

Additional cast samples have been produced using a castable silicaceramic material using the same mold described in Example 7 above. Theceramic material, Rescor™-750, was obtained from the CotronicsCorporation of Brooklyn, N.Y. The ceramic material was prepared prior tocasting per the manufacturer's instructions. This included mixing theceramic powder with the supplied activator. Per the manufacturer'sinstructions, an additional 2% of activator was used to reduce theviscosity of the mixed casting ceramic, in order to aid in filling thefine cavity features of the mold.

The mold was filled and degassed using a similar process and the samemold and non-planar fixture as Example 7 above, covered with a thinsheet of plastic, and allowed to cure for 16 hours at room temperature.The ceramic casting then was removed from the RTV mold and post cured toa temperature of 1750 degrees F., heated at a rate of 200 degrees F. perhour. Post-curing increased the strength of the cast grid structure. Theceramic casting then was ready for the final grinding and lappingprocess for the removal of the backing

Additional Fields of Use

Additional exemplary fields of use, illustrative functionalities and/ortechnology areas, and representative cast devices are contemplated forvarious embodiments of the invention, as partially listed below. Notethat any such device, and many others not specifically listed, canutilize any aspect of any embodiment of the invention as disclosedherein to provide any of the functionalities in any of the fields ofuse. For example, in the automotive industry, inertial measurement canbe provided by an accelerometer, at least a component of which that hasbeen fabricated according to a method. Likewise, in thetelecommunications field, one or more components of an optical switch,and possibly an entire optical switch, can be fabricated according to amethod.

Embodiments of such devices can provide any of a number offunctionalities, including, for example, material, mechanical, thermal,fluidic, electrical, magnetic, optical, informational, physical,chemical, biological, and/or biochemical, etc. functionalities.Embodiments of such devices can at least in part rely on any of a numberof phenomena, effects, and/or properties, including, for example,electrical, capacitance, inductance, resistance, piezoresistance,piezoelectric, electrostatic, electrokinetic, electrochemistry,electromagnetic, magnetic, hysteresis, signal propagation, chemical,hydrophilic, hydrophobic, Marangoni, phase change, heat transfer,fluidic, fluid mechanical, multiphase flow, free surface flow, surfacetension, optical, optoelectronic, electro-optical, photonic, wave optic,diffusion, scattering, interference, diffraction, reflection,refraction, absorption, adsorption, mass transport, momentum transport,energy transport, species transport, mechanical, structural dynamic,dynamic, kinematic, vibration, damping, tribology, material, bimetallic,shape memory, biological, biochemical, cell transport, electrophoretic,physical, Newtonian, non-Newtonian, linear, non-linear, and/or quantum,etc. phenomena, effects, and/or properties.

Moreover, note that unless stated otherwise, any device, discrete devicecomponent, and/or integrated device component fabricated according toany method disclosed herein can have any dimension, dimensional ratio,geometric shape, configuration, feature, attribute, material ofconstruction, functionality, and/or property disclosed herein.

Among the many contemplated industries and/or fields of use are:

-   -   Aerospace    -   Automotive    -   Avionics    -   Biotechnology    -   Chemical    -   Computer    -   Consumer Products    -   Defense    -   Electronics    -   Manufacturing    -   Medical devices    -   Medicine    -   Military    -   Optics    -   Pharmaceuticals    -   Process    -   Security    -   Telecommunications    -   Transportation

Among the many contemplated technology areas are:

-   -   Acoustics    -   Active structures and surfaces    -   Adaptive optics    -   Analytical instrumentation    -   Angiography    -   Arming and/or fusing    -   Bio-computing    -   Bio-filtration    -   Biomedical imaging    -   Biomedical sensors    -   Biomedical technologies    -   Cardiac and vascular technologies    -   Catheter based technologies    -   Chemical analysis    -   Chemical processing    -   Chemical testing    -   Communications    -   Computed tomography    -   Computer hardware    -   Control systems    -   Data storage    -   Display technologies    -   Distributed control    -   Distributed sensing    -   DNA Assays    -   Electrical hardware    -   Electronics    -   Fastener mechanisms    -   Fluid dynamics    -   Fluidics    -   Fluoroscopy    -   Genomics    -   Imaging    -   Inertial measurement    -   Information technologies    -   Instrumentation    -   Interventional radiography    -   Ion source technologies    -   Lab-on-a-chip    -   Measurements    -   Mechanical technologies    -   Medical technologies    -   Microbiology    -   Micro-fluidics    -   Micro-scale power generation    -   Non-invasive surgical devices    -   Optics    -   Orthopedics    -   Power generation    -   Pressure measurement    -   Printing    -   Propulsion    -   Proteomics    -   Radiography    -   RF (radio frequency) technologies    -   Safety systems    -   Satellite technologies    -   Security technologies    -   Signal analysis    -   Signal detection    -   Signal processing    -   Surgery    -   Telecommunications    -   Testing    -   Tissue engineering    -   Turbomachinery    -   Weapon safeing

Among the many contemplated cast devices and/or cast device componentsare at least one:

-   -   accelerometer    -   actuator    -   airway    -   amplifier    -   antenna    -   aperture    -   application specific microinstrument    -   atomizer    -   balloon catheter    -   balloon cuff    -   beam    -   beam splitter    -   bearing    -   bioelectronic component    -   bio-filter    -   biosensor    -   bistable microfluidic amplifier    -   blade passage    -   blower    -   bubble    -   capacitive sensor    -   capacitor    -   cell sorting membrane    -   chain    -   channel    -   chromatograph    -   clip    -   clutch    -   coextrusion    -   coil    -   collimator    -   comb    -   comb drive    -   combustor    -   compression bar    -   compressor    -   conductor    -   cooler    -   corrosion sensor    -   current regulator    -   density sensor    -   detector array    -   diaphragm    -   diffractive grating    -   diffractive lens    -   diffractive phase plate    -   diffractor    -   diffuser    -   disc    -   display    -   disposable sensor    -   distillation column    -   drainage tube    -   dynamic value    -   ear plug    -   electric generator    -   electrode array    -   electronic component socket    -   electrosurgical hand piece    -   electrosurgical tubing    -   exciter    -   fan    -   fastener    -   feeding device    -   filter    -   filtration membrane    -   flow passage    -   flow regulator    -   fluid coextrusion    -   fluidic amplifier    -   fluidic oscillator    -   fluidic rectifier    -   fluidic switch    -   foil    -   fuel cell    -   fuel processor    -   fuse    -   gear    -   grating    -   grating light valve    -   gyroscope    -   hearing aid    -   heat exchanger    -   heater    -   high reflection coating    -   housing    -   humidity sensor    -   impeller    -   inducer    -   inductor    -   infra-red radiation sensor    -   infusion sleeve    -   infusion test chamber    -   interferometer    -   introducer sheath    -   introducer tip    -   ion beam grid    -   ion deposition device    -   ion etching device    -   jet    -   joint    -   lens    -   lens array    -   lenslet    -   link    -   lock    -   lumen    -   manifold    -   mass exchanger    -   mass sensor    -   membrane    -   microbubble    -   microchannel plate    -   microcombustor    -   microlens    -   micromirror    -   micromirror display    -   microprism    -   microrelay    -   microsatellite component    -   microshutter    -   microthruster    -   microtiterplate    -   microturbine    -   microwell    -   mirror    -   mirror display    -   mixer    -   multiplexer    -   nozzle    -   optical attenuator    -   optical collimator    -   optical switch    -   ordinance control device    -   ordinance guidance device    -   orifice    -   phase shifter    -   photonic switch    -   pin array    -   plunger    -   polarizer    -   port    -   power regulator    -   pressure regulator    -   pressure sensor    -   printer head    -   printer head component    -   prism    -   processor    -   processor socket    -   propeller    -   pump    -   radiopaque marker    -   radiopaque target    -   rate sensor    -   reaction chamber    -   reaction well    -   reactor    -   receiver    -   reflector    -   refractor    -   regulator    -   relay    -   resistor    -   resonator    -   RF switch    -   rim    -   safe-arm device    -   satellite component    -   scatter grid    -   seal    -   septum    -   shroud    -   shunt    -   shutter    -   spectrometer    -   stent    -   stopper    -   supercharger    -   switch    -   tank    -   temperature regulator    -   temperature sensor    -   thruster    -   tissue scaffolding    -   titerplate    -   transmission component    -   transmitter    -   tunable laser    -   turbine    -   turbocharger    -   ultra-sound transducer    -   valve    -   vane    -   vessel    -   vibration sensor    -   viscosity sensor    -   voltage regulator    -   waveplate    -   well    -   wheel    -   wire coextrusion

Additional detailed examples of some of the many possible embodiments ofdevices and/or device components that can be fabricated according to amethod are now provided. Additional potential embodiments of theseand/or other herein-described devices and/or device components aredescribed in one or more of U.S. patent and/or patent applicationsUS2001/0031531, US2001/0034114, U.S. Pat. Nos. 408,677, 460,377,1,164,987, 3,379,812, 3,829,536, 4,288,697, 4,356,400, 4,465,540,4,748,328, 4,801,379, 4,812,236, 4,825,646, 4,856,043, 4,951,305,5,002,889, 5,043,043, 5,147,761, 5,150,183, 5,190,637, 5,206,983,5,252,881, 5,378,583, 5,447,068, 5,450,751, 5,459,320, 5,483,387,5,551,904, 5,576,147, 5,606,589, 5,620,854, 5,638,212, 5,644,177,5,681,661, 5,692,507, 5,702,384, 5,718,618, 5,721,687, 5,729,585,5,763,318, 5,773,116, 5,778,468, 5,786,597, 5,795,748, 5,814,235,5,814,807, 5,836,150, 5,849,229, 5,851,897, 5,924,277, 5,929,446,5,932,940, 5,949,850, 5,955,801, 5,955,818, 5,962,949, 5,963,788,5,985,204, 5,994,801, 5,994,816, 5,998,260, 6,004,500, 6,011,265,6,014,419, 6,018,422, 6,018,680, 6,055,899, 6,068,684, 6,075,840,6,084,626, 6,088,102, 6,124,663, 6,133,670, 6,134,294, 6,149,160,6,152,181, 6,155,634, 6,175,615, 6,185,278, 6,188,743, 6,197,180,6,210,644, 6,219,015, 6,226,120, 6,226,120, 6,242,163, 6,245,487,6,245,849, 6,250,070, 6,252,938, 6,261,066, 6,276,313, 6,280,090,6,299,300, 6,307,815, 6,310,419, 6,314,887, 6,318,069, 6,318,849,6,324,748, 6,328,903, 6,333,584, 6,333,584, 6,336,318, 6,338,199,6,338,249, 6,340,222, 6,344,392, 6,346,030, 6,350,983, 6,360,424,6,363,712, 6,363,843, 6,367,911, 6,373,158, 6,375,871, 6,381,846,6,382,588, 6,386,015, 6,387,713, 6,392,187, 6,392,313, 6,392,524,6,393,685, 6,396,677, 6,397,677, 6,397,793, 6,398,490, 6,404,942,6,408,884, 6,409,072, 6,410,213, 6,415,860, 6,416,168, 6,433,657,6,440,284, 6,445,840, 6,447,727, 6,450,047, 6,453,083, 6,454,945,6,458,263, 6,462,858, 6,467,138, 6,468,039, 6,471,471, and/or 6,480,320,each of which are incorporated by reference herein in their entirety toits fullest enabling extent permitted by law.

Microvalves can be enabling components of many microfluidic systems thatcan be used in many industry segments. Microvalves are generallyclassified as passive or active valves, but can share similar flowcharacteristics through varied orifice geometries. Diaphragm microvalvescan be useful in many fluidic applications. FIG. 48A is a top view of anarray 48010 of generic microdevices 48000. FIG. 48B is a cross sectionof a particular microdevice 48000 in this instance a diaphragmmicrovalve, taken along section lines 48-48 of FIG. 48A, the microvalveincluding diaphragm 48010 and valve seat 48020, as shown in the openposition. FIG. 49 is a cross section of the diaphragm microvalve 48000,again taken along section lines 48-48 of FIG. 48A, the microvalve in theclosed position.

The flow rate through diaphragm microvalve 48000 can be controlled viathe geometric design of the valve seat, which is often referred to asgap resistance. The physical characteristics of the valve seat, incombination with the diaphragm, can affect flow characteristics such asfluid pressure drop, inlet and outlet pressure, flow rate, and/or valveleakage. For example, the length, width, and/or height of the valve seatcan be proportional to the pressure drop across the microvalve'sdiaphragm. Additionally, physical characteristics of the diaphragm caninfluence performance parameters such as fluid flow rate, which canincrease significantly with a decrease in the Young's modulus of thediaphragm material. Valve leakage also can become optimized with adecrease in the Young's modulus of the diaphragm, which can enablehigher deflection forces, further optimizing the valve's overallperformance and/or lifetime.

Typical microvalve features and specifications can include a valve seat:The valve seat, which is sometimes referred to as the valve chamber, canbe defined by its size and the material from which it is made. Using anexemplary embodiment of a method, the dimensions of the chamber can beas small as about 10 microns by about 10 microns if square, about 10microns in diameter if round, etc., with a depth in the range of about 5microns to millimeters or greater. Thus, aspect ratios of 50, 100, or200:1 can be achieved. The inner walls of the chamber can haveadditional micro features and/or surfaces which can influence variousparameters, such as flow resistance, Reynolds number, mixing capability,heat exchange fouling factor, thermal and/or electrical conductivity,etc.

The chamber material can be selected for application specific uses. Asexamples, a ceramic material can be used for high temperature gas flow,or a chemical resistant polymer can be used for chemical uses, and/or abio-compatible polymer can be used for biological uses, to name a few.Valve chambers can be arrayed over an area to create multi-valveconfigurations. Each valve chamber can have complex inlet and outletchannels and/or ports to further optimize functionality and/or provideadditional functionality.

Typical microvalve features and specifications can also include adiaphragm: The diaphragm can be defined by its size, shape, thickness,durometer (Young's modulus), and/or the material from which it is made.Using an exemplary embodiment of a method, the dimensions of thediaphragm can be as small as about 25 microns by about 25 microns ifsquare, about 25 microns in diameter if round, etc., with thickness ofabout 1 micron or greater. The surface of one side or both sides of thediaphragm could have micro features and/or surfaces to influencespecific parameters, such as diaphragm deflection and/or flowcharacteristics. The diaphragm can be fabricated as a free form devicethat is attached to the valve in a secondary operation, and/or attachedto a substrate. Diaphragms can be arrayed to accurately align to amatching array of valve chambers.

Potential performance parameters can include valve seat and diaphragmmaterial, diaphragm deflection distance, inlet pressure, flow, and/orlifetime.

Micropumps

FIGS. 50 and 51 are cross-sectional views of a particular micro-device48000, in this case a typical simplified micropump, taken along sectionlines 48-48 of FIG. 48A. Micropumps can be an enabling component of manymicrofluidic systems that can be used in many industry segments.Reciprocating diaphragm pumps are a common pump type used inmicro-fluidic systems. Micropump 50000 includes two microvalves 50010and 50020, a pump cavity 50030, valve diaphragms 50040 and 50050, andactuator diaphragm 50060.

At the initial state of pump 50000, the actuation is off, both inlet andoutlet valves 50010 and 50020 are closed, and there is no fluid flowthrough pump 50000. Once actuator diaphragm 50060 is moved upwards, thecavity volume will be expanded causing the inside pressure to decrease,which opens inlet valve 50010 and allows the fluid to flow into and fillpump cavity 50030, as seen in FIG. 50. Then actuator diaphragm 50060moves downward, shrinking pump cavity 50030, which increases thepressure inside cavity 50030. This pressure opens outlet valve 50020 andthe fluid flows out of the pump cavity 50030 as seen in FIG. 51. Byrepeating the above steps, continuous fluid flow can be achieved. Theactuator diaphragm can be driven using any of various drives, includingpneumatic, hydraulic, mechanical, magnetic, electrical, and/orpiezoelectrical, etc. drives.

Typical microvalve features and specifications can include any of thefollowing, each of which are similar to those features andspecifications described herein under Microvalves:

-   -   Valve seats    -   Valve actuators (diaphragm)    -   Cavity chamber    -   Actuator diaphragm

Potential performance parameters can include valve seat, chambermaterial, actuator diaphragm material, valve diaphragm material,deflection distance for actuator, deflection distance for valvediaphragms, inlet pressure, outlet pressure, chamber capacity, flowrate, actuator drive characteristics (pulse width, frequency, and/orpower consumption, etc.), and/or lifetime.

Microwells and Microwell Arrays

Microwells can be an enabling component in many devices used formicro-electronics, micro-mechanics, micro-optics, and/or micro-fluidicsystems. Precise arrays of micro-wells, potentially having hundreds tothousands of wells, can further advance functionality and processcapabilities. Microwell technology can be applied to DNA micro-arrays,protein micro-arrays, drug delivery chips, microwell detectors, gasproportional counters, and/or arterial stents, etc. Fields of use caninclude drug discovery, genetics, proteomics, medical devices, x-raycrystallography, medical imaging, and/or bio-detection, to name a few.

For example, using exemplary embodiments, microwells can be engineeredin the third (Z) dimension to produce complex undercuts, pockets, and/orsub-cavities. Wells can also be arrayed over various size areas asredundant or non-redundant arrays. These features can include thedimensional accuracies and/or tolerances described earlier. Also, arange of surface treatments within the well structure are possible thatcan enhance the functionality of the well.

Examples of Microwell Applications

DNA Microarrays: Scientists can rely on DNA microarrays for severalpurposes, including 1) to determine gene identification, presence,and/or sequence in genotype applications by comparing the DNA on a chip;2) to assess expression and/or activity level of genes; and/or 3) tomeasure levels of proteins in protein based arrays, which can be similarto DNA arrays.

DNA microarrays can track tens of thousands of reactions in parallel ona single chip or array. Such tracking is possible because each probe (agene or shorter sequence of code) can be deposited in an assignedposition within the cell array. A DNA solution, representing a DNAsample that has been chopped into constituent sequences of code, can bepoured over the entire array (DNA or RNA). If any sequence of the samplematches a sequence of any probe, the two will bind, and non-bindingsequences can be washed away. Because each sequence in the sample oreach probe can be tagged or labeled with a fluorescent, any boundsequences will remain in the cell array and can be detected by ascanner. Once an array has been scanned, a computer program can convertthe raw data into a color-coded readout.

Protein Microarrays: The design of a protein array is similar to that ofa DNA chip. Hundreds to thousand of fluorescently labeled proteins canbe placed in specific wells on a chip. The proteins can be deposited onthe array via a pin or array of pins that are designed to draw fluidicmaterial from a well and deposit it on the inside of the well of thearray. The position and configuration of the cells on the array, thepins, and the wells are located with the accuracy needed to usehigh-speed pick-and-place robotics to move and align the chip over thefluidic wells. A blood sample is applied to the loaded array and scannedfor bio-fluorescent reactions using a scanner.

Certain embodiments of the invention enable DNA or Protein microarrayshaving a potentially large number of complex 3-dimensional wells to befabricated using any of a range of materials. For example, structurescan be fabricated that combine two or more types of material in amicrowell or array. Additional functionality and enhancements can bedesigned into a chip having an array of microwells. Wells can beproduced having cavities capable of capturing accurate amounts of fluidsand/or high surface-to-volume ratios. Entrance and/or exitconfigurations can enhance fluid deposition and/or provide visualenhancements to scanners when detecting fluorescence reactions. Veryprecise well locations can enable the use of pick and place roboticswhen translating chips over arrays of fluidic wells. Certain embodimentsof the invention can include highly engineered pins and/or pin arraysthat can be accurately co-aligned to well arrays on chips and/or canhave features capable of efficiently capturing and/or depositing fluidsin the wells.

Arterial Stents: Stents are small slotted cylindrical metal tubes thatcan be implanted by surgeons to prevent arterial walls from collapsingafter surgery. Typical stents have diameters in the 2 to 4 millimeterrange so as to fit inside an artery. After insertion of a stent, a largenumber of patients experience restenosis—a narrowing of theartery—because of the build-up of excess cells around the stent as partof the healing process. To minimize restenosis, techniques are emerginginvolving the use of radioactive elements or controlled-releasechemicals that can be contained within the inner or outer walls of thestent.

Certain embodiments of the invention can provide complex 3-dimensionalfeatures that can be designed and fabricated into the inside, outside,and/or through surfaces of tubing or other generally cylindrical and/orcontoured surfaces. Examples 4 and 5 teach such a fabrication techniquefor a 3 mm tube. Certain embodiments of the invention can allow themanufacture of complex 2-dimensional and/or 3-dimensional featuresthrough the wall of a stent. Micro surfaces and features can also beincorporated into the stent design. For example, microwells could beused to contain pharmaceutical materials. The wells could be arrayed inredundant configurations or otherwise. The stent features do not have tobe machined into the stent surface one at a time, but can be appliedessentially simultaneously. From a quality control perspective, featuresformed individually typically must be 100% inspected, whereas featuresproduced in a batch typically do not. Furthermore, a variety ofapplication specific materials (e.g., radio-opaque, biocompatible,biosorbable, biodissolvable, shape-memory) can be employed.

Microwell Detectors: Microwells and microwell arrays can be used in gasproportional counters of various kinds, such as for example, in x-raycrystallography, in certain astrophysical applications, and/or inmedical imaging. One form of microwell detector consists of acylindrical hole formed in a dielectric material and having a cathodesurrounding the top opening and anode at the bottom of the well. Otherforms can employ a point or pin anode centered in the well. Themicrowell detector can be filled with a gas such as Xenon and a voltagecan be applied between the cathode and anode to create a relativelystrong electric field. Because of the electric field, each x-raystriking an atom of the gas can initiate a chain reaction resulting inan “avalanche” of hundreds or thousands of electrons, thereby producinga signal that can be detected. This is known as a gas electronmultiplier. Individual microwell detectors may be used to detect thepresence and energy level of x-rays, and if arrays of microwelldetectors are employed, an image of the x-ray source can be formed. Sucharrays can be configured as 2-dimensional and/or 3-dimensional arrays.

Certain embodiments of the invention can enable arrays of complex3-dimensional wells to be fabricated and bonded or coupled to otherstructures such as a cathode material and anode material. It is alsopossible to alter the surface condition of the vertical walls of thewells, which can enhance the laminar flow of electrons in the well. Anumber of possible materials can be used to best meet the needs of aparticular application, enhancing parameters such as conductivity,die-electrical constant, and/or density. Certain embodiments of theinvention can further enable the hybridizing of micro-electronics to awell array, in particular because of accurate co-alignment between themicro-electronic feature(s), and/or the structural elements of the well.

Typical Microwell Features, Specifications and Potential PerformanceParameters:

FIG. 52 is a top view of an exemplary microwell array 52000, showingmicrowells 52010, and the X- and Y-axes. Array 52000 is shown asrectangle, but could be produced as a square, circle, or any othershape. Either of the array's dimensions as measured along the X- orY-axes can range from 20 microns to 90 centimeters. Microwells 52010 areshown having circular perimeters, but could also be squares, rectangles,or any other shape. Array 52000 is shown having a redundant array ofwells 52010, but could be produced to have non-redundant wells. Thepositional accuracy of wells 52010 can be accurate to the specificationsdescribed herein for producing lithographic masks. Wells can range insize from 0.5 microns to millimeters, with cross-sectionalconfigurations as described herein.

Using certain embodiments of a method, certain materials can be used toproduce microwell arrays for specific uses. For example, a ceramicmaterial can be used for high-temperature gas flow, a chemical resistantpolymer can be used for chemical uses, and/or a bio-compatible polymercan be used for biological uses, to name a few. Specialty compositematerials can enhance application specific functionality by beingconductive, magnetic, flexible, hydrophilic, hydrophobic, piezoelectric,to name a few.

Using an embodiment of a method, microwells with certain 3-dimensionalcross-sectional shapes can be produced. FIG. 52 is a top view of anexemplary array 52000 of microwells 52010.

FIG. 53 is a cross-sectional view, taken at section lines 52-52 of FIG.52, of an exemplary microwell 53000 having an entrance 53010. Entrance53010 is shown having a tapered angle, which could be angled from 0degrees to nearly 180 degrees. Entrance 53010 is also shown having adifferent surface than well area 53020. Well area 53020 can be square,round, rectangular, or any other shape. Well area 53020 can range insize from 0.5 microns to millimeters in width and can be dimensionallycontrolled in the Z-axis to have aspect ratios of from about 50:1 toabout 100:1. As shown in FIG. 53, microwell 53000 defines microwellsurfaces 53050, 53060, 53070, 53080, 53090, 53100, 53110. As also shownin FIG. 53, a cross-sectional surface 53030 is defined that intersectsmicrowell surfaces 53050, 53060, 53070, 53080, 53090, 53100, 53110. Asfurther shown in FIG. 53, a central area and/or layer-less volume 53040of cross-sectional surface 53030 comprises a majority of cross-sectionalsurface 53030, yet does not include any of microwell surfaces 53050,53060, 53070, 53080, 53090, 53100, 53110, which define a periphery 53120of central area and/or layer-less volume 53040 of microwell 53000.

FIG. 54 is a cross-sectional view, taken at section lines 52-52 of FIG.52, of an alternative exemplary microwell 54000 that defines an entrance54010, a well 54020, and an exit 54030. Microwell 54000 can be used inapplications that require fluids that are conveyed from below or abovethe entrance 54010 and/or exit 54030, and deposited in well 54020. Usingan embodiment of a method, microwell 54000 can be produced so that well54020 is hydrophilic and entrance 54010 and exit 54030 are hydrophobicto, for example, enable the deposition of fluid into well 54020, anddiscourage the fluid deposition, retention, and/or accumulation onentrance 54010, on exit 54030, and/or on the chip's surface. For useswhere microelectronic controls or chips are employed, the materialsurrounding and/or defining entrance 54010 and/or 54030 can beconductive or non-conductive, as required. Well 54020 can be dimensionedto accurately contain a pre-determined amount of fluid.

The shape and size of corner feature 54040 can be defined to encouragethe discharge of a fluid material from a fluidic channel on a pin, whena pin is produced using any of certain embodiments of the invention. Forexample, pins can be produced having fluidic channels or undercuts thatare positioned radially at the end of the pin. The undercuts can serveas reservoirs that increase surface area-to-volume ratios and/or holdaccurate amounts of fluids. If the undercuts are designed to berelatively flexible and larger than the opening dimension at feature54040, fluid can be squeezed from the reservoir as the fluid passes bycorner feature 54040. Entrance 54010 can have an angle that promotes thevisibility of a material, such as a fluid, in well 54020. The materialsurrounding and/or defining well 54020 can be fabricated to havemicro-surface features to increase the well's surface area-to-volumeratio.

FIG. 55 is a top view of an exemplary microwell 55000 showing a wellarea 55010 and sub-cavities 55020. FIG. 56 is a cross-sectional view,taken at section lines 56-56 of FIG. 55, of microwell 55000 showing well55010 and sub-cavities 55020. Well 55010 can extend through the materialthat defines it, as shown in FIG. 56, or can be a closed well having asolid floor. Sub-cavities 55020 can be incorporated within a well to,for example, increase an area of the surface(s) bordering the well, avolume, and/or surface area-to-volume ratio of the well. Sub-cavities55020 can be continuous rings as shown in FIG. 55. Alternatively,sub-cavities 55020 can be discrete pockets forming sub-wells within well55010. Sub-cavities 55020 can be positioned on a horizontal floor orsubfloor of well 55010 as shown in FIG. 55, on the vertical walls ofwell 55010, and/or on another surface. Sub-cavities 55020 can havecircular, square, rectangular, and/or any of a variety of othercross-sectional shapes. Sub-cavities 55020 can also be positioned toprovide an enhanced visual perspective of a deposited material fromwhich could be angled from 0 degrees to nearly 180 degrees, such as anapproximately perpendicular angle, so as to enhance scanning performanceor resolution.

Filtration

Filtration can be an important element in many industries includingmedical products, food and beverage, pharmaceutical and biological,dairy, waste water treatment, chemical processing, textile, and/or watertreatment, to name a few. Filters are generally classified in terms ofthe particle size that they can separate. Micro-filtration generallyrefers to separation of particles in the range of approximately 0.01microns through 20 microns. Separation of larger particles thanapproximately 10-20 microns is typically referred to as particleseparation. There are two common forms of filtration, cross-flow anddead-end. In cross-flow separation, a fluid stream runs parallel to amembrane of a filter while in dead-end separation, the filter isperpendicular to the fluid flow. There are a very large number ofdifferent shapes, sizes, and materials used for filtration depending onthe particular application.

Certain embodiments of the invention can be filters suitable formicro-filtration and/or particle filtration applications. Certainembodiments of the invention allow fabrication of complex 2-dimensionaland/or 3-dimensional filters offering redundant or non-redundant poresize, shape, and/or configuration. For example, a circular filter canhave an array of redundant generally circular through-features, eachthrough-feature having a diameter slightly smaller than a targetparticle size. Moreover, the through-feature can have a tapered,countersunk, and/or undercut entrance, thereby better trapping anytarget particle that encounters the through-feature. Further, thecylindrical walls defined by the through-feature can have channelsdefined therein that are designed to allow a continued and/orpredetermined amount of fluid flow around a particle once the particleencounters the through-feature. The fluid flow around the particle cancreate eddys vortices, and/or other flow patterns that better trap theparticle against the filter.

Certain embodiments of the filter can have features that allow thecapture of particles of various sizes at various levels of the filter.For example, an outer layer of the filter can capture larger particles,a middle layer can capture mid-sized particles, and a final layer cancapture smaller particles. There are numerous techniques foraccomplishing such particle segregation, including providingthrough-features having tapered, stepped, and/or diminishingcross-sectional areas.

In certain embodiments, the filter can include means for detecting apressure drop across the filter, and/or across any particular area,layer, and/or level of the filter. For example, in a filter designed tofilter a gas such as air, micro pitot tubes can be fabricated into eachlayer of the filter (or into selected layers of the filter). Suchpressure measurement devices can be used to determine the pressure dropacross each layer, to detect the level of “clogging” of that layer,and/or to determine what size and/or concentration of particles areentrapped in the filter.

Further, certain embodiments of the invention allow for fabrication offilters in a wide range of materials including metals, polymers,plastics, ceramics, and/or composites thereof. In biomedicalapplications, for instance, a biocompatible material can be used thatwill allow filtration of blood or other body fluids. Using certainembodiments of the invention, filtration schemes can be engineered asplanar or non-planar configurations.

Sorting

Sorting can be considered a special type of filtration in whichparticles, solids, and/or solids are separated by size. In biomedicalapplications for example, it may be desirable to sort blood or othertypes of cells by size and deliver different sizes to differentlocations. Certain embodiments of the invention can enable thefabrication of complex 3-dimensional structures that allow cells to besorted by size (potentially in a manner similar to that discussed hereinfor filters) and/or for cells of different sizes to be delivered throughdifferent size micro-channels or between complex 3-dimensionalstructures. Structures can be material specific and on planar ornon-planar surfaces.

Membranes

Membranes can offer filtration via pore sizes ranging from nanometers toa few microns in size. Membrane filtration can be used for particles inthe ionic and molecular range, such as for reverse osmosis processes todesalinate water. Membranes are generally fabricated of polymers,metals, or ceramics. Micro-filtration membranes can be divided into twobroad types based on their pore structure. Membranes havingcapillary-type pores are called screen membranes, and those havingso-called tortuous-type pores are called depth membranes.

Screen membranes can have nearly perfectly round pores that can bedispersed randomly over the outer surface of the membrane. Screenmembranes are generally fabricated using a nuclear track and etchprocess. Depth membranes offer a relatively rough surface where thereappear to be openings larger than the rated size pore, however, thefluid must follow a random tortuous path deeper into the membrane toachieve their pore-size rating. Depth membranes can be fabricated ofsilver, various cellulosic compounds, nylon, and/or polymeric compounds.

Certain embodiments of the invention enable fabrication of membraneshaving complex 3-dimensional shapes, sizes, and/or configurations madeof polymers, plastics, metals, and/or ceramics, etc. Furthermore, suchmembranes can embody redundant or non-redundant pores, and can befabricated to be flexible, rigid, and/or non-planar depending upon thematerial and/or application requirements.

Heaters

Certain exemplary embodiments can provide heaters and/or componentsthereof, potentially having high resolution and/or high aspect ratios.For example, an exemplary embodiment can provide a resistive heaterhaving numerous wire, strip, and/or coil, etc. elements havingsubstantially large length and/or width dimensions with respect to theirthickness dimensions. Certain exemplary embodiments can provide heatersthat utilize a Seebeck effect for heating.

Heat Exchangers

Certain exemplary embodiments can provide heat exchangers and/orcomponents thereof, potentially having high resolution and/or highaspect ratios. For example, an exemplary embodiment can provide a heatexchanger having numerous “fins” or other surfaces having substantiallylarge length and/or width dimensions with respect to their thicknessdimensions, thereby providing relatively large surface area to volumeratios to facilitate heat transfer. Such heat exchangers can be used forheating and/or cooling of a target fluid and/or material. Also,exemplary embodiments can provide thin-walled tubular heat exchangers,having tubes that potentially incorporate “fins” and/or other heattransfer surfaces. Exemplary embodiments of fins and the like can havesecondary features that can be useful for further increasing surfacearea, manipulating and/or optimizing flow, controlling fouling, etc.Certain exemplary embodiments can provide heat exchangers that utilize aPeltier, Seebeck, and/or Joule effect for cooling and/or heating.

Mass Exchangers

Certain exemplary embodiments can provide mass exchangers and/orcomponents thereof, potentially having high resolution and/or highaspect ratios. For example, an exemplary embodiment can provide a massexchanger having numerous “fins” or other surfaces capable of releasingan impregnated and/or bound material, and/or having receptors forreceiving a target material. Each such fin can have substantially largelength and/or width dimensions with respect to their thicknessdimensions, thereby providing relatively large surface area to volumeratios to facilitate mass transfer. Another exemplary embodiment canprovide a mass exchanger, such as pieces of packing, each havingnumerous surfaces and having a large surface area to volume ratio.Another exemplary embodiment can provide a mass exchanger, such as astatic mixer having numerous fluid dividing/mixing surfaces. Exemplaryembodiments of fins and the like can have secondary features that can beuseful for further increasing surface area, manipulating and/oroptimizing mass transfer, etc.

Surface Reactors

Certain exemplary embodiments can provide surface reactors and/orcomponents thereof, potentially having high resolution and/or highaspect ratios. For example, an exemplary embodiment can provide asurface reactor having numerous “fins” or other surfaces comprisingand/or bound to a material capable of reacting with a target material,and/or catalyzing such a reaction. Each such fin can have substantiallylarge length and/or width dimensions with respect to their thicknessdimensions, thereby providing relatively large surface area to volumeratios to facilitate higher reaction rates. Exemplary embodiments offins and the like can have secondary features that can be useful forfurther increasing surface area, manipulating and/or optimizing reactionrates, controlling heating, cooling, mixing, and/or flow, etc.

Fuel Cells

Certain exemplary embodiments can provide a fuel cell having one or morediscrete and/or integrated components such as a channel, manifold,separator, pump, valve, filter, heater, cooler, heat exchanger, massexchanger, and/or surface reactor, etc., of any size and/orconfiguration. Such a fuel cell can be useful as a power cell, battery,charger, etc. For example, an embodiment of the invention can provide afuel cell having a solid electrolyte disposed between an oxygenelectrode and a fuel electrode, and one or more separators can contactthe surface of one of the electrodes opposite of the electrolyte. Atleast one electrode of the cell can define a micro-channel pattern,wherein the micro-channel cross-section can be varied, such thatreactant gas flowing through the micro channels can achieve tailoredlocal flow, pressure, and/or velocity distributions. An exemplaryembodiment of the invention can provide a proton exchange diffusionmembrane fuel cell having a membrane and/or channels. An exemplaryembodiment of the invention can provide a fluid fuel cell, such as ahydrogen fuel cell, proton exchange member, and/or a direct methanolfuel cell, utilizing one or more fluid mixers, mixing chambers, pumps,and/or recirculators.

Turbomachinery and Machinery

Certain exemplary embodiments can provide turbomachinery devices and/orcomponents thereof, potentially having high resolution and/or highaspect ratios. For example, an exemplary embodiment can provide amicroturbine having an impeller, rotor, blades, stages, seals, and/ornozzles, etc., any of which can high a high aspect ratio be formed froma material having a high strength, and/or be formed from a materialhaving desired thermal performance capabilities, such as a ceramic. Themicroturbine can that can be coupled to a microgenerator for generatingelectrical power and/or can be used for generating thrust. Anotherexemplary embodiment can provide a microcombustion engine having freepistons magnetically coupled to electromagnets for control and powertransfer.

Ion Beam Technologies

Certain exemplary embodiments can provide ion beam devices and/orcomponents thereof, potentially having high resolution and/or highaspect ratios. For example, space propulsion, surface cleaning, ionimplantation, and high energy accelerators use two or three closelyspaced multiple-aperture electrodes to extractions from a source andeject them in a collimated beam. The electrodes are called “grids”because they are perforated with a large number of small holes in aregular array. A series of grids constitute an “ion optics”electrostatic ion accelerator and focusing system.

Ion Thrusters

On-board propulsion systems can be used to realize a variety ofspacecraft maneuvers. In satellites, for example, these maneuversinclude the processes of orbit raising (e.g., raising from a low Earthorbit to a geostationary orbit), stationkeeping (e.g., correcting theinclination, drift and eccentricity of a satellite's orbit) and attitudecontrol (e.g., correcting attitude errors about a satellite's roll,pitch and yaw axes).

Certain exemplary embodiments can provide propulsion and/ormicropropulsion devices and/or components potentially having highresolution and/or high aspect ratios. For example, an exemplaryembodiment can provide an ion thruster, microthruster, Kaufman-type ionengine, and/or electric rocket engine that can be useful for maintainingthe orbit and/or relative position of a geosynchronous satellite. Such adevice can utilize an orifice, orifice array, and/or grid. In certainembodiments, an ion thruster grid can have a spherically-formed and/ordomed screen pattern with, for example, a high resolution and/or highaspect ratio.

Ion beam sources designed for spacecraft propulsion, that is, ionthrusters, typically are preferred to have long lifetimes (10,000 hoursor more), be efficient, and be lightweight. Ion thrusters have beensuccessfully tested in space, and show promise for significant savingsin propellant because of their high specific impulse (an order ofmagnitude higher than that of chemical rocket engines). They have yet toachieve any significant space use, however, because of lifetimelimitations resulting from grid erosion and performance constraintsresulting from thermal-mechanical design considerations, particularlythe spacing of metallic grids, including molybdenum.

In an ion thruster, a plasma is created and confined within the body ofthe thruster. Ions from the plasma are electrostatically acceleratedrearwardly by an ion-optics system. The reaction with the spacecraftdrives it forwardly, in the opposite direction. The force produced bythe ion thruster is relatively small. The ion thruster is thereforeoperated for a relatively long period of time to impart the requiredmomentum to the heavy spacecraft. For some missions the ion thrustermust be operable and reliable for thousands of hours of operation, andwith multiple starts and stops.

The ion-optics system can include grids to which appropriate voltagesare applied in order to accelerate the ions rearwardly. In a typicalelectron bombardment ion thruster, a cathode produces electrons thatstrike neutral gas atoms introduced through a propellant feed line. Theelectrons ionize the gas propellant and produce a diffuse plasma. In aradio frequency ion thruster, the propellant is ionizedelectromagnetically by an external coil, and there is no cathode. Inboth cases, an anode associated with the plasma raises its positivepotential. To maintain the positive potential of the anode, a powersupply pumps to ground potential some of the electrons that the anodecollects from the plasma. These electrons are ejected into space by aneutralizer to neutralize the ion beam. Magnets act to inhibit electronsand ions from leaving the plasma. Ions drift toward the ion optics, andenter the holes in a screen grid. A voltage difference between thescreen grid and an accelerator grid accelerates the ions, therebycreating thrust. The screen grid is at the plasma potential, and theaccelerator grid is held at a negative potential to prevent downstreamelectrons from entering the thruster. Optionally, the optics can includea decelerator grid located slightly downstream of the accelerator gridand held at ground potential or at a lesser negative potential than theaccelerator grid to improve beam focusing and reduce ion impingement onthe negative accelerator grid.

The grids can be in a facing orientation to each other, spaced apart byrelatively small clearances such as about 0.035 inches at roomtemperature. The grids can include aligned apertures therethrough. Someof the ions accelerated by the applied voltages can pass through theapertures, providing the propulsion. Others of the ions can impact thegrids, heating them and etching away material from the grids by physicalsputtering. The heating and electrostatic forces on the grids cancombine to cause substantial mechanical forces at elevated temperatureon the grids, which can distort the grids unevenly. The unevendistortion of the grids can cause adjacent grids to physically approacheach other, rendering them less efficient and prone to shorting againsteach other. These effects can be taken into account in the design of thegrids and the operation of the ion thruster, so that the thruster canremain functional for the required extended lifetimes. However,limitations may be placed on the operation of the ion thruster becauseof grid distortion, such as a relatively slow ramp-up in power duringstartup and operation, so that the adjacent grids do not expand sodifferently that they come into contact.

A factor that can affect the efficiency and/or the weight of ionthrusters is how closely and precisely the grids can be positioned whilemaintaining relative uniformity in the grid-to-grid spacing at highoperating temperatures or in conditions where the spatial temperature isnonuniform and thermal distortion can occur because of temperaturegradients.

Grids are frequently made of molybdenum formed into a domed shape. Themolybdenum can resist material removal by physical sputtering. The domedshape can establish the direction of change due to thermal expansionand/or can aid in preventing a too-close approach of the adjacent gridsas a result of differences in temperatures of the adjacent grids.

Exemplary embodiments of ion thruster grids, such as those formedaccording to an exemplary embodiment of a method, can be preciselyformed into matching shapes, which can account for deformation that canoccur due to thermal expansion when a thruster heats in operation.Changes in the actual spacing and the uniformity of spacing over thegrid surfaces between the grids can potentially be predicted and/orcontrolled.

Exemplary embodiments of ion thruster grids, such as those formedaccording to an exemplary embodiment of a method, can be formed of anymoldable material, include tungsten, molybdenum, ceramics, graphite,etc.

Exemplary embodiments of ion thruster grids, such as those formedaccording to an exemplary embodiment of a method, can have relativelylong lifetimes, allow for precise alignment and/or spacing betweengrids, and/or allow for precise alignment and/or spacing of gridopenings.

Ion Beam Grids

Ion beams can be used in the production of components in themicro-electronics industry and magnetic thin film devices in the storagemedia industry. Typically, an ion beam, such as an argon ion beam, has alarge area, a high current and an energy of between 100 eV and 2 keV.The beam can be used in a number of ways to modify the surface of asubstrate, for example by sputter deposition, sputter etching, milling,or implantation.

In a typical ion beam source (or ion gun) a plasma is produced byadmitting a gas or vapor to a low pressure discharge chamber containinga heated cathode and an anode which serves to remove electrons from theplasma and to give a surplus of positively charged ions which passthrough a screen grid or grids into a target chamber which is pumped toa lower pressure than the discharge chamber. Ions are formed in thedischarge chamber by electron impact ionization and move within the bodyof the ion gun by random thermal motion. The plasma will thus exhibitpositive plasma potential which is higher than the potential of anysurface with which it comes into contact. Various arrangements of gridscan be used, the potentials of which are individually controlled. In amultigrid system, the first grid encountered by the ions is usuallypositively biased whilst the second grid is negatively biased. A furthergrid may be used to decelerate the ions emerging from the ion source soas to provide a collimated beam of ions having more or less uniformenergy. For ion sputtering a target is placed in the target chamberwhere this can be struck by the beam of ions, usually at an obliqueangle, and the substrate on to which material is to be sputtered isplaced in a position where sputtered material can impinge on it. Whensputter etching, milling or implantation is to be practiced thesubstrate is placed in the path of the ion beam.

Hence, in a typical ion gun an ion arriving at a multiapertureextraction grid assembly first meets a positively biased grid.Associated with the grid is a plasma sheath. Across this sheath isdropped the potential difference between the plasma and the grid. Thisaccelerating potential will attract ions in the sheath region to thefirst grid. Any ion moving through an aperture in this first grid, andentering the space between the first, positively biased grid, and thesecond, negatively biased, grid is strongly accelerated in an intenseelectrical field. As the ion passes through the aperture in the secondgrid and is in flight to the grounded target it is moving through adecelerating field. The ion then arrives at an grounded target with anenergy equal to the potential of the first, positive, grid plus thesheath potential.

Exemplary embodiments of ion beam grids, such as those formed accordingto an exemplary embodiment of a method, can have relatively longlifetimes, allow for precise alignment and/or spacing between grids,and/or allow for precise alignment and/or spacing of grid openings. Suchgrids can be planar and/or non-planar, can have redundant and/ornon-redundant grid openings, can have anisotropic and/or isotropic gridopenings, and/or can be constructed of nearly any moldable material,including composite materials.

Microfluidics

Certain exemplary embodiments can provide fluidic and/or microfluidicdevices and/or components thereof, potentially having high resolutionand/or high aspect ratios. For example, an exemplary embodiment canprovide a pressure regulator and/or controller that utilizes a valve,orifice, and/or nozzle having a high aspect ratio and formed using anembodiment.

Actuators

Certain exemplary embodiments can provide actuators and/or componentsthereof, potentially having high resolution and/or high aspect ratios.For example, an exemplary embodiment can provide a valve actuator havingan electromagnetic, magnetic, piezoelectric, electrostatic, bimetallic,and/or shape memory component formed using an embodiment and having ahigh aspect ratio.

Attenuators

Certain exemplary embodiments can provide attenuators and/or componentsthereof, potentially having high resolution and/or high aspect ratios.For example, an exemplary embodiment can provide an acousticalattenuator having numerous microbaffles for absorbing undesired soundwaves, such as sound waves of a particular frequency range. Such bafflescan be textured, dimensioned, and/or shaped to enhance their performancecapabilities. Likewise, attenuators can be provided for attenuatingflow, electromagnetic radiation (e.g., light, electrical current,x-rays, etc.), etc.

Motion Devices

Certain exemplary embodiments can provide gyroscopes, accelerometers,tilt detectors, etc., and/or components thereof, potentially having highresolution and/or high aspect ratios. Such devices can be useful fornavigation, stabilitization, airbag crash systems, vibration detection,earthquake detection, anti-theft and/or security systems, activesuspensions, automated braking systems, vehicle rollover preventionsystems, headlight leveling systems, seatbelt tensioners, motorcontrollers, pedometers, stereo speakers, computer peripherials, flightsimulators, sports training, robots, machine health monitors, etc. Forexample, an exemplary embodiment can provide an accelerometer having acantilevered inertial mass coupled to at least one electrical element,such as a capacitive sensor that is adapted to generate a signal uponsufficient change in acceleration (movement) of the cantileveredinertial mass. In certain embodiments, the mass and electrical elementcan be substantially co-planar. In certain embodiments, the mass canhave a substantial aspect ratio, and electrical elements can be providedin orthogonal and/or multiple planes, so that changes in orientation,displacement, and/or motion (e.g., linear, curvilinear, and/orrotational velocity, acceleration, jerk, pulse, etc.) in any directioncan be sensed, measured, and/or analyzed.

Mirrors

Certain exemplary embodiments can provide a mirror and/or componentsthereof, potentially having high resolution and/or high aspect ratios.Such a mirror can be a component of an optical device and/or anopto-mechanical device, such as an opto-mechanical switching cell and/ora laser scanner, such as is used in a bar-code scanner or a holographicdata storage system. Exemplary arrays of mirrors can be redundant and/ornon-redundant. Exemplary mirrors can be planar and/or non-planar.Exemplary mirrors can have a reflectivity that varies in any fashion(e.g., linearly, non-linearly, polarly, radially, controllably,periodically, thermally, etc.) across a surface of the mirror.

Grating Light Valves

Grating light valves can resemble small reflectors/diffractors, eachcomprising several structures that resemble ribbon-like beams supportedon each end, which can electrostatically actuated upwards or downwards(typically a fraction of the wavelength of visible light). Theribbon-like structures can be arranged to form an element that variablyreflects or diffracts light, in either a continuous or discrete (on-off)manner. Grating light valves can have utility in optical attenuators,switches, relays, direct-to-plate printers, HDTV monitors, electroniccinema projectors, and/or commercial flight simulator displays.

Exemplary embodiments of grating light valves, such as those formedaccording to an exemplary embodiment of a method, can include redundantand/or non-redundant arrays of reflector and/or diffractor elements.Each such element can be planar and/or non-planar, and can include anactuator, such as those used in optical switching arrays.

Fuses

Certain exemplary embodiments can provide methods for fabricating a fuseand/or components thereof, potentially having a high-resolution and/orhigh-aspect ratio, which can be used for triggering and/or disconnectingthe flow of fluid and/or current. For example, fluid fuse comprising alow melting (fusible) alloy can be useful for triggering and/oractuating a sprinkler head in a fire protection system. As anotherexample, an electrical fuse comprising an electrically fusible alloy canbe useful for disconnecting a current flow to an electronic and/orelectrical device.

Signal Detecting Collimators and Devices

Certain exemplary embodiments can provide methods for fabricating a gridstructure and/or components thereof, potentially having ahigh-resolution and/or high-aspect ratio, which can be used for signaldetection collimators. Such devices can be used in the field ofacoustics to, for example, enhance acoustical signal detection and/oranalysis, by for example, reflecting, dispersing, filtering, and/orabsorbing sound waves. Such devices can be used in the field of imagingto, for example, enhance image contrast and quality by refracting,diffracting, reflecting, dispersing, filtering, and/or absorbingscattered radiation (sometimes referred to as “off-axis” radiationand/or “secondary” radiation). In this context, “radiation” meanselectromagnetic radiation, and can include radio, television, microwave,infrared, visible light, ultraviolet, alpha-rays, beta-rays, gamma rays,and/or x-rays, etc., and can even include high energy particles, ionbeams, etc. Moreover, much of the following discussion regardingradiation is analogous to acoustical energy, vibration, and/or otherforms of energy that have a varying and/or frequency component (e.g., atime-varying component, a spatially-varying component, adimensionally-varying component, etc.).

As an example, certain exemplary embodiments can provide a collimatorhaving optical properties, such as cell walls capable of absorbingcertain wavelengths, that can be used as a notch filter. Other suchcollimators can have certain cells filled with a material that hascertain refractive properties, thereby providing a lens effect withthose cells. Other such collimators can have reflective and/or curvedcell walls thereby serving as a reflector and/or wave guide.

Certain exemplary embodiments can provide a collimator having at leastone curved face, and possibly having both faces curved, such that eachcell is “pointed” in a different direction. In various embodiments, thecurve can be circular, elliptical, curvilinear, cylindrical, and/orspherical, etc., and can be concave and/or convex.

Such collimators can be useful for detecting a direction of a radiationsource with respect to the collimator and/or the imaging machinecomprising the collimator, particularly when the machine also comprisesa pixilated detector array and an image processing capability.

Thus, in certain embodiments, such as those in which the “outer” face ofthe collimator is convex, such collimators can function as a form of“wide-angle lens” for whatever type of radiation the collimator isdesigned to pass. Moreover, by analyzing the time variance of thedetected radiation, such machines can determine changes in direction orintensity of the emitted and/or incoming radiation. Further, byanalyzing the frequency components of the detected radiation, suchmachines can determine, perhaps with a high degree of precision, thenature of the radiation source.

As an example, an imaging machine comprising such a curved collimatorcould be deployed at a location having a relatively wide view of astadium parking lot. The collimator can direct light originating fromany particular location in the view to a corresponding detector element.By virtue of its power, time, and/or frequency analysis capability, suchan imaging machine could detect the source of a bright and rapid flashof infrared and visible light and/or other forms of radiation, such asoccurs when a handgun is fired. The imaging machine could then alertauthorities to the location of the fired handgun, and could trigger avideo camera to turn to and zoom in on the location to capture a visibleimage of the scene, potentially capturing images of the faces ofwitnesses and/or perpetrators, license plate numbers, etc.

As another example, an imaging machine comprising such a curvedcollimator could be deployed at a location having a relatively wide viewof a port, shipping channel, runway, rail yard, border crossing,roadway, warehouse, parking lot, etc. Once deployed, the imaging machinecan detect, for example, gamma radiation, such as emitted from aradioactive source, such as a radioactive medical waste, nuclear fuel,and/or a radiation bomb. Upon detection, the imaging machine could alertauthorities to the approach, movement, and/or specific location of theradioactive source.

As yet another example, an imaging machine comprising a concavecollimator could be deployed at a conveyor and opposite a radiationsource, such as is used for scanning passenger bags in commercialairports, train stations, bus depots, etc. In an environment with manysuch conveyors each having a radiation source, such a collimator canisolate radiation to that coming from its corresponding radiationsource.

Additional Embodiments

Certain exemplary embodiments can provide a manufacturing process thatcan produce, potentially in high volume, complex, net-shape (i.e.,formed to the designed configuration, no secondary finishing operationsneeded), and/or micro-scale (i.e., with two or more orthogonaldimensions measuring in a range of approximately sub-micron toapproximately 25 microns) to meso-scale (i.e., with two or moreorthogonal dimensions measuring in a range of approximately 25 micronsto approximately 100 millimeters) structures, such as from advancedmaterials comprised of, for example, powdered metals, ceramics, and/orpolymers, etc. This process, which is sometimes referred to herein asTomo-Lithographic-Molding (TLM™), can utilize a high-resolution mastertool constructed from lithographically micro-machined layers, preciselyaligned and stack laminated into a monolithic solid. By combiningdissimilarly patterned layers or “toma”, 3D cavities of otherwiseunattainable sophistication and/or precision can be created. Combiningthese disciplines with certain casting and/or forming methods can enablethe production of cost effective, high aspect-ratio devices and/orsystems with features ranging from micro-scale to meso-scale. Thousandsof micro-scale and/or meso-scale features and/or structures in varieddistributions and/or customized geometries can be arrayed upon large(e.g., approximately 1 square foot to approximately 10,000 square metersor larger) planar and/or non-planar, continuous and/or arrayed,surfaces. These surfaces may, in turn, be used as plies in a macro-scale(i.e., with one or more orthogonal dimensions measuring greater than 100millimeters), laminate composite structure for potentially optimizingphysical properties.

Composite Structures Manufacturing Technology

Composite materials are generally defined as a combination of two ormore constituent materials; e.g., reinforcing elements, fillers, andcomposite matrix binders; differing in form or composition on amacro-scale. The constituents can maintain their identities, i.e., theydo not dissolve or merge completely into one another although they canact in unison as a system. Super composites, that is, multi-plycomposite structures wherein each ply is composed of compositematerials, can be constructed by bonding together two or more distinctcomponents, each of which can be made of metal, alloy, nonmetal, and/orcomposite material. Examples of composite structures include: honeycombpanels, clad plate, electrical contacts, sleeve bearings, carbide tippeddrills or lathe tools, and weldments constructed of two or moredifferent alloys. Conventional technology can be limited to materialsthat have uniform microstructures throughout their volume. As describedherein, a Large Area Micro Mechanical System (LAMMS™) can Differ fromConventional Technology in that each predetermined portion (e.g., cubicmillimeter, cubic inch, etc.) of material volume of a LAMMS™ can be of aunique configuration designed specifically for the micro-environment inwhich this particular element is expected to be situated.

Overview of Certain Aspects of Synthetic Multifunctional LaminateComposites

LAMMS™ can have their micro-structure, meso-structure, and/ormacro-structure designed to achieve any of a wide array of materialproperties and/or be tailored to achieve specific functionalities. Thespecific properties of this class of composites can make them attractivefor high-performance, weight sensitive applications. The fabricationmethod for creating LAMMS™ composites can allow new embeddedtechnologies to be incorporated into the materials, potentially furtherenhancing their functionality and/or utility.

Design

The LAMMS™ manufacturing process can begin by use of “CommercialOff-The-Shelf Software” (COTS) Finite Element Analysis (FEA) software tocreate a virtual prototype of the engineering design. The software canmodel one or more environmental factors, such as any potential,expected, and/or substantial stress, strain, force, moment, shear,torsion, inertia, friction, abrasion, corrosion, cavitation, creep,ablation, impact, pressure, temperature, humidity, power, voltage,current, electromagnetic radiation, magnetic flux, etc., includingvariations in and/or cycles of such factors, that the designed object isexpected to bear throughout its entire structure and/or design lifetime.Using this information it then can be possible to calculate, with a highdegree of precision, the expected environmental factors that might actupon of smaller subsections (elements) of the structure. Each of theseelements then can be treated as a discreet object with its associatedset of factors acting upon it—and each element might benefit from adistinct microstructure to bear those local factors. Usually the designof a macrostructure is dictated by the most extreme factor(s) it mustbear. These factors might act only upon small areas of themacrostructure. Because conventional materials have essentiallyhomogenous microstructures, their design can be driven by “the weakestlink.” The LAMMS™ process can make it possible to optimize the materialproperties of each design element, by, for example, providing higherdensity (and stiffness) only where expected to be needed, allowing therest of the structure, where the higher density (and accompanyingweight) is not needed, to be made lighter. The net result can be amacrostructure whose interior volume is a lattice—e.g., a unique arrayof microstructures—of precise design that in aggregate can be capable ofwithstanding the most extreme expected applied factors, but, forexample, can weigh relatively little due to its parsimonious use ofmaterials.

The LAMMS™ approach thus can provide a method to build structures thatcan bear some similarities to what can be observed innature—macro-structures having locally-varying micro-structures.Examples from nature can include the potentially and/or substantiallylocally-varying structures of sea shells, tree trunks, and/or animalbones, etc., such as the wing bones of birds and/or the thigh bone ofmammals, etc. At least some of such natural structures can compriselocally varying material compositions; densities; strengths;flexibilities; porosities; diffusabilities; surface textures; color;opacity; vibration damping; mineral concentrations; muscle, tendon,and/or ligament attachment points; blood and/or other cell productioncapabilities; nerve fiber and/or blood conduit capacities; and/orself-healing abilities; etc.

Fabrication

The LAMMS™ process can be suitable for large scale and/or high volumeproduction operations that are consistent, for example, with thoseemployed for the manufacture of aerostructures, automobiles, trucks, andmaritime vessels and/or components thereof.

Description of Certain Manufacturing Processes Tomo LithographicMolding™

The TLM™ process can be used to create a high-resolution, laminatedmaster tool (mold or die) by means of lithographically derived,micro-machined layers and stack laminations methods. Combining thesedisciplines with the following processes can enable the production ofcost effective LAMMS™ with features in the micro-to-meso scale that canbe arrayed over large scale planar and/or non-planar surfaces.

Continuous Flow Injection Molding

This process can comprise forming a plastic to a desired shape byforcing the heat-softened plastic into a relatively cool cavity underpressure. In the LAMMS process, the material (thick film, engineeredplastic), can be fed from a spool or roll between and through a pair ofrollers whereon a TLM™-derived mold, or set of molds, can be embedded.The configuration of the mold can be determined by the aforementionedFinite Element Analysis.

Hot Embossing

This process can be used to create depressions of a specific pattern ina heated plastic film or sheet, thus raising a design in relief againsta surface. In the LAMMS™ process, the plastic film can be fed from aspool or roll between and through a pair of rollers whereon aTLM™-derived mold, or set of molds, is embedded. The configuration ofthe mold can be determined by the aforementioned Finite ElementAnalysis.

Blanking

This process can comprise punching, cutting, stamping, and/or shearing apiece out of stock to a predetermined shape through cutting dies. In theLAMMS process, the material (a thin metal foil or thick plastic film),can be fed from a spool or roll between and through a pair of rollerswhereon a TLM™-derived cutting die, or set of dies, is embedded. Theconfiguration of the die can be determined by the aforementioned FiniteElement Analysis. The output can be a lattice of beams and/or nodes thatcan be used to join (e.g., in the Z or through-thickness axis) themicrostructures molded or embossed upon mating plies.

Adhesive Bonding

This is a materials joining process in which an adhesive, placed betweenfaying surfaces (adherends) can solidify to produce an adhesive bond. Inthe LAMMS™ process, the blanked ply (d) can be sandwiched between themolded and/or embossed material (plies b & c) and/or cemented in placeby means of an adhesive and/or pressure exerted by another set ofrollers in line with the aforementioned rollers.

Trimming

This process can comprise removing excess material from the part bycutting with a trimmer blade, punch, and/or shoe in a trim press and/orcan be accomplished at elevated and/or ambient temperature. In theLAMMS™ process, the perimeter of the macrostructure (part) cam betrimmed from the body of the laminated composite sheet by means ofTLM™-derived trimming blades embedded in a set of rollers in line withthe aforementioned rollers.

Thermoforming

This process can comprise forming a thermoplastic sheet into athree-dimensional shape after heating it to the point where it is softand flowable, and/or then applying differential pressure to make thesheet conform to the shape of the mold or die positioned below and/orabove the material. Traditionally, there are three basic mold types:female (concave), male (convex), and matched (a combination of the two).In matched-mold thermoforming, the stamping force of the male mold canpush the heated sheet into the female cavity. In the LAMMS™ process, thethree (or more) ply, laminated structure can be thermoformed in a singleoperation.

Materials

The TLM™ process can provide the ability to produce parts in a number ofdifferent materials, thus allowing the best match to the end part andapplication. TLM™ process can be used to fabricate parts using, forexample: 1) powder metals (such as tungsten, copper, and/or gold, etc.),2) powder ceramics (such as alumina and/or zirconia, etc.), and/or 3)polymers (such as silicone rubber, urethanes, and/or epoxies, etc.). TheTLM™ process can also be utilized with combinations of materials (suchas ceramic and metal powder/epoxy composites, etc.).

The LAMMS™ process can be compatible with a wide variety of commerciallyavailable engineering materials such as:

-   -   engineered plastics;    -   metals;    -   ceramics;    -   synthetic composites; and/or    -   adhesives, etc.

Tooling

TLM™ master molds and master dies (master tools) can be made asnegatives and/or positives of the finished part configuration. If themaster is made as a negative, the finished part can be produced directlyfrom the tool. If the master is made as a positive, it might be usefulto create a second-generation (or derived) master. Some productionsituations might benefit from a second (or even a third) generationversion of the master tool. Downstream process parameters and/or controllimits might be primary design factors when contemplating theconfiguration (positive or negative rendition of the finished part) ofthe master tool. If, for example, the finished part is made of aflexible material having good release properties, a rigid master toolmight be used, whereas, if the finished part was very rigid, with poorrelease properties, a second-generation consumable master tool might beused. Masters can be, for example: 1) rigid tools made of metal and/orceramics, etc., 2) flexible tools made of rubber and/or variouspolymers, etc., and/or 3) consumable tools, made of wax and/orconsumable polymers, etc. LAMMS™ master tools can be employable asinserts integral to the rollers described in Section 3. These insertscan be interchangeable. Thus, multiple product configurations can beproduced on the same production line.

Application Examples

FIG. 57 illustrates an exemplary embodiment of a microstructure derivedfrom a finite element analysis (FEA) and formed via an exemplary methoddescribed herein. FIG. 58 is a perspective view of an exemplaryembodiment of opposing interlocking microstructures formed via anexemplary method described herein. More specifically, FIGS. 57-58 showmicrostructures derived from a finite element analysis and extractedfrom a thick film plastic sheet. Note that a mold from which eachmicrostructure is derived can be formed from a plurality oflithographically-derived, micro-machined metallic foil layers (11 suchlayers are shown in FIG. 57), which have been precisely aligned andstack laminated into a monolithic solid.

FIG. 59 is a perspective view of an exemplary embodiment of a latticemicrostructure formed via an exemplary method described herein. Morespecifically, FIG. 59 shows an LAMMS array of microstructures derivedfrom a finite element analysis and extracted from an intermediate thinmetal foil.

FIG. 60 is a perspective view of an exemplary embodiment of a compositemicrostructure formed via an exemplary method described herein. Morespecifically, FIG. 60 shows a combination of the microstructures of FIG.58 and FIG. 59.

FIG. 61 is a flowchart of an exemplary embodiment of a basic sequence ofan exemplary method described herein. More specifically, FIG. 61 is aflowchart of an exemplary manufacturing process for making certainexemplary microstructures and/or LAMMS, such as the microstructures ofFIG. 60.

FIG. 62 is a block diagram of an exemplary embodiment of a basicsequence of an exemplary method described herein. More specifically,FIG. 62 is a schematic of an exemplary manufacturing process for makingcertain exemplary microstructures and/or LAMMS, such as themicrostructures of FIG. 60.

FIG. 63 is a perspective view of an exemplary embodiment of a simplifiedmicrostructure formed via an exemplary method described herein. Morespecifically, FIG. 63 illustrates an exemplary simplified LAMMS showingan array of microstructures such as those shown in FIG. 60, which can beused to form an aeroframe skin panel.

The following examples have been selected to illustrate severalpotential attributes of the LAMMS™ process.

FIG. 64 is a perspective view of an exemplary embodiment of amacro-scale surface comprising a plurality of microstructures, thesurface and microstructures formed via an exemplary method describedherein. More specifically, FIG. 64 (example 1) demonstrates the use ofLAMMS™ to array precisely angled micro-scale features across amacro-scale surface.

FIG. 65 is a photomicrograph of exemplary columnar microstructuresformed via an exemplary method described herein. FIG. 66 is aphotomicrograph of exemplary cast microstructures formed via anexemplary method described herein. More specifically, FIGS. 65 and 66(examples 2 and 3) demonstrate production of more complex 3D features.For demonstration purposes, each example has been produced in asingle-ply configuration using a casting process.

In the first example, a precision TLM™ mold was fabricated having131,589 cylindrical shape cavities arrayed over a 45 centimeter diametersurface. The resulting cavities are 0.950 millimeters in diameter, havea depth of 3.25 millimeters, and are arrayed in staggered rows andcolumns to maximize the pattern density. The pitch frequency of thecavities is 1.00 millimeter.

The arrayed pattern is comprised of four identical quadrants locatedaround a central x, y datum. The cavity located at the center of thearray is perpendicular to the mold surface at an angle of 90 degrees(datum cavity). The remaining cavities in each quadrant of the mold areuniquely angled relative to the mold surface. A cumulative angle of0.01196 degrees was applied to each cavity position within each quadrant(1.00 millimeter pitch) resulting in a focused cavity array with eachcavity pointing precisely at a predetermined focal point. The focalpoint of the array was centered on the datum cavity at a distance of 5meters.

Using a vacuum assisted casting process, a LAMMS™ device was derivedfrom the TLM™ mold using a high strength poly-urethane resin. The castresin part and the TLM™ mold were dimensionally characterized andcompared for accuracy. The measurements were made using an Accugage AG24video metrology system.

FIG. 64 shows an overall view of the micro-structure array and to theright a magnified view (the small divisions on the scale are 1 mm).

This example demonstrates the ability to produce a precisionmicro-structure array over a large area using a TLM™ mold. Each featurein a quadrant of the array has a unique x, y and z orientation, but theindividual structures are somewhat simple and repetitive in terms ofshape. Examples 2 and 3 are presented to show how more complex featureswithin an array can be produced using the LAMMS™ process.

The second example, shown in FIG. 65, was chosen to illustrate amicro-structure array designed to increase the surface area of a singlestructure by a factor of four. The structures are tapered columns withcorrugated ridges forming precise slots in the Z axis. The high-surfacearea columns were derived from a TLM™ mold using a platinum curesilicone rubber. The TLM™ mold was fabricated using photo-chemicallyetched, 75 micron thick copper foils which were precision stacklaminated. The foils were bonded using a high-strength, thermal cureepoxy.

This high-surface area micro-structure has the following dimensionalcharacteristics:

-   -   1020 arrayed 3D micro-columns    -   75×75 millimeter array area    -   54 circular slots on each column    -   75 micron width×215 micron deep slots    -   Column height 8.3 mm

Another example involving complex 3D structures is shown in FIG. 66.This was produced using a TLM™ mold comprised of six photo-chemicallymachined stainless steel layers. Each layer in the mold had a thicknessof 150 microns. The layers were laminated together using a eutecticCuSil™ (copper/silver) metal brazing process. The mold was designed tosurvive high-volume molding using a high-strength, flexible polymercasting resin to form the final part.

FIG. 66 shows a magnified view of the cast 3D structures. Asquare-shaped structure was chosen for this example to furtherdemonstrate the versatility of lithography. Features of these structuresinclude:

-   -   Cast Polymer Micro-Structures    -   Micro-Structure Array=20×60    -   Top and Bottom Surface 870×870 microns    -   Center Surface 1.035×1.035 mm    -   Micro Structure Height 900 microns

FIG. 67 is a photomicrograph of an exemplary 7-layer microstructureformed via an exemplary method described herein. FIG. 68 is aphotomicrograph of an exemplary array of microstructures formed via anexemplary method described herein. FIG. 69 is a photomicrograph of asurface of an exemplary microstructure formed via an exemplary methoddescribed herein.

Note that the layers and/or features of a mold can be reflected in themicrostructure and/or molded part. Although this is at least implied inFIG. 57, this is particularly apparent in FIGS. 65 and 66, each of whichshow a plurality of monolithic microstructures each having protrudingundercuts created by one or more molds from which the microstructure isdescended and/or reflecting protruding undercuts of such a mold(s). Thereflection, impression, and/or artifacts of the mold layers are alsoshown in FIGS. 67, 68, and 69 for various microstructures. The smoothwall of the hexagonal stack and the rectangular stack at the slice markin the foreground of FIG. 68 make apparent the fact that thesemicrostructures are monolithic and/or unitary molded structures. Thatis, FIG. 68 shows that one of the microstructures sliced to reveal asolid, layer-less interior volume having periphery defined by an outersurface, at least one outer surface of each of the microstructurescomprising a plurality of 3-dimensional micro-features thatsubstantially spatially invertedly replicate a mold surface formed by aplurality of layers of a metallic foil stack lamination parent mold.That is, by reflecting and/or invertedly reproducing the surface of theparent mold, the outer surface of each hexagonal column appears tosuggest that the column is a stack of layers. Yet the cut-away viewshows that the column is layer-less in its interior, the column onlyshowing artifacts, such as protruding undercuts, of the layers of theparent mold on the surface of the column.

FIG. 69 illustrates that the surface of an exemplary microstructureformed via an exemplary method described herein can comprise a pluralityof 3-dimensional micro-features that substantially spatially invertedlyreplicate a mold surface formed by a plurality of layers of a metallicfoil stack lamination parent mold. That is, FIG. 69 makes apparent thatthe layers of the mold are reflected at the edges, surfaces, and/orinterfaces (e.g., at the outer edges and within the holes) of thesemicrostructures and/or molded parts.

Potential Fields of Application

a. Transportation Industry

Technology Areas:

-   -   Weight reduction    -   Low inertia for dynamic components    -   Impact resistance    -   Vibration damping    -   Acoustic abatement    -   Electrical insulation    -   Inertial measurement    -   RF technology    -   Communications    -   Active structures and surfaces    -   Hydrodynamics

Representative Devices:

-   -   conformable MEMS (active and passive)    -   micro-satellite components    -   micro combusters    -   micro turbines    -   micro-thrusters    -   RF switches    -   antennas    -   phase shifters    -   displays    -   optical switches    -   accelerometers    -   gyroscopes    -   rate sensors    -   vibration sensors    -   mass sensors    -   pressure sensors    -   temperature sensors    -   viscosity sensors    -   density sensors    -   humidity sensors    -   corrosion sensors    -   capacitive sensors    -   temperature regulators    -   fuel cells    -   fuel processors    -   nozzle technology    -   valves and regulators    -   pumps    -   filters    -   relays    -   actuators    -   heaters        b. Biological and Biotechnology

Technology Areas:

-   -   Micro-fluidics    -   Microbiology    -   DNA Assays    -   Chemical testing    -   Chemical processing    -   Lab-on-a-chip    -   Tissue engineering    -   Analytical instrumentation    -   Bio-filtration    -   Test and measurement    -   Bio-computing    -   Biomedical imaging

Representative Devices:

biosensors

bioelectronic components

reaction wells

microtiterplates

pin arrays

valves

pumps

bio-filters

tissue scaffolding

cell sorting and filtration membranes

c. Medical (diagnostic and therapeutic)

Technology Areas:

-   -   Imaging        -   Computed tomography        -   Angiography        -   Fluoroscopy        -   Radiography        -   Interventional radiography    -   Orthopedic    -   Cardiac and vascular devices    -   Catheter based tools and devices    -   Non-invasive surgical devices        -   Medical tubing    -   Fasteners    -   Surgical cutting tools

Representative Devices:

-   -   airways    -   balloon catheters    -   clips    -   compression bars    -   drainage tubes    -   ear plugs    -   hearing aids    -   electrosurgical hand pieces and tubing    -   feeding devices    -   balloon cuffs    -   wire/fluid coextrusions    -   lumen assemblies    -   infusion sleeves/test chambers    -   introducer tips/flexible sheaths    -   seals/stoppers/valves    -   septums    -   stents    -   shunts    -   membranes    -   electrode arrays    -   ultra-sound transducers    -   infra-red radiation sensors    -   radiopaque targets or markers    -   collimators    -   scatter grids    -   detector arrays        d. Military

Technology Areas:

-   -   Weapon safeing    -   Arming and fusing    -   Miniature analytical instruments    -   Biomedical sensors    -   Inertial measurement    -   Distributed sensing and control    -   Information technology    -   RF devices

Representative Devices:

-   -   MEMS fuse/safe-arm devices    -   ordinance guidance and control devices    -   gyroscopes    -   accelerometers    -   disposable sensors    -   spectrometers    -   active MEMS surfaces (large area)    -   micro-mirror MEMS displays    -   antennas    -   switches    -   phase shifters    -   capacitors    -   resistors    -   conductors    -   inductors    -   exciters    -   transmitters    -   filters    -   receivers    -   voltage regulators    -   power regulators    -   current regulators

In the transportation industry, such as the aerospace industry,exemplary embodiments can comprise multi-layer composite components,such as wings, ailerons, rotors, panels, doors, shrouds, and/orcowlings, etc. For such components, layers underlying the external“skin” can be constructed to optimize the component generally and/or inany specific and/or predetermined layer and/or location(s) within thecomponent for functions, properties, and/or attributes such as materialcomposition; density; weight; strength; impact resistance; stiffness;deflection; fatigue resistance; permeability; diffusion rate; texture;color; opacity; attachment points; cooling; vibration damping; acousticdamping; stealth properties; electromagnetic properties; conductivity;thermal insulation; heat transfer; wire, cable and/or conduit routing;fluid routing; penetration and/or leak detection; and/or environmentalsensing, etc.

The external skin can be optimized generally and/or in locally forfunctions, properties, and/or attributes such as surface finish; impactresistance; hardness; corrosion resistance; reflectance; color; opacity;electrical conductivity; thermal conductivity; permeability; etc.

For example, the ability for helicopters to safely fly or even fly atall can be influenced by damage to the helicopter's rotor. To alert ahelicopter's pilot to such damage during flight, the interior of therotor is typically pressurized with nitrogen and the pressure of thenitrogen monitored, so that substantial penetrations of the rotor's skinresult in a detectable pressure drop. By utilizing the herein describedLAMMS™ technology, numerous orifices, pressure sensors, andcommunications networks can be built into the rotor in selectedlocations such that a more precise location of any substantial leaks canbe determined, thereby allowing the pilot to make a more informeddecision about the severity of the influence of the leak upon thehelicopter's flightworthiness. That is, certain detected leaks might betolerable and of insignificant impact on the ability of the helicopterto continue to fly safely. Other leaks, whether in critical locations orof critical size, can have a significant impact.

Similarly, exterior and/or interior components, such as panels, doors,hoods, fenders, shrouds, and/or cowlings for automobiles, trucks, and/ormarine vessels can utilize the LAMMS™ technology described herein togenerally and/or locally optimize the component for any of the hereindescribed functions, properties, and/or attributes.

For example, for racing yachts and/or other marine vessels, utilizingthe LAMMS™ technology described herein, hulls and/or hull surfaces canbe constructed using a fish-scale type design, the fish scales varyingin locations, dimensions, and/or properties as desired and/or foroptimal hydrodynamic performance.

In another example, the housing of a computer and/or other electronic orelectrical device can utilize the LAMMS™ technology described herein togenerally and/or locally optimize the housing for any of the hereindescribed functions, properties, and/or attributes. For example, thehousing could integrate redundant and/or non-redundant acoustic dampingelements; cooling channels; mechanical vibration damping features;stiffeners; electrical conductors; electromagnetic shielding; etc.

For another example, hook and loop fastener systems can be createdutilizing the herein described LAMMS™ technology for creating redundantand/or non-redundant hooks and/or loops, such as hooks that vary indensity and/or length across a particular dimension of hook material. Aspecific application for such a fastening system is a baby diaper havinga hook and loop closure with a varying pattern of hooks and/or loops.The pattern can be constructed such that the closure is ratherdifficult, particularly for a child, to initiate opening by separatingthe hooks from the loops, but once opening is initiated, completing theopening requires much less pulling force than would be required ifsubstantially uniform hooks and loops were utilized for the closure.Such a pattern can feature a predetermined variable hook and/or loopdensity, and/or hooks of predetermined varying lengths, orientations,stiffness, material composition, etc.

An additional application for the herein described LAMMS™ technology isto create a grinding wheel that is customized to the particular part(e.g., lens, blade, etc.) it is intended to grind. The wheel can havegrinding functions, properties, and/or attributes (e.g., abrasiveness,hardness, density, surface finish, material; etc.) that vary across itsface in correspondence and/or relevance to the grinding needs of thepart with which the wheel will interface.

In another application, a transdermal patch can utilize the hereindescribed LAMMS™ technology to provide multiple functional layers and/orgenerally and/or locally optimized functions, properties, and/orattributes. For example, a particular layer, perhaps in a particularlocation, can encompass a desired pharmaceutical, chemical, radioactive,and/or biological substance that can aid in treatment.

Additional applications can involve the utilization of the hereindescribed LAMMS™ technology for large area and/or pixelated sensors ordetectors. For example, a large area neutron detector can utilizeselectively conductive layers separated by a dielectric material throughwhich an array of gas-filled wells is formed. In another example, theLAMMS™ technology can be used to form a pixelated radiography screen,the screen comprising a plurality of wells each containing a phosphorelement.

Hierarchical Tessellation Structures (Hts)—A New Class of PeriodicCellular Structure Engineering Concept A: Tessellation

Tessellation is the juxtaposition of shapes into a pattern of contiguouspolygons. As shown in FIG. 70, hexagons, rectangles, and isoscelestriangles can be arrayed in three dimensions to create honeycomb,orthogrid, and isogrid structures, respectively. One purpose and/or useof such structures is to increase and/or maximize open volume, which canreduce the overall weight of the structure.

Engineering Concept B: Fractals

Fractals are scalable, self-similar, geometric patterns mathematicallydefined by precise, iterative functions. FIG. 71 illustrates someexemplary embodiments of fractal patterns that can be created viavarious exemplary embodiments described herein. At least some cellswithin any of the aforementioned tessellation structures can subdividedinto smaller, self-similar cells. One purpose of such structures is todecrease and/or minimize open area, which can increase density and/orenhance associated material and/or structural properties.

Combining these two concepts can give rise to a HierarchicalTessellation Structure wherein the geometry, scale, and/or distributionof cells can be manipulated into continuous gradients to improve and/oroptimize the strength-to-weight ratio of a structure, createsubstantially uniform load paths (distribution) within the structure,and/or enable more efficient transfer of loads to adjoining structures.These structures, which can be derived via a method described herein,also can exhibit low part-to-part variation in weight and/or dimensionalaccuracy. By varying the architecture of individual plies within amulti-ply, laminated structure, precisely engineered cavities andpassageways can be created to embed remote sensing systems forstructural health monitoring and/or real-time battle damage assessment.

The geometry, scale, and/or distribution of cells can be determined bymeans of a Finite Element Analysis stress model. The design process cancorrelate cell architecture with the concentrations of stress generated(within the structure) by applied loads, which can enable and moreand/or most parsimonious use of materials. FIG. 72 illustrates anexemplary output of an exemplary finite element analysis, showing areasof higher and lower stress values, and an approximate relative size ofcorresponding structures that can be used to accommodate those stressvalues, with larger structures corresponding to lower stress values andsmaller structures used for accommodating higher stress values. FIG. 73shows a perspective view of an exemplary isogrid structure that can beconstructed based on such an output of a finite element analysis.

Application-specific materials can be combined to achieve desired and/orsuperior performance in such systems as low observable (‘stealth”)structures, ballistic impact resistant structures, and/or high-cyclefatigue resistant structures. Attributes of this technology can include,but are not limited to:

-   -   Design agility;    -   Facilitates carbon fiber panel lay-up by integral membranes        (closed cells) on outer plies;    -   Large area (square meter) capability;    -   Reduction of septa (ligament) volume;    -   Reduction in core density;    -   Isotropic mechanical properties;    -   Increased resistance to rib buckling;    -   Increase mechanical strength of shear planes;    -   Variable rigidity (flexibility); and/or    -   Energy absorbing core structures.

Certain exemplary embodiments can provide large area micro-mechanicalsystems (sometimes referred to herein as “LAMMS”), which can be

-   -   Finite Element Analysis (“FEA”) driven;    -   custom mesostructure per FEA element;    -   variable geometry and distribution;    -   arrays of mm3-scale mesostructures over m2 areas;    -   multi-functional materials; synthetic composites;    -   multi-ply, laminated structures; and/or    -   low weight; high performance.

Certain exemplary embodiments can provide advanced core structures,which can comprise and/or be characterized by: multi-layer lamination;isogrid cell motif; loads-defined cell topography; carbon fiber faceand/or back sheets; large area capability, on the scale of approximately1 to 10 square meters; a density of approximately 19 kg/cubic meter fora cell size of 20 mm; varying cell concentrations in a continuousgradient; parsimonious use of materials; and/or uniform loaddistributions.

Certain exemplary embodiments can provide an isogrid cell motif, whichcan provide and/or be characterized by: an inherent resilience totensile, compressive, shear, and/or bending loads; redundant load paths;resistance to impact, delamination, and/or crack propagation;optimization for a wide range of load intensities, superior strength toweight ratio.

Certain exemplary embodiments can provide an isogrid cell motif, which,from the perspective of and/or to accommodate compressive loads, canprovide and/or be characterized by: a variety of rib and/or ligamentthicknesses; expanded and/or condensed grid patterns; decreased aspectratio; increased numbers of plies; grid patterns that are offset fromone layer to the next; isotropic properties; and/or resistance to ribbuckling.

Certain exemplary embodiments can provide an isogrid cell motif, which,from the perspective of and/or to accommodate shear loads, can provideand/or be characterized by: increased surface area; closed cells on thebond line; increased interface adhesion; textured surfaces; interlockingplies; male and female interlock components; and/or optimizablemechanical strength of shear planes.

Certain exemplary embodiments can provide an advanced multi-functionalarmor system, which, can provide and/or be characterized by: projectileand/or fragment defeat; blast mitigation (Behind Armor Blunt Trauma);multiple strike protection; enhanced mobility; light weight; scalablesystems; low cost; high modulus outer skin; and/or an energy absorbingand/or redirecting core; a polymer matrix core; a ballistic barrierand/or ceramic back face; and/or a spall shielding (e.g., Kevlar) backface.

Certain exemplary embodiments described herein can be used to constructproducts, devices, assemblies, machines, and/or systems, such as thosedescribed herein and/or such as a sporting good, tennis racket, golfclub shaft, fishing rod, hockey stick, backboard, goalpost, bicycleand/or motorcycle frame, fork, handlebar, seatpost, crank arm, wheel,mudflap, equestrian saddle, saddle tree, kayak, paddle, ski, ski pole,skate, skate blade, snowboard, surfboard, skateboard, helmet, guard,paintball equipment, gunstock, ballistic armor, armor, boat and/or shiphull, deck, superstructure, mast, marine equipment, satellite shell,antenna, solar panel, radome, aircraft wing, fuselage, fairing assembly,airframe, elevator, rudder, landing gear, propeller, helicopter airfoil(rotor blade), windmill airfoil (blade), turbine blade, enginecomponent, engine exhaust shroud, exhaust baffle, driveshaft, acousticshroud, acoustic baffle, cockpit sidewall, ceiling panel, doorliner,door panel, hood, fender, bonnet, fairing, bumper, tailgate, spoiler,bed, quarter panel, roof, pillar, floorboard, sidewall, dashboard,instrument panel, headliner, trunk deck, firewall, bulkhead, seat frame,leaf spring, wheel, rail, wall, floor support, flooring, door, windowframe, railing, siding, chassis, frame, conduit, duct, pipe, pressurevessel, tank, equipment, pump, fan, damper, machine tool, robot arm,equipment housing, enclosure, fire resistant enclosure and/or panel,fireproof enclosure and/or panel, computer enclosure, keyboard, display,loud speaker, tripod, engine component, flywheel, footing, structuralcolumn, structural beam, truss, structural wall, divider, impactabsorber, guardrail, signpost, light pole, power pole, structural pole,architectural signage, signage substrate, billboard substrate, tool,handle, footwear, toy, musical instrument, casket, gurney, bed frame,furniture, shelving, cabinetry, countertop, hot tub, tub, showerenclosure, pet crate, packaging, composite part, and/or compositestructure, etc.

Certain exemplary embodiments described herein can be used to constructproducts, devices, assemblies, machines, and/or systems, such as thosetypically constructed using fiberglass reinforced plastic, carbon fiberreinforced plastic, fiber reinforced matrix systems, honeycombedsandwich structures, and/or sandwiched composite structures.

Certain exemplary embodiments can provide a first isogrid defining afirst plurality of zones, each zone from said first plurality of zonescomprising a plurality of ligaments, each zone from said first pluralityof zones defining a plurality of spaces, each space bounded by a firstsub-plurality of ligaments from said plurality of ligaments, each ofsaid ligaments comprising a plurality of ligament surfaces.

Certain exemplary embodiments can provide a system comprising: a firstcast isogrid defining a first plurality of zones, each zone from saidfirst plurality of zones comprising a plurality of cast ligaments, eachzone from said first plurality of zones defining a plurality oftriangular spaces, each triangular space bounded by a firstsub-plurality of cast ligaments from said plurality of cast ligaments,an interlock defined at an intersection of a second sub-plurality ofcast ligaments from said plurality of cast ligaments, each of said castligaments comprising a plurality of ligament surfaces, for each of saidligaments, a ligament surface from said plurality of ligament surfacescomprising a plurality of 3-dimensional micro-features thatsubstantially spatially invertedly replicate a mold surface formed by aplurality of layers of a metallic foil stack lamination parent mold,said plurality of 3-dimensional micro-features comprising at least oneprotruding undercut, said plurality of ligament surfaces for each ofsaid ligaments defining a periphery of a layer-less volume.

Additional Embodiments Exemplary Embodiment #1

Engineering specimens were produced to demonstrate the ability to designand/or fabricate an advanced multi-layer structural composite using TLM™manufacturing. The specimen embodied engineered features including: highstrength ISO grid configuration, controlled corner radii at cellintersection points to eliminate or reduce fracture points, varyingsized interconnected cell configurations, recessed nodes atintersections for sensor embedding or fastening points, and 45 micronbump and cavity arrays on grid ligament (and back plane surface) topromote multi-layer adhesive bonding. Figure # X shows dimensionalspecifications of the specimen.

Specimens were produced using methods described in U.S. patentapplication Ser. No. 10/479,335 and/or herein. Methods for manufacturingthree-dimensional devices and devices created thereby. Specimenmanufacturing methods can include CAD generation, photo-mask generation,metallic foil etching, stack lamination, mold production, and/orcasting. Both open and closed molds were used to produce the specimens.Specimens were produced using a low CTE two part epoxy (Epo-tek 301-2)and a flexible polyeurathane (Resin Lab EP1218). Specimens were alsoproduced by loading the two part epoxy with carbon powder (200 meshobtained from Grupo Rooe, S.A. de c.v. Mexico) prior to casting. Theepoxy was loaded with varying amounts of carbon powder including 20%,30%, and 40% by weight.

Exemplary Embodiment #2

Engineering specimens were produced to demonstrate the ability to designand fabricate an advanced multi-layer structural composite using TLM™manufacturing.

The following design specifications were embodied in the specimen:overall size 20×20 CM, 1.500 mm open hexagonal cells, cells arrayed intwo regions (slant hole region and progressive angle cell region), 2.0mm total specimen thickness. Open cells arrayed in “progressive anglecell region” decrease in angular position from 90 degrees at the focalpoint to 36.7 degrees at the border of the “slant hole region”. Opencells remain constant in the “slant hole region” at an angle of 37.5degrees. Cell angles and regions are shown in Figure X.

Software code written in Visual Basic was used as a means of configuringthe angles of the cell openings in the specimen. Each layer of the TLM™mold (stack lamination) had unique cell positions on each layer toproduce the angled cells. The Visual Basic program was imported intoAutoCad software which was then used to create a DXF file. The DXF fileswere used to plot the CAD data to film for photo-mask generation.

Using Visual Basic, an event driven programming language for graphicaluser interface applications, such as AutoCAD, we can implement theappropriate algorithms for the desired engineered design. We canmanipulate patterns across a surface as well as create 3D structureswithin a volume with layer-to-layer pattern variations.

Example Algorithms

3D slant hole geometry can be created by programming the followingalgorithm into Visual Basic for specific z locations.

For integers i and j=1→integer value and dR, pitch_X andpitch_Y=constants, then the insertion point could be defined:

X=(pitch_(—) X*i)+(dX*Z) Y=pitch_(—) Y*j)+(dY*Z)

where Z=location in z-axis,

${dX} = {{\frac{{dR}*\left( \frac{{pitch\_ X}*i}{{pitch\_ Y}*j} \right)}{\sqrt{\left( \frac{{pitch\_ X}*i}{{pitch\_ Y}*j} \right)^{2} + 1}}\mspace{14mu} {and}\mspace{14mu} {dY}} = \frac{dR}{\sqrt{\left( \frac{{pitch\_ X}*i}{{pitch\_ Y}*j} \right)^{2} + 1}}}$

Specimens were produced using methods described in U.S. patentapplication Ser. No. 10/479,335, which is incorporated by referenceherein in its entirety to its fullest enabling extent permitted by law.Methods for manufacturing three-dimensional devices and devices createdthereby. Specimen manufacturing methods include CAD generation(described above), photo-mask generation, metallic foil etching, stacklamination, mold production, and casting. Both open and closed moldswere used to produce the specimens. Specimens were produced using a lowCTE two-part epoxy (Epo-tek 301-2) and flexible polyurethane (Resin LabEP1218). Specimens were also produced by loading the two part epoxy withcarbon powder (200 mesh obtained from Grupo Rooe, S.A. de c.v. Mexico)prior to casting. The epoxy was loaded with varying amounts of carbonpowder including 20%, 30%, and 40% by weight.

FIG. 74 is a perspective view of an exemplary embodiment of a castisogrid 74000, which can comprise multiple zones 74100, 74200, 74300,74400. Each zone can comprise multiple ligaments 74500, 74600, which canjoin at an intersection and/or node 74700.

FIG. 75A and FIG. 75B are a top and side views, respectively of anexemplary embodiment of a male interlocking isogrid 75100, and FIG. 75Cand FIG. 75D are a top and side views, respectively of an exemplaryembodiment of a female interlocking isogrid 75200. Any isogrid 75100,75200 can comprise multiple ligaments 75300, which can join at anintersection and/or node 75400, and which can define spaces, such astriangular space 75500. A maximum dimension measured between a pair ofligaments defining a triangular space 75500 can be, for example, fromapproximately 0.0625 inches to approximately 0.375 inches, including allvalues and subranges therebetween, such as from approximately 0.1875inches to approximately 0.375 inches. Each ligament can have a variableand/or substantially uniform thickness, such as a thickness of fromapproximately 0.0007 inches to approximately 0.005 inches, including allvalues and subranges therebetween. A ligament 75300 can comprise aligament surface 75600, which can comprise a plurality of 3-dimensionalmicro-features that substantially spatially invertedly replicate a moldsurface formed by a plurality of layers of a metallic foil stacklamination parent mold, said plurality of 3-dimensional micro-featurescomprising at least one protruding undercut, said plurality of ligamentsurfaces for each of said ligaments defining a periphery of a layer-lessvolume, such as shown in FIG. 68.

FIG. 76 is a block diagram of an exemplary embodiment of an informationdevice 76000, which in certain operative embodiments can comprise, forexample, a computer, such as a computer used to perform a finite elementanalysis. Information device 76000 can comprise any of numerouscomponents, such as for example, one or more network interfaces 76100,one or more processors 76200, one or more memories 76300 containinginstructions 76400, one or more input/output (I/O) devices 76500, and/orone or more user interfaces 76600 coupled to I/O device 76500, etc.

In certain exemplary embodiments, via one or more user interfaces 76600,such as a graphical user interface, a user can view a rendering ofinformation related to researching, designing, modeling, creating,developing, building, manufacturing, operating, maintaining, storing,marketing, selling, delivering, selecting, specifying, requesting,ordering, receiving, returning, rating, and/or recommending any of theproducts, services, methods, and/or information described herein.

FIG. 77A is a top view of an exemplary embodiment of a system 77000, andFIG. 77B is a front view of an exemplary embodiment of the system 77000of FIG. 77A. System 77000 comprises isogrid 77100 and isogrid 77200, aswell as an isogrid tiling positioner 77300 formed by features of isogrid77100 and isogrid 77200 at multiple layers of each isogrid. Thus, inthis exemplary embodiment, isogrid tiling positioner 77300 serves as aninterlocking isogrid stacking positioner, because it constrains and/orprevents movement of isogrid 77100 with respect to isogrid 77200 in theZ direction, and serves as an isogrid tiling positioner because itconstrains and/or prevents movement of isogrid 77100 with respect toisogrid 77200 in the X direction and/or Y direction.

FIG. 78A is a top view, and FIG. 78B is a front view, of an exemplaryembodiment of a system 78000 comprising a channeled isogrid 78100comprising channels 78200, 78300 within a plurality of its ligaments.Such channels can provide a variety of uses, such as conveying fluids,positioning electrical conductors, and/or positioning opticalwaveguides.

FIG. 79A is a top view of an exemplary embodiment of a system 79000comprising an isogrid 79200 attached to a face plate 79100.

FIG. 79B is a front view of an exemplary embodiment of system 79000 ofFIG. 79A, in which isogrid 79200 and face plate 79100 are positionedadjacent and in parallel flat planes.

FIG. 79C is a front view of an exemplary embodiment of system 79000 ofFIG. 79A, in which isogrid 79200 and face plate 79100 are positionedadjacent and in parallel curved planes.

FIG. 80A is a top view of an exemplary embodiment of a system 80000comprising an isogrid 80200 attachable to a face plate 80100 via one ormore male isogrid stacking positioners 80300, which can be located alonga ligament 80220 and/or at a node 80240 where ligaments intersect.

FIG. 80B is a front view of an exemplary embodiment of system 80000 ofFIG. 80A, showing a plurality of female isogrid stacking positioners80400, and that isogrid 80200 and face plate 80100 can be positioned inadjacent parallel flat planes.

FIG. 80C is a front view of an exemplary embodiment of system 80000 ofFIG. 80A, showing a plurality of female isogrid stacking positioners80400, and that isogrid 80200 and face plate 80100 can be positioned inadjacent parallel curved planes.

FIG. 81A is a top view of an exemplary embodiment of a system 81000comprising a isogrid stacking positioner 81300 located at a node 81200of an isogrid 81100.

FIG. 81B is a front view of an exemplary embodiment of system 81000 ofFIG. 81A, and showing that isogrid stacking positioner 81300 can bemale, thereby serving as a mechanical positioner.

FIG. 82A is a top view of an exemplary embodiment of a system 82000comprising an isogrid stacking positioner 82300 located at a node 82200of an isogrid 82100.

FIG. 82B is a front view of an exemplary embodiment of system 82000 ofFIG. 82A, and showing that isogrid stacking positioner 82300 can befemale, thereby serving as a mechanical positioner.

FIG. 82C is a front view of an exemplary embodiment of system 82000 ofFIG. 82A, and showing that isogrid stacking positioner 81300 can be athrough hole, thereby serving as a visual and/or optical positioner.

FIG. 83A is a top view, and FIG. 83B is a front view, of an exemplaryembodiment of a system 83000 comprising a fillet 83300 joining twoligaments 83400, 83500 at a node 83200 of an isogrid 83100, the fillet83300 having a radius R.

FIG. 84 is a top view of an exemplary embodiment of a system 84000comprising a substantially circular node 84200 joining a plurality ofligaments of an isogrid 84100.

FIG. 85 is a top view of an exemplary embodiment of a system 85000comprising a first isogrid 85100 comprising a male isogrid tilingpositioner 85300 located at a predetermined position along a ligament offirst isogrid 85100 and adapted constrain and/or interlock first isogrid85100 relative to a second isogrid 85200 via mating with a femaleisogrid tiling positioner 85400 located at a corresponding predeterminedposition along a ligament of second isogrid 85200.

FIG. 86 is a top view of an exemplary embodiment of a system 86000comprising a first isogrid 86100 comprising a male isogrid tilingpositioner 86300 located at a node of first isogrid 86100 and adaptedconstrain, connect, and/or interlock first isogrid 86100 relative to asecond isogrid 86200 via mating with a female isogrid tiling positioner86400 located at a corresponding node of second isogrid 86200. Dependingon the precise configuration, dimensions, and/or material properties ofmale isogrid tiling positioner 86300 and/or female isogrid tilingpositioner 86400, the interlock formed thereby can be eithernon-destructively releasable, thereby allowing first isogrid 86100 to beeasily released and reunited with second isogrid 86200, such as tofacilitate testing, repair, and/or maintenance, or destructivelyreleasable, thereby preventing first isogrid 86100 from being easilyreleased and/or reunited with second isogrid 86200.

Additional Exemplary Embodiments

Jet engine manufacturers often seek to produce engines capable ofoperating at ever higher temperatures. The advantages derived therebycan include:

-   -   higher combustion efficiency,    -   higher thrust,    -   improved fuel efficiency, and/or    -   lower emissions.

A potential impediment to increasing the engine operating temperature(specifically, the turbine inlet temperature) can be the diminution ofstructural integrity that can occur in turbine airfoils at hightemperature. “Hot section” airfoils often must maintain structuralintegrity in an environment of extreme temperatures and corrosive gases.The manufacture of such airfoils typically requires the use of specialsuper-alloys that are resistant to high temperature, corrosion, andstress. In short, turbine blade and vane survivability at higheroperating temperatures can be a key to improving engine performance.

Modern gas turbine airfoils are typically hollow, monolithic structuresthat embody highly-engineered passages and orifices. During typicaloperation, cold (relatively) compressed air courses through thesepassages to extract heat from the structure, exits through arrays oforifices on the airfoil surfaces, and flows off the airfoil in lamellarfashion. Thus, the external surfaces of the airfoil are usuallyinsulated from higher temperature gas in the mainstream. Airfoil designengineers have devised ways to increase the efficacy and efficiency ofthis “film cooling” process. Typically, the complex internal shapes ofadvanced, film-cooled airfoils can be achieved only with advancedinvestment casting technology and, more specifically, with the placementof a sophisticated casting core within the casting mold. Implementationof the most advanced film cooling designs tends to require investmentcasting cores of configurations that exceed the capability ofconventional manufacturing technology.

Certain exemplary embodiments can address the need to rapidly and/oreconomically produce tools and/or prototype hardware whereby an advanceddesign can be empirically tested and optimized and/or the need toincrease core manufacturing process capability (quality and/orreliability) in a recurring production environment.

Certain exemplary embodiments can enable faster and/or less-costlyprototyping of complex investment casting cores and/or enhance themanufacturability of these optimized designs in a recurring productionenvironment. Today's core manufacturing methods often impose significantconstraints on engine designers as the need for more complex airfoilsbecomes greater. The high cost and long lead-time required to producenew prototypes often further impedes the design evolution process.

Certain exemplary embodiments can provide the ability to manufactureadvanced investment casting cores embodying state-of-the-art designs forfilm cooling turbine airfoils. Via certain exemplary embodiments, thiscan be achieved with unprecedented design flexibility, accuracy, and/orcost efficiency. For certain exemplary embodiments, an enablingtechnology can be that found herein and/or in U.S. Pat. No. 7,141,812,dated 28 Nov. 2006, which is incorporated by reference herein in itsentirety to its fullest enabling extent permitted by law, a portion ofwhich we sometimes refer to herein as the Tomo-Lithographic-Molding™(TLM™) process.

TLM master molds can be composed of a series of chemically-machinedmetal foils precisely aligned and/or bonded into a laminated, monolithicsolid object. Each foil can be as thin as 0.0005″ and/or can embody thecross-sectional features corresponding to a single “clipping plane” of avirtual solid (CAD model). The nearly unlimited flexibility to arrayfeatures on the X-Y plane of each foil, and/or the Z axis among foils,can be inherent to the process.

TLM can be considered a distant derivative of the photo-lithographicmethods commonly employed in the production of integrated circuits.Optical scaling techniques can be used to produce ultra-precise photomasks. This approach can enable one to chemically machine metal foils todimensional tolerances of ±0.00002″ positional accuracy and/or ±0.0001″feature accuracy.

The TLM process can inexpensively replicate the master mold withoutaffecting dimensional accuracy. These high-fidelity replicas can beproduced using standard shop practices—neither clean-rooms nor stringentenvironmental controls are necessarily required. Master mold fabricationcan be a nonrecurring task and/or can be accomplished for a fraction ofthe cost required for conventionally-machined molds and/or dies. Thederived molds can be used for production operations.

Film cooling—Film cooling is a process whereby compressor exit flow canbypass the combustor, course through the hollow interior of individualturbine airfoils, and/or exit through an array of holes in the surfacesof each airfoil. Film cooling can effectively form an insulatingboundary layer over the pressure and/or suction sides of each airfoil,thus maintaining surface temperatures below the mainstream totaltemperature. Engine performance can decrease in proportion to the volumeof compressed air that bypasses the combustor and is consumed in thefilm cooling process. Therefore, film cooling designs typically mustmaximize insulating capacity (efficacy) while minimizing compressed airconsumption (efficiency).

Modeling—Advanced Computational Fluid Dynamics (CFD) models indicatethat insulating capacity can be further optimized by manipulation offilm cooling process parameters such as blowing ratio, injection angle,discharge coefficient, and/or discharge trajectory. Flow in a gasturbine engine can be extremely complicated. The equations governing theproblem are typically considered to be the continuity (conservation ofmass), the Navier-Stokes (conservation of momentum), and the energyequations. Together, these equations can form a system of couplednon-linear partial differential equations (PDEs). Because of thenon-linear terms in these PDEs, analytical methods typically yield fewsolutions. Computational Fluid Dynamics is often considered to be asmuch art as science in the substitution of the differential equationgoverning the fluid (gas) flow with a set of algebraic equations (aprocess referred to as discretization). These equations, with the aid ofa digital computer, can be used to calculate approximate solutions.There is no film cooling design handbook for arbitrary airfoil shapesand conditions. Designs are typically evolutionary; the convention is toadapt what worked in the last engine to fulfill the requirements for afuture engine. This iterative process is frequently costly in terms ofboth time and money. Schedule and budget constraints generally lead toconservative designs. Unfortunately, many CFD-optimized designs have notbeen implemented because the enabling manufacturing technology does notexist within the investment casting industry.

Manufacturability—Film cooling passages and exit features within anairfoil can be created by means of a ceramic core situated within aninvestment casting mold cavity. The core can be a solid structure; itsgeometry can be reciprocal to the desired film cooling passages and exitfeatures; i.e., it can be a solid rendition of the desired voids withinthe finished casting. A fine balance often must be achieved between thestrength and density of investment casting cores for turbine airfoils.The cores often must be durable enough to withstand transportation andhandling, strong enough to retain their shape during wax injectionmolding and metal casting, sufficiently weak to crush under loadsassociated with metal solidification, chemically inert to castingalloys, and/or be porous enough and of such material composition as tobe chemically dissolved during subsequent leaching operations.

The service environment is usually most demanding of first and secondstage turbine airfoils. These components are typically produced by meansof the single crystal (SX) casting process. The extended solidificationtime associated with this process (generally several hours) tends toaccentuate the need for chemically inert core material compositions andmechanical stability.

Certain exemplary embodiments can allow variation in certain designparameters, such as:

-   -   cooling channel turbulator ribs (which can promote site-specific        vortices and/or increase blowing ratio),    -   plenum lattice structures (which can optimize flow dynamics,        heat transfer, and/or airfoil strength),    -   integral film holes of varied geometry and inclination (which        can allow manipulation of discharge coefficient),    -   film hole-turbulator alignment (to manipulate discharge        coefficient), and/or    -   film hole distribution (which can allow improvements in cascade        flow and/or heat transfer coefficient).

Certain exemplary embodiments can enhance the strength, geometricstability, dimensional accuracy, and/or overall survivability of suchintricate features during exposure to DS and/or SX casting temperatureregimes and/or casting alloys (notably, nickel-based super alloyscontaining hafnium and/or yttrium).

Because TLM™ can be a fault-tolerant, highly-repeatable, manufacturingprocess, TLM™-derived structures can exhibit low part-to-part variation.Complex shapes can be produced as monolithic solids thus potentiallyobviating the need for assembly operations. The opportunity for errorand cumulative, negative effects of tolerance build-up thereby can beminimized. This can greatly reduce the need to segregate, categorize,and/or match sets of airfoils according to blowing ratio.

Certain exemplary embodiments can provide a composition, system,machine, device, manufacture, circuit, and/or user interface adaptedfor, and/or a method and/or machine-readable medium comprisingmachine-implementable instructions for, activities that can comprise,after removing a cast device from a stack-lamination-derived mold, saidcast device formed from a molding composition, applying a desired shapeto said cast device to form a shaped cast device, said moldingcomposition comprising: a ceramic composition comprising silica; ancycloaliphatic epoxy binder composition, said cycloaliphatic epoxybinder composition present in said molding composition in an amount upto 30% by weight of said molding composition; a silicone compositioncomprising a siloxane resin, said silicone composition present in saidmolding composition in an amount up to 30% by weight of said moldingcomposition; and a solvent composition adapted to dissolve saidcycloaliphatic epoxy binder composition and said silicone composition.

Certain exemplary embodiments can provide novel systems, devices, and/ormethods for manufacturing castings, such as cast parts. Such a cast partcan serve, for example, as an internal form, sometimes called a “core”,for an investment cast product that will at least partially surround thecore. Such investment cast products can include, for example, foils,blades, vanes, nozzles, seals, disks, ducts, sensors, stators, and/orrotors of any fan section, compressor section, combustor section, and/orturbine section, of any turbomachine, such as those used for steamturbines, industrial gas turbines, ship propulsion, and/or aeronauticalpower plants. Such investment cast parts can include automobile parts,such as: intake manifolds; exhaust manifolds; turbochargers;superchargers; pistons; connecting rods; crank shafts; cam shafts;gears; engine blocks; transmission housings; fuel pumps; fuel injectors;brake master cylinders, rotors and/or drums; alternators; starters;motor frames; vehicle frames; seat frames and/or supports; suspensionmembers; etc. Such investment cast parts can include and/or beincorporated in sensors, actuators, valves, control valves, rotaryvalves, controls, armatures, spools, pulleys, gears, couplings,linkages, propellers, impellers, pumps, housings, casings, enclosures,structural members, frames, tubes, hinges, triggers, firearm hammers,jewelry, art, sporting goods, bicycle parts, equestrian gear, golf clubheads, cryogenic parts, heat sinks, injectors, igniter tubes, hydraulicdevices, pneumatic devices, electric motors, air motors, machinery,machine parts, compressors, fasteners, lugs, drill bits, blades, chainlinks, hardware, instruments, power tools, hand tools, medical tools,surgical tools, medical devices, general prothesis, dental prothesis,etc. Certain exemplary embodiments can enable faster and/or less-costlyprototyping of complex investment casting cores, optimization of theirdesigns, and/or enhancement of their manufacturability in a recurringproduction environment.

Certain exemplary embodiments of such cast parts and/or their molds canutilize the Tomo Lithographic Molding (TLM™) process, which is describedherein.

Certain exemplary embodiments can prepare cast parts and/or cores, suchas cast parts that are removable, leachable, dissolvable, friable,and/or fracturable, etc., for any type of investment casting, such assingle crystal (SX) investment casting, directional solidification (DS)investment casting, and/or equiax investment casting, etc.

Generally, a process for manufacturing cast parts, such as investmentcasting cores, can include:

-   -   develop 3D CAD model of cast part;    -   adjust model as needed:        -   scale model to account for shrinkage of cast material;        -   split model to create part line/pull plane for cast part            mold;        -   “flatten” model to make faces planar;        -   incorporate cast part mold half co-alignment features in            model as desired; and/or        -   incorporate other features in model as desired for            alignment, inter-connecting cast parts, mold venting, part            handling, etc.;    -   prepare laminated stack foil mold, such as per the TLM™ process,        to correspond to adjusted model of cast part:        -   output adjusted model;        -   create photo masks from outputted model;        -   create foils using photo masks;        -   create alignment fixtures as needed; and/or        -   stack, align, and bond foils to form mold for cast part;    -   form initial cat part using mold:        -   fill mold with casting components;        -   mix components in situ;        -   heat filled mold to form cured cast part; and/or        -   de-mold cured cast part;    -   adjust cured cast part to desired shape, hardness, crystal        structure, etc.:        -   form cast part to desired curvature using forming fixture;        -   heat cast part to initially solidfy;        -   cool cast part to form desired crystal structure in cast            part; and/or        -   fire cast part to sinter its particles; and/or    -   cast investment material around cast part.

To prepare the model, solid modeling software, such as SolidWorks,Pro/Engineering (Pro/E), etc., can be utilized. The model can be scaledto account for shrinkage of cast material using standard scale commandsthat are part of the solid modeling software. The entire model, orfeatures of the model can selected and scaled to reduce or enlarge themodel or features to compensate for shrinkage during ceramic sintering.

The model can be split to create a part line/pull plane for the castpart mold by dividing and/or part the model into two sections, typicallyfrom the root portion of the part to the tip (through the overallthickness). The part line can be placed in the middle of the part'sthickness or any other plane from the top most surface to the bottommost surface of the part.

The model can be “flattened” to make its faces planar using one or morecommands in the solid modeling software. For example, in SolidWorks, the“Flex” command initially can be used to roughly flatten out the 3D modelin one direction at a time using a straight line extending along themodel or the feature being flattened. The Flex command can be repeatedby rotating the line across the model at various angles, each timefurther flattening the model. A series of Flex commands can be performeduntil the model is in a near planar or flattened condition. Next, asurface plane (zero thickness) can be created that extends slightlybeyond the outer edges of the model and can be located in the Z-axis atthe part line location (part line described above) of the model. InSolidWorks, the “Deform” command can be used to fully planarize themodel using the surface plane at the part line as the planar base. TheDeform command basically can form the nearly flattened model surfacesonto the surface plane at the part line.

The model halves can be sliced to the desired thickness corresponding tothe thickness of the metal foil layers that will be used to produce thestack lamination. In SolidWorks, the command “Intersection Curve” can beused to slice the model. Once sliced, the layer slices can be exportedin a DXF file format, which then can be used to produce the output datafor plotting the photographic masks.

To initially form the cast part, a mold can be formed in one or morepieces and/or portions, potentially using non-lithographic methods toproduce coarse featured portions of the part and/or combining otherportions produced using TLM™ for creating part areas (such a leadingedge and/or a trailing edge) having finer features. For example, aportion of a mold for creating a part body could be produced using CNCmachining while the trailing edge and/or leading edge portions of themold can be produced using TLM™. Alignment features between the moldportions and/or parts created thereby can be incorporated to align themold portions together on a fixture before deriving a complete mold.

The mold can be formed of a flexible material such as described herein.The material of the mold can be used to transfer vibrational energy tothe molding composition that fills the mold to allow for appropriateparticle packing and/or breaking and/or separating of particleagglomerates. For example, the mold fixture can be attached to avibration table and vibrated for a period of time sufficient to allowthe ceramic powder particles to settle to the bottom of the mold cavity.The amount of time required can depend upon many factors including thetable type, the vibration action (linear or rotary), table manufacturer,the particular ceramic powder and polymer materials used, and/or thedensity required in the final ceramic part, etc. For the example, an FMCJ-50 linear action Jogger table can be used at a power setting of 10-90%at a frequency of 250-3600 or 3600-5000 pulses per minute forapproximately 2 minutes to approximately 120 minutes. The mold can beused repeatedly, without substantial wear and/or abrasion, to createmultiple cast parts. Vacuum assistance can be used with to aid infilling the mold features and/or evacuating air from the mold.

To prepare and/or provide a molding composition for at least partiallyfilling the mold, a powder material can be combined with a binder systemto form a molding composition, such as a slurry. The powder can compriseany of ceramic, silica, alumina, zirconia, silicon carbide, boronnitride, and/or yttria, etc. The powder, molding composition, and/orcasting method can be any of those described herein, including any ofthose described in the following set of US patent documents, each ofwhich is incorporated by reference herein in its entirety to its fullestenabling extent permitted by law:

-   -   U.S. Pat. No. 2,961,751, titled “Ceramic Metal Casting Process”;    -   U.S. Pat. No. 3,957,715, titled “Casting of High Melting Point        Metals and Cores Therefore”;    -   U.S. Pat. No. 4,190,450, titled “Ceramic Cores for Manufacturing        Hollow Metal Castings”;    -   U.S. Pat. No. 4,284,121, titled “Process and Materials for        Making Refractory Cores”;    -   U.S. Pat. No. 4,837,187, titled “Alumina-Based Core Containing        Yttria”;    -   U.S. Pat. No. 5,394,932, titled “Multiple Part Cores for        Investment Casting”;    -   U.S. Pat. No. 6,588,484, titled “Ceramic Casting Cores with        Controlled Surface Textures”;    -   U.S. Pat. No. 7,413,001, titled “Synthetic Model Casting”; and    -   US Patent Application Publication 2008/0169081, titled “Method        and Apparatus for Production of a Cast Component”.

What follows are several examples of potential molding composition forparts, whose approximate composition can range as follows:

-   -   Silica 10%-99%; alumina 1%-90%; cristobalite 1%-20%; zircon        1%-20%; magnesium oxide 0.01%-1.0%; silicone resin 1%-30%;        organic binder 1%-30%.

Ceramic materials, such as those of the type described in U.S. Pat. No.4,837,187, which is incorporated by reference herein in its entirety toits fullest enabling extent permitted by law, can be used for themolding composition and/or in forming core parts of gas turbine engineblade cores by low pressure injection molding. Specifically, a moldingcomposition with a composition of: approximately 1 wt % to approximately90 wt % alumina, such as 84.5 wt % alumina; approximately 1 wt % yttriato approximately 20 wt % yttria, such as approximately 7.0 wt % yttria;approximately 0.05 wt % magnesia to approximately 10 wt % magnesia, suchas 1.9 wt % magnesia; and/or approximately 1 wt % graphite (flour) toapproximately 15 wt % graphite (flour), such as approximately 6.6 wt %graphite (flour) was found to perform acceptably in a two piece coreconstruction. For example, an illustrative molding composition cancomprise approximately 94 wt % of 200 mesh fused silica, approximately 6wt % of 400 mesh Cristobalite, approximately 6 wt % of 325 mesh tabularalumina, and/or approximately 0.2% superfine MgO.

The alumina component of a produced exemplary embodiment of this moldingcomposition included approximately 70.2% of approximately 37 micrometersized grains, approximately 11.3% of approximately 5 micrometer grains,and approximately 3% of approximately 0.7 micrometer grains. The grainsizes of the other components were: graphite—approximately 17.5micrometer; yttria—approximately 4 micrometer; andmagnesia—approximately 4 micrometer. The thermoplastic binder usedincluded the following components (wt % of mixture): Okerin 1865Q (AstorChemical); paraffin based wax approximately 14.41 wt %; DuPont Elvax 310FINNECAN, approximately 0.49 wt %; oleic acid—approximately 0.59 wt %.Other ceramic material components and thermoplastic binders could beused, including those set forth in U.S. Pat. No. 4,837,187.

In certain exemplary embodiments of the molding composition, any of awide variety of silicone resins can be used. For example, siloxanes ofthe type described in U.S. Pat. Nos. 3,090,691 and 3,108,985, each ofwhich is incorporated by reference herein in its entirety to its fullestenabling extent permitted by law, can be utilized, including any organicsiloxane in which the substituent groups are hydrogen atoms or organicradicals attached directly to the silicone atoms. In general, siloxanescontaining 1 to 3 hydrogen and/or organic substituents per silicon atom,and the organic group contains 1-12 carbon atoms, optionally substitutedby a group containing an oxygen atom and/or a nitrogen atom can beutilized. As used herein, the term “siloxane” is intended to refer toand include a material which contains at least one linkage per molecule.In an exemplary embodiment, approximately 11 g to 19 g (including allvalues and subranges therebetween) of Momentive 355 silicone resin canbe used with each 100 g of ceramic powder.

Certain exemplary embodiments of the molding composition can employsiloxane resins such as dimethyl siloxane, monomethyl siloxane,phenylmethyl siloxane, monophenyl siloxane, diphenyl siloxane, monethylsiloxane, ethylmethyl siloxane, diethyl siloxane, phenylethyl siloxane,monopropyl siloxane, ethylpropyl siloxane, divinyl siloxane, monovinylsiloxane, ethyl vinyl siloxane, phenyl vinyl siloxane, diallyl siloxane,monoallyl siloxane, allylethyl siloxane, allylvinyl siloxane,monocyclohexyl siloxane, gamma-hydroxypropylmethyl siloxane,beta-methoxyethylmethyl siloxane, gamma-carboxypropyl siloxane,gamma-aminopropyl siloxane, and/or gamma-cyanopropylmethyl siloxane,etc.

Certain exemplary embodiments of the molding composition can utilize anyof a variety of filler materials of the type typically used in thepreparation of molds and cast parts, such as the Group IVB metals,including refractory and/or ceramic materials, such as silica, alumina,and/or zircon, etc. As indicated above, the filler particles can bebonded together by a siliceous bond on firing of the preformed part as aresult of partial decomposition of the siloxane resin. The bulk density,apparent density, apparent porosity, and/or other properties of thebaked or fired part can be controlled by varying the relativeproportions of the filler and/or siloxane resin, by varying the sizedistribution of the ceramic particles employed in the moldingcomposition, and/or by adding to the molding composition graphite and/orwood flour which can burn-out on firing to increase the porosity of thepart.

When silica is the primary filler, the baked and/or fired part can havea bulk density within the range of approximately 1 to approximately 3g/ml, such as, for example, from approximately 1.4 to approximately 2.0g/ml. This range can correspond to an apparent solid density ofapproximately 1.80 to approximately 2.50 g/ml and an apparent porosityof approximately 15 to approximately 35 percent. For this purpose, usecan be made of filler material having particle sizes within the range ofapproximately 100 to approximately 400 mesh.

Graphite can be used as the filler material in combination with asilicone resin as described above for molding a pre-formed partconfiguration. On baking and firing, a carbon and/or graphite bond canbe formed in addition to the siliceous bond to form the desired parthaving a minimum bulk density of approximately 1.2 g/ml, and a maximumof approximately 5 g/ml. Such graphite parts can be particularly usefulin the production of intricately cored, precision cast titaniumcomponents.

In addition to the filler, silicone resin, and/or catalyst components,the molding composition can be formulated to include, if desired, aplasticizer for the silicone resin to improve its workingcharacteristics during molding of the composition in the preparation ofa pre-formed part. As the plasticizer component, use can be made of anyof a variety of plasticizers for silicone resins as represented byparaffin waxes, styrene, phenol or low molecular weight phenolic resins,and/or fatty amines such as N,N′-distearyl ethylenediamine, etc. Theamount of plasticizer in the molding composition can be varied fromapproximately 0 to approximately 7% by weight of the resin content ofthe molding composition.

Any of a number of additives, such as parting agents or lubricants canbe added to the molding composition to improve the processingcharacteristics of the molding composition during molding in thepreparation of the pre-formed core configuration. Representativematerials include, for example, calcium stearate as well as other metalsalts of fatty acids.

The molding composition can be formulated in accordance with well knownmixing techniques, including dry blending, wet mixing, hot mixing, etc.,and then molded in a conventional manner using conventional moldingtechniques, such as transfer molding, injection molding, and/orcompression molding, etc. Molding parameters including pressures, dietemperatures, compound temperatures, and/or cure times can varydepending somewhat on the configuration of the part being molded and/orthe particular composition of the molding composition. Typical pressureranges normally used for transfer or injection molding can be fromapproximately 100 psig to approximately 10,000 psig, and approximately100 psig to approximately 5,000 psig for compression molding. Compoundand/or die temperatures usually can range from approximately roomtemperature up to approximately 400 F and/or can be timed fromapproximately 1 to approximately 10 minutes.

The distribution of the particles of the powder comprised by the moldingcomposition can be controlled over the entire cast part and/or anyportion thereof, such as, in the case of a core, the core body, trailingedge of the core, and/or leading edge of the core, etc.

The binder system can comprise one or more urethane and/or epoxy resins,one or more solvents and/or wetting agents, and/or one or moreplasticizers (plasticizers described above), etc. Binder systems can beproduced using acrylics such as, for example, PMMA acrylic powder,resins, 2 part epoxy systems and/or composites, and/or methacrylatessuch as butyl, lauryl, stearyl, isobutyl, hydroxethyl, hydroxpropyl,glycidyl and/or ethyl, etc.; thermoplastics, such as, for example, ABS,acetyl, acrylic, alkyd, fluorothermoplastic, liquid crystal polymer,styrene acrylonitrile, polybutylene terephthalate, thermoplasticelastomer, polyketone, polypropylene, polyethylene, polystyrene, PVC,polyester, polyurethane, thermoplastic rubber, and/or polyamide, etc.,thermo-sets, such as, for example, phenolic, vinyl ester, urea, and/oramelamine, etc.; and/or rubbers: such as, for example, elastomer,natural rubber, nitrile rubber, silicone rubber, acrylic rubber,neoprene, butyl rubber, fluorosilicone, TFE, SBR, and/or styrenebutadiene, etc. Certain exemplary embodiments can employ acycloaliphatic thermal cure epoxy. For example, approximately 10 g to 20g of WO32701-8 epoxy from Resinlab of Germantown, Wis. can be used per100 g of total ceramic powder weight, blended according to themanufacturer's directions of A:B approximately equals 0.94:1.

Binder materials and/or components can be liquids that can be fullysoluable in, and/or diluted using, various solvents such as MEK,acetone, heptane, and/or isopropyl alcohol, etc. In the case of MEK,solvent additions can range between 10-22 grams per 100 grams of totalceramic powder weight. In the case of acetone, solvent additions canrange between 14 grams and 27 grams per 100 grams of total ceramicpowder weight. In the case of isopropyl alcohol, solvent additions canrange between 11-21 grams per 100 grams of total ceramic powder weight.The binder system can comprise any of those appropriate materialsdescribed herein, including any of those described in any of the patentsincorporated herein.

It has been found that ceramic cores having the desired thermalstability at temperatures as high as approximately 2700 F and above canbe produced when the molding composition is formulated to replace all orat least part of the silica component with a crystalline phase of silicawhich can be identified as Cristobalite. When Cristobalite is present asa constituent of the molding composition in an amount greater thanapproximately 2.5%, but not greater than approximately 10% by weight,the high temperature stability of the ceramic core can be superior tothat of a core in which the silica component is formed of amorphousfused silica or fused silica combinations with zircon and/or alumina asthe ceramic component of the core.

The amount of Cristobalite in the core body, at the time that the moltenmetal is cast into the mold cavity, can be important. The quantity canbe sufficient to achieve the desired improvement in high temperaturestability without adversely affecting the strength of the core or thethermal shock properties. While beneficial use can be obtained when allof the silica is replaced with Cristobalite, it can be desirable tolimit the maximum concentration in the fired core to approximately 35%by weight and/or approximately 5 to approximately 20% by weightCristobalite in the fired core. The remainder of the core can beformulated with fused silica and/or fused silica and zircon, and/orfused silica, zircon and/or alumina, with binders such as organosilicone resins, such as described in the aforementioned U.S. Pat. No.3,957,715. The presence of Cristobalite can be achieved by the directaddition of Cristobalite to the components making up the moldingcomposition. For this purpose, Cristobalite can be used in finelydivided form such as in the range of approximately 70 to approximately−325 mesh. The core can be formed by transfer molding technique usingsilicone resins as the binder.

The following example identifies the approximate ingredient ranges forthe molding composition by weight: silica 10%-99%; alumina 1%-90%;cristobalite 1%-20%; zircon 1%-20%; magnesium oxide 0.01%-1.0%; siliconeresin 1%-30%; organic binder 1%-30%. For example, a composition of fusedsilica (60%) and alumina (40%) can be used.

The above compositions can include additional ingredients such ascalcium stearate as a lubricant, and/or a catalyst that can be in theform of finely divided magnesium oxide and/or benzoic acid in equalparts by weight, with the lubricant being present in an amount withinthe range of approximately 0.2 to approximately 2% by weight and thecatalyst being present in an amount within the range of approximately0.2 to approximately 2% by weight.

The binder can be partially and/or fully mixed using standard mixingtechniques. For example, a kitchen mixer such as a food blender and/or aceramic slurry mixer such as an approximately 1 horsepower RossDispersion Mixer, model 100 LC, can be used. Mixing times to dispersethe binder and/or mix it into the powder can range from approximately 1minute to approximately 24 hours. The binder can be partially and/orfully mixed with the powder prior to filling mold with the moldingcomposition or directly in the mold. The mixing can occur via any knowntechnique, including shear, vibration, centrifugal force, resonantmixing, static mixing, and/or rotational ball-milling, etc.

The slurry composition can comprise any desired wetting agent and/oralternate binder system, which can comprise poly-vinyl alcohol andpoly-ethylene glycol.

Generally, the viscosities ranging from approximately 500 toapproximately 10,000 cps of the powder, binder, and/or moldingcomposition can be appropriate to allow them to flow into and/or fillthe mold. The binder concentration (ranging from approximately 10percent to approximately 20 percent binder to ceramic powder by weight)of the molding composition can be sufficiently low to facilitate burnoutof the binder and/or allow for the sintering of the powder.

Adequate time can be allowed to vent and/or de-gas the filled moldand/or to cure and/or set the cast part in the mold. For example, thetime for venting, de-gasing, and/or mold filling can range fromapproximately 1 minute to approximately 60 minutes. The cast part can bereleased from the mold after the binder has at least partiallycross-linked and/or cured. The cure temperature of the binder can becompatible with the mold material. The cure temperature can range fromapproximately 90 F to approximately 350 F. The cure time can range fromapproximately 15 minutes to approximately 24 hours. The binder can havecompatible reversion properties that can allow the cured “green” stateceramic part to be heated and thermo-formed prior to binder burn-out andsintering. The thermo-forming temperature is dependant on the initialcure temperature used to produce the green state ceramic core and thespecific glass transition temperature (Tg) of the polymer binder.Manufacturers of resins, epoxies, urethanes and other organic polymers(binders) specify the Tg of their products on the materials propertiesdata sheet. During sintering, the binder can burnout clean, leavingsubstantially no carbon to react with the investment casting material.

The mold can be configured to be closed before, during, and/or afterfilling. In certain exemplary embodiments, the mold can be configured astwo or more mold portions that remain open during and/or after filling,which can potentially more easily vent air from the mold, de-gas solventin the molding composition, de-mold the cast part, etc.

The mold can be filled via any known technique, such as gravity pouring,injection pressure, vacuum, and/or dispersion, etc. The mold can beoverfilled to insure a proper fill. A vacuum can be used to assist withair venting and/or de-gassing.

During and/or after filling of the mold with the molding composition,its particles can be compacted, densified, and/or packed in a maximumdensity configuration to substantially eliminate gaps between ceramicparticles, thereby helping the particles to sinter to each other duringceramic firing That is, the location, size distribution, count, and/orpacking density of the particles can be adjusted (such as per theparticle sizes described in the Minco silica product literature) and/orcontrolled via applying energy, such as vibrational energy, to the moldduring and/or after filling. As desired, adjustments can be made to thepre-vibration settling time (approximately 2 minutes to approximately 2hours), vibration time (approximately 2 minutes to approximately 2hours), the vibration frequency range and/or amplitude, post-vibrationsettling time (approximately 2 minutes to approximately 2 hours), and/orsolvent separation time (approximately 2 minutes to approximately 2hours), etc. A linear action Jogger table can be used at a power settingrange of approximately 10% to approximately 90% to adjust the amplitudeand at a frequency of approximately 250-5000, approximately 250-3600,and/or approximately 3600-5000 pulses per minute. While the mold isbeing vibrated, the mold can stay open to allow the solvent to moreeasily evaporate out of the molding composition. While the mold is beingvibrated and/or while open, the mold can be heated (temperature rangefrom approximately 100 F to approximately 350 F for approximately 15minutes to approximately 24 hours) and/or cooled (temperature range fromapproximately 60 F to approximately 80 F for approximately 1 minute toapproximately 3 hours) to affect molding composition flow,densification, and/or curing, etc.

By using open molds, one or more inserts can be inserted into the moldand/or molding composition prior to, during, and/or after filling of themold and/or initial setting of the molding composition. An insert canserve as a reinforcement member to the cast part, such as to addcompressive, tensile, shear, and/or torsional strength to the cast part.An insert can provide physical, electrical, magnetic, optical, chemical,biological, mechanical, thermal, and/or fluidic properties to the castpart, such as described under “Cavity Inserts” in U.S. Pat. No.7,410,606, which is incorporated by reference herein in its entirety toits fullest enabling extent permitted by law.

An insert can be formed by any known technique, such as via casting,extruding, stamping, forging, machining, thermoforming, photo-etching,and/or TLM, etc. An insert can be formed of any known material, such asmetal, polymer, and/or ceramic, etc. For example, an insert can beformed of tungsten, molybdenum, etc. Once installed in a cast part, aninsert can be removable, leachable, dissolvable, friable, and/orfracturable, etc. The structure of an insert can be solid, hollow,and/or web-like, etc. A surface of an insert can be treated via anyknown technique, such as via dipping, coating, brushing, spraying,plating, vapor deposition, abrading, blasting, etching, cavitating,and/or chemical reaction, etc. The surface treatment can be compatiblewith the material of the insert, the molding composition, the cast part,and/or the investment casting material. The insert can be incorporatedinto the part and/or ceramic core to act as a reinforcement orstrengthening system, such as steel rebar in a concrete structure. Usingtechniques such as photo-etching to produce the insert, thereinforcement pattern of the insert can be configured to selectivelystrengthen the ceramic material in predetermined areas of a part and/orceramic core. For example, a trailing edge portion of a core having finefeatures or very thin cross sectional thickness can use thereinforcement insert to aid in core survivability during DS, SX or otherinvestment casting methods, and/or steps prior to the actual castingstage of investment casting, such as wax injection and/or shell firing.The insert can be produced from a material, such as tungsten and/ormolybdenum, which has a low coefficient of thermal expansion (CTE) valueand/or is CTE matched with the ceramic material. The insert can beprocess compatible with the process used to leach and/or dissolve themolded part and/or core from the investment cast part. If the insert isproduced using photo-lithographic techniques, the alignment of theinsert can very accurately match the TLM™ mold, therefore simplifyingthe integration of the insert with the mold. An insert can be producedusing TLM™. For example, an insert having a reinforcement pattern can beproduced using TLM™ from a ceramic (such as any of those described) thatis mixed with a metal powder, such as tungsten and/or molybdenum. TheTLM™ insert can be used in the green state and/or after the ceramicmaterial has been sintered. An entire TLM™ core, and/or a portion of acore can be produced from a metal powder combined with any of theceramic materials and/or combinations of materials and/or methodsdescribed in this document. The metal powder can be a refractory metalsuch as molybdenum, tungsten, and/or any other metal powder. The metalpowder ratio to ceramic can be approximately 1% to approximately 90% byweight.

If and/or when desired, the mold portions and/or halves can be broughttogether and/or closed. Alignment between the mold portions can beachieved using mold features and/or fixture features, either of whichcan be substantially incompressible. The mold can be closed when:

-   -   all halves and/or portions of the cast part are uncured;    -   one half and/or portion is cured; and/or    -   all halves and/or portions are cured.

The closed mold can be further filled, de-gassed, vibrated, and/or spun(centrifuge), etc.

The cast part and/or the binder in the molding composition can be curedto a partial and/or fully cross-linked and/or polymerized state bysubjecting the cast part and/or mixture to an appropriate temperaturefor an appropriate time, to arrive at a cast part in a “green” (unfired)state. This process can occur while the molding composition is in themold.

Once in the green state, the cast part can be separated from the moldand/or demolded, such as by opening the mold and pulling the cast partalong the pull-plane. After removing the green cast part from the mold,the cast part can be shaped to a final desired shape and/or curvaturesuch as those of a turbine airfoil blade or vane and/or a golf club headusing traditional machining and/or a shaping tool, such as a mandreland/or form, etc. Prior to such shaping, the cast part can be alignedwith a machine tool and/or a shaping tool using features in the castpart and/or of the cast part, such as alignment features spatiallyinvertedly reflecting those formed in the part mold using the TLM™process.

After shaping, the cast part can be fired and/or sintered, such as viathe methods described in any patent incorporated herein. Sintertemperatures can range from approximately 1000 C to approximately 1700C. Sinter times can range from approximately 1 hour to approximately 24hours. The sintering atmosphere can be air and/or any inert gasatmosphere such as nitrogen, helium, and/or argon, etc.

At any appropriate time, such as after initial casting, while in thegreen state, and/or after sintering, etc., a cast part can be coupledand/or attached to one or more additional parts, such as via aninterlock. Any of the additional parts can be created using any process,such as any process described herein.

Prior to sintering, a part can be oriented as desired to determineand/or control feature distortion, dimensional changes, and/or shrinkagedue to sintering. For example, a part can be oriented horizontally,vertically, and/or on edge. As another example, an overall size of coretooling can be increased, such as by 10%, to compensate for partshrinkage during sintering.

Additional adjustments can be made to improve the final part, such as:

-   -   elimination of sharp (90°) corners from core features and/or        addition of controlled radii to mitigate stress concentration        (“raisers”) during sintering;    -   removal of controlled amounts of material from high mass areas        of the core body to improve mass balancing and/or control        warpage during sintering;    -   addition of controlled radii at termination points between        trailing edge tapers for increased strength during sintering,        wax injection, and/or casting;    -   incorporation of various controlled frame areas around the        finest features of the core specimen to reduce and/or eliminate        warpage during sintering; and/or    -   arraying of core specimens to increase manufacturing throughput.

One or more exemplary parts can be formed via:

-   -   mold lay-up—a core specimen can be aligned and/or fixtured into        a machined mold for wax forming;    -   wax injection—molten wax can be injected into the mold and        around the core;    -   demolding—the wax casting (with the core inside) can be removed        from the mold;    -   shelling—a thin silica ceramic coating can be applied to the wax        casting. The coating can be applied by successively dipping the        wax part into a silica slurry, removing it and allowing it to        dry. The process can be repeated 4-6 times depending on the        desired shell thickness;    -   shell firing—the shelled part can be placed in an autoclave        furnace and the wax is melted out leaving the core in the shell.        Into the resulting cavity molten metal alloy can be poured to        produce the metal casting; and/or    -   investment casting—parts, such as equiaxed aluminum parts can be        cast using the gravity pour casting process.

Parts can be inspected visually using a 35 KeV x-ray source and/or ahigh resolution digital detector.

FIG. 87 is a flowchart of an exemplary embodiment of a method 87000. Atactivity 87100, a computer-based, 3-dimensional, graphical virtual modelcan be created of a desired or predetermined unflattened cast part. Atactivity 87200, via computer software, such as the computer softwareused to create the initial model of the cast part, the model can bescaled. At activity 87300, the model can be flattened, so that one ormore of its major surfaces become planar and/or substantially flat. Atactivity 87400, the part model can be split, such as into 2 or moreportions. At activity 87500, a mold model can be defined, that moldmodel invertedly reflecting the geometry of the flattened and/or splitpart model, such that at least virtually, the part model can be formedfrom the mold model. At activity 87600, desired features can beincorporated into the mold model, such as alignment features, injectionmolding features, de-molding features, etc. At activity 87700, the moldmodel can be virtually sliced, such as into sheets that aresubstantially co-planar with one another and/or one or more flattenedmajor surfaces of the flattened model, those sheets having thicknessescorresponding to the thicknesses of metallic foils that can be stackedto physically re-create the model of the mold and/or part. At activity87800, dimensional data of the mold model and/or its constituent sheetscan be output so that the stackable foils can be specified. At activity87900, foils that are stackable to create the mold for the part can beformed.

FIG. 88 is a flowchart of an exemplary embodiment of a method. Atactivity 88100, the foils can be aligned, stacked, bonded, compressed,connected, and/or assembled to form a physical mold for the unflattened,flattened, un-split, and/or split part. At activity 88200, the mold canbe at least partially, and potentially completely, filled with apredetermined molding composition and/or one or more of itsconstituents. At activity 88300, the molding composition and/or one ormore of its constituents can be mixed, such as in the mold. At activity88400, one or more predetermined inserts can be placed into the mold,the molding composition, and/or one or more of the constituents of thatmolding composition. At activity 88500, constituent particles of themolding composition can be densified, that is, caused to move within themold such that the molding composition can have substantially differentdensities at different locations within the mold. At activity 88600, themolding composition can be de-gassed, potentially while outside ofand/or within the mold. At activity 88700, the temperature of themolding composition can be adjusted, potentially while outside of and/orwithin the mold. At activity 88800, the composition and/or one or moreof its constituents can be allowed to cross-link, potentially whileoutside of and/or within the mold. At activity 88900, a molded part,which can be formed from and/or comprise the cross-linked compositionand/or one or more of its constituents, can be pulled from the mold.

FIG. 89 is a flowchart of an exemplary embodiment of a method. Atactivity 89100, which can be formed from and/or comprise thecross-linked composition (described above) and/or one or more of itsconstituents, a molded part can be pulled and/or removed from the mold.At activity 89200, the part can be aligned with a shaping tool. Atactivity 89300, the part can be shaped. At activity 89400, thetemperature of the part can be adjusted (raised and/or lowered) asdesired. At activity 89500, the shaped part can be fired. At activity89600, particles forming the shaped part can be sintered. At activity89700, investment material can be cast around and/or in the fired part.At activity 89800, the part can be removed from the casting. At activity89900, the casting can be installed in a machine, so that it can serveas a component of the machine. For example, as described herein, thecasting can serve, for example, as an internal form, sometimes called a“core”, for an investment cast product that will at least partiallysurround the core.

FIG. 90 is a block diagram of an exemplary embodiment of an informationdevice 90000, which in certain operative embodiments can comprise, forexample . . . . Information device 90000 can comprise any of numeroustransform circuits, which can be formed via any of numerouscommunicatively-, electrically-, magnetically-, optically-,fluidically-, and/or mechanically-coupled physical components, such asfor example, one or more network interfaces 90100, one or moreprocessors 90200, one or more memories 90300 containing instructions90400, one or more input/output (I/O) devices 90500, and/or one or moreuser interfaces 90600 coupled to I/O device 90500, etc.

In certain exemplary embodiments, via one or more user interfaces 90600,such as a graphical user interface, a user can view a rendering ofinformation related to researching, designing, modeling, creating,developing, building, manufacturing, operating, maintaining, storing,marketing, selling, delivering, selecting, specifying, requesting,ordering, receiving, returning, rating, and/or recommending any of theproducts, services, methods, user interfaces, and/or informationdescribed herein.

FIG. 91 is a perspective view of an exemplary embodiment of a metallicand/or ceramic foil structure 91000.

FIG. 92 is a perspective view of an exemplary embodiment of a stack92000 that includes a stacked plurality of foils 92200 and a pluralityof spherical mold inserts 92500 into one or more foils 92200.

FIG. 93 is a perspective view of an exemplary embodiment of a stackfixture 93000 having an alignment feature 93200 that aligns a foil 93400in stack fixture 93000.

FIG. 94 is a perspective view of an exemplary embodiment of a mold 94000of a metallic foil stack fixture containing a laminated stack ofmetallic foils, such as shown in FIG. 93.

FIG. 95 is a perspective view of an exemplary embodiment of a filledmold 95200 on an exemplary vibration table 95400 within a vacuum chamber95600.

FIG. 96 is a perspective view of an exemplary embodiment of a green castpart 96000 having a tapered thickness.

FIG. 97 is a front view of an exemplary embodiment of a green cast part9700 showing a plurality of apertures 97200 having various radii andcurvatures.

FIG. 98 is a perspective view of an exemplary embodiment of a green castpart 98000.

FIG. 99 is a close-up perspective view of an exemplary embodiment of agreen cast part 98000 that includes an inserted metallic foil moldinsert 99000, taken at section B of FIG. 98.

FIG. 100 is a perspective view of an exemplary embodiment of a greencast part 100000 prior to being shaped.

FIG. 101 is a perspective view of an exemplary embodiment of a greencast part 101200 being shaped on a shaping mandrel 101400.

FIG. 102 is a perspective view of an exemplary embodiment of a shapedcast part 102000, which can function as a core for a turbo-machine part,such as an airfoil, blade, vane, nozzle, etc.

FIG. 103 is a perspective view of an exemplary embodiment of a shapedcast part 103000 and showing a reinforcing metallic foil mold insert103200.

FIG. 104 is a perspective view of an exemplary embodiment of a device104000 comprising a shaped cast part 104200, which can serve as apotentially removable, leachable, and/or dissolvable core of a castdevice 104400, such as a turbo-machine airfoil, blade, nozzle, vane,etc., which can be attached to an attachment device 104600 not formedvia a stack lamination mold, such as a root of an airfoil, blade,nozzle, and/or vane, etc., which can allow the device to be removablyattached to a rotor and/or stator of a turbo-machine. Note that theremoval of core 104200 can create passages through which air can flow tocool cast device 104400.

FIG. 105 is a perspective view of an exemplary embodiment of aturbo-machine 105000, such as a ducted fan gas turbine engine, which cancomprise, in axial flow series, a fan 105100, intermediate pressurecompressor 105200, high pressure compressor 105300, combustion equipment105400, high, intermediate and low pressure turbines 105500, 105600 and105700 respectively and an exhaust nozzle 105800. Air can be acceleratedby fan 105100 to produce two flows of air, the larger of which can beexhausted from the engine 105000 to provide propulsive thrust. Thesmaller flow of air can be directed into the intermediate pressurecompressor 105200 where it can be compressed and then into the highpressure compressor 105300 where further compression can take place. Thecompressed air then can be mixed with fuel in the combustion equipment105400 and the mixture combusted. The resultant combustion products thencan expand through the high, intermediate, and low pressure turbines105500, 105600, and 105700 respectively before being exhausted toatmosphere through the exhaust nozzle 105800 to provide additionalpropulsive thrust.

Referring to FIG. 105, and to FIG. 106, which is a perspective view ofan exemplary embodiment of a turbo-machine assembly 106000, the highpressure turbine (or other turbo-machine) 105000 can include a rotordisc (not shown), which can carry an annular array of similar radiallyextending air cooled aerofoil blades, one of which 106900 can be seen inFIG. 106. The aerofoil blade 106900 can be made up of a root 106500, anaerofoil portion 106100, a shank 106200 that can interconnect the root106500 and aerofoil portion 106100, and a shroud 106300 attached to theopposite end of the aerofoil portion 106100 to the shank 106200. Theroot 106200 can be of the well known “fir tree” cross-sectionalconfiguration to facilitate its attachment to its rotor disc. Thus therotor disc can be provided with a plurality of similar fir-treecross-section slots in its periphery; each one receiving a turbine bladeroot 106200.

The root 106200 can be provided with apertures 106400 which can bepositioned so as to receive flows of cooling air supplied byconventional means to the rotor disc. The apertures 106400 can directthe cooling air into cooling air passages, such as can be formed by aformed cast part as described herein, which can extend through anyportion of the turbine blade 106900. Some of the air that passes throughthe air passages can be exhausted through small film cooling holes106600 provided in the external surface of the aerofoil portion 106100,thereby providing cooling of that surface.

The remainder of the air can pass through any portion of the aerofoilportion 106100, thereby cooling it. When the remaining air finallyreaches the shroud 106300, some of that air can be exhausted radiallyoutwards through apertures extending through the shroud 106300. However,the remainder can be directed into a circumferentially extending passageprovided within the shroud 106300. The passage can be open at each ofits extents so that the passages of adjacent the turbine blade shrouds106300 can be in air flow communication with each other.

FIG. 107 is a schematic diagram of an exemplary embodiment of aturbo-machine 107000, which can comprise an inlet 107100, airfoils107200, vanes 107300, blades 107400, nozzles 107500, rotor 107600,and/or outlet or exhaust 107700. In certain exemplary embodiments,airfoils 107200 and/or blades 107400 can be attached to rotor 107600. Incertain exemplary embodiments, vanes 107300 and/or nozzles 107500 can beattached to a stator (not shown).

Certain exemplary embodiments can provide a composition, system,machine, device, manufacture, circuit, and/or user interface adaptedfor, and/or a method and/or machine-readable medium comprisingmachine-implementable instructions for, activities that can comprise:

-   -   via a predetermined and/or special purpose computer:        -   flattening a three-dimensional simulated model of a physical            unflattened cast part to define a three-dimensional            simulated model of a physical flattened cast part and to            make substantially planar a first major face of said            unflattened cast part model and a second major face of said            unflattened cast part model, wherein after said flattening,            a first plane substantially defining said first major face            is substantially parallel to a second plane substantially            defining said second major face;        -   after said flattening, defining a three-dimensional            simulated model of a physical mold adapted to form said            flattened cast part;        -   slicing said mold model into a plurality of mold model            layers;        -   outputting dimensional data associated with said plurality            of mold model layers, said dimensional data sufficient to            physically form a plurality of metallic foils stackable to            physically create said mold for said physical flattened cast            part;        -   creating said model of said unflattened cast part;        -   scaling said unflattened cast part model, said flattened            cast part model, and/or said mold model to account for            expected shrinkage of a molding composition used to            physically form said physical flattened cast part;        -   scaling said unflattened cast part model, said flattened            cast part model, and/or said mold model to account for            predetermined dimensional changes of said physical            unflattened cast part, said physical flattened cast part,            and/or said physical mold;        -   splitting said mold model to define a first mold portion            model and a second mold portion model, said first mold            portion model adapted to substantially mate with said second            mold portion model along a pull-plane adapted to facilitate            physical demolding of said flattened cast part from said            mold;        -   incorporating corresponding alignment features into said            first mold portion model and said second mold portion model;        -   incorporating inter-connecting part features into said mold            model;        -   incorporating mold venting features into said mold model;        -   incorporating flattened cast part handling features into            said mold model.

Certain exemplary embodiments can provide a composition, system,machine, device, manufacture, circuit, and/or user interface adaptedfor, and/or a method and/or machine-readable medium comprisingmachine-implementable instructions for, activities that can comprise:

-   -   outputting dimensional data associated with a plurality of        layers of a flat cast part mold model, said dimensional data        sufficient to physically form a plurality of metallic foils        stackable to physically create a physical flat cast part mold        for a physical flat cast part, said plurality of layers formed        by slicing said flat cast part mold model, said mold model a        three-dimensional simulated model of said flat cast part mold        model, said physical flat cast part mold adapted to form said        flat cast part, said flat cast part mold model a        three-dimensional simulated model of a physical flat cast part,        said flat cast part mold model formed from flattening a        three-dimensional simulated unflattened cast part model of a        physical unflattened cast part, said flattening making        substantially planar a first major face of said unflattened cast        part model and a second major face of said unflattened cast part        model, wherein after said flattening, a first plane        substantially defining said first major face is substantially        parallel to a second plane substantially defining said second        major face;    -   flattening said three-dimensional simulated unflattened cast        part model of said physical unflattened cast part;    -   defining said flat cast part mold model; and/or    -   slicing said flat cast part mold model into said plurality of        layers.

Certain exemplary embodiments can provide a molding compositioncomprising:

-   -   a ceramic composition comprising silica;    -   an cycloaliphatic epoxy binder composition, said cycloaliphatic        epoxy binder composition present in said molding composition in        an amount up to 30% by weight of said molding composition;    -   a silicone composition comprising a siloxane resin, said        silicone composition present in said molding composition in an        amount up to 30% by weight of said molding composition; and/or    -   a solvent composition adapted to dissolve said cycloaliphatic        epoxy binder composition and said silicone composition; wherein:        -   said ceramic composition comprises approximately 1 percent            to approximately 20 percent cristobalite by weight of said            ceramic composition;        -   said ceramic composition comprises zircon;        -   said ceramic composition comprises alumina; and/or        -   said epoxy binder composition and said silicone composition            are dissolvable via a predetermined solvent.

Certain exemplary embodiments can provide a composition, system,machine, device, manufacture, circuit, and/or user interface adaptedfor, and/or a method and/or machine-readable medium comprisingmachine-implementable instructions for, activities that can comprise:

-   -   causing crosslinking of at least a portion of a plurality of        cross-linkable molecules comprised by a predetermined molding        composition while said molding composition is located within a        stack-lamination-derived mold, said molding composition        comprising:        -   a ceramic composition comprising silica;        -   an cycloaliphatic epoxy binder composition, said            cycloaliphatic epoxy binder composition present in said            molding composition in an amount up to 30% by weight of said            molding composition;        -   a silicone composition comprising a siloxane resin, said            silicone composition present in said molding composition in            an amount up to 30% by weight of said molding composition;            and/or        -   a solvent composition adapted to dissolve said            cycloaliphatic epoxy binder composition and said silicone            composition;    -   causing cross-linking of at least a portion of a plurality of        cross-linkable molecules comprised by a molding composition        while said molding composition is within a        stack-lamination-derived mold;    -   mixing ingredients of said molding composition in said        stack-lamination-derived mold;    -   creating said molding composition in said        stack-lamination-derived mold;    -   filling said stack-lamination-derived mold with said molding        composition;    -   placing a photolithographically-derived foil structure into said        stack-lamination-derived mold such that a first alignment        feature of said foil structure interacts with a corresponding        second alignment feature formed in said stack-lamination-derived        mold, said foil structure comprising a plurality of apertures;    -   while said molding composition is present within said        stack-lamination-derived mold, placing an insert into said        molding composition;    -   while said molding composition is present within said        stack-lamination-derived mold, placing an insert into said        molding composition, said insert comprising an insert alignment        feature that aligns with a mold alignment feature comprised by        said stack-lamination-derived mold;    -   while said molding composition is present within said        stack-lamination-derived mold, placing a        photolithographically-derived insert into said molding        composition;    -   while said molding composition is present within said        stack-lamination-derived mold, vibrating said molding        composition;    -   while said molding composition is present within said        stack-lamination-derived mold, densifying particles of said        ceramic composition in said molding composition;    -   while said molding composition is present within said        stack-lamination-derived mold, applying a vacuum to said molding        composition;    -   while said molding composition is present within said        stack-lamination-derived mold, degassing said molding        composition;    -   while said molding composition is present within said        stack-lamination-derived mold, reducing a concentration of said        solvent composition in said molding composition;    -   while said molding composition is present within said        stack-lamination-derived mold, closing said        stack-lamination-derived mold;    -   while said molding composition is present within said        stack-lamination-derived mold, heating said molding composition;    -   while said molding composition is present within said        stack-lamination-derived mold, cooling said molding composition;    -   while said molding composition is present within said        stack-lamination-derived mold, opening said        stack-lamination-derived mold;    -   after said causing cross-linking, separating said molding        composition from said stack-lamination-derived mold;    -   after said causing cross-linking, separating a cast device from        said stack-lamination-derived mold;    -   after said causing cross-linking, pulling a cast device from        said stack-lamination-derived mold perpendicular to a pull-plane        of said stack-lamination-derived mold; and/or    -   after said causing cross-linking, applying a desired shape to a        cast device formed from said molding composition;    -   wherein said stack-lamination-derived mold is derived from a        photolithographically-generated stack-foil lamination mold;        and/or    -   wherein said stack-lamination-derived mold defines a plurality        of wall surfaces, a wall surface from said plurality of wall        surfaces comprising a plurality of 3-dimensional micro-features        that substantially spatially invertedly replicate an ancestor        mold surface defined by a plurality of layers of a metallic foil        stack lamination ancestor mold, said plurality of 3-dimensional        micro-features comprising at least one protruding undercut, said        plurality of wall surfaces defining a periphery of a layer-less        volume.

Certain exemplary embodiments can provide a composition, system,machine, device, manufacture, circuit, and/or user interface adaptedfor, and/or a method and/or machine-readable medium comprisingmachine-implementable instructions for, activities that can comprise:

-   -   filling a stack-lamination-derived mold with a molding        composition comprising a plurality of cross-linkable molecules,        such that said molding composition surrounds at least a portion        of a photolithographically-derived foil structure located within        said stack-lamination-derived mold, a first alignment feature of        said foil structure interfaced with a corresponding second        alignment feature formed in said mold, said foil structure        comprising a plurality of apertures, said molding composition        substantially filling said plurality of apertures.

Certain exemplary embodiments can provide a composition, system,machine, device, manufacture, circuit, and/or user interface adaptedfor, and/or a method and/or machine-readable medium comprisingmachine-implementable instructions for, activities that can comprise:

-   -   placing a photolithographically-derived foil structure into a        stack-lamination-derived mold such that a first alignment        feature of said foil structure interacts with a corresponding        second alignment feature formed in said mold, said foil        structure comprising a plurality of apertures;    -   filling said mold with a molding composition comprising a        plurality of cross-linkable molecules, such that said molding        composition fills said plurality of apertures and surrounds at        least a portion of said foil structure; and    -   causing cross-linking of at least a portion of said plurality of        cross-linkable molecules; wherein:    -   said foil structure comprises a single monolithic metallic foil;        and/or    -   said foil structure comprises a plurality of monolithic metallic        foils.

Certain exemplary embodiments can provide a composition, system,machine, device, manufacture, and/or circuit that can comprise:

-   -   a first planar surface, and    -   a thermoformable composition comprising:        -   a ceramic composition comprising silica;        -   an cycloaliphatic epoxy binder composition, said            cycloaliphatic epoxy binder composition present in said            thermoformable composition in an amount up to 30 percent by            weight of said thermoformable composition; and        -   a silicone composition comprising a siloxane resin, said            silicone composition present in said thermoformable            composition in an amount up to 30 percent by weight of said            device;    -   wherein said first planar surface is adapted to be transformed        into a non-planar surface via thermoforming said thermoformable        composition; wherein:    -   said ceramic composition comprises approximately 1 percent to        approximately 20 percent cristobalite by weight of said ceramic        composition;    -   said ceramic composition comprises zircon;    -   said ceramic composition comprises alumina; and/or    -   said epoxy binder composition and said silicone composition are        dissolvable via a predetermined solvent.

Certain exemplary embodiments can provide a system, machine, device,manufacture, circuit, and/or user interface that can comprise:

-   -   a device composition comprising:        -   a ceramic composition comprising silica;        -   an cycloaliphatic epoxy binder composition, said            cycloaliphatic epoxy binder composition present in said            molding composition in an amount up to 30% by weight of said            device composition; and/or        -   a silicone composition comprising a siloxane resin, said            silicone composition present in said molding composition in            an amount up to 30% by weight of said device composition;            wherein:        -   said system, machine, device, manufacture, circuit, and/or            user interface can be formed via a predetermined            stack-lamination-derived mold, said device defining a            plurality of wall surfaces, a wall surface from said            plurality of wall surfaces comprising a plurality of            3-dimensional micro-features that substantially spatially            invertedly replicate an ancestor mold surface defined by a            plurality of layers of a metallic foil stack lamination            ancestor mold, said plurality of 3-dimensional            micro-features comprising at least one protruding undercut,            said plurality of wall surfaces defining a periphery of a            layer-less volume.

Certain exemplary embodiments can provide a composition, system,machine, device, manufacture, circuit, and/or user interface adaptedfor, and/or a method and/or machine-readable medium comprisingmachine-implementable instructions for, activities that can comprise:

-   -   after removing a cast device from a stack-lamination-derived        mold, said cast device formed from a molding composition,        applying a desired shape to said cast device to form a shaped        cast device, said molding composition comprising:        -   a ceramic composition comprising silica;        -   an cycloaliphatic epoxy binder composition, said            cycloaliphatic epoxy binder composition present in said            molding composition in an amount up to 30% by weight of said            molding composition;        -   a silicone composition comprising a siloxane resin, said            silicone composition present in said molding composition in            an amount up to 30% by weight of said molding composition;            and/or        -   a solvent composition adapted to dissolve said            cycloaliphatic epoxy binder composition and said silicone            composition.

Certain exemplary embodiments can provide a composition, system,machine, device, manufacture, circuit, and/or user interface adaptedfor, and/or a method and/or machine-readable medium comprisingmachine-implementable instructions for, activities that can comprise:

-   -   after removing a cast device from a stack-lamination-derived        mold, said cast device comprising a reduced solvent version of a        herein described molding composition, applying a desired shape        to said cast device to form a shaped cast device;    -   removing said cast device from said stack-lamination-derived        mold;    -   prior to said applying a desired shape, aligning said cast        device with a shaping tool;    -   heating said shaped cast device;    -   cooling said shaped cast device;    -   firing said shaped cast device;    -   sintering particles of said ceramic composition in said shaped        cast device;    -   coupling said cast device to a part;    -   coupling said shaped cast device to a part;    -   casting investment material around said shaped cast device;    -   casting investment material around said shaped cast device to        form an investment cast part;    -   after casting investment material around said shaped cast device        to form an investment cast part, removing said shaped cast        device from said investment cast part; and/or    -   casting investment material around said shaped cast device to        form an investment cast part, said investment cast part defining        a plurality of wall surfaces, a wall surface from said plurality        of wall surfaces comprising a plurality of 3-dimensional        micro-features that substantially spatially invertedly replicate        an ancestor mold surface defined by a plurality of layers of a        metallic foil stack lamination ancestor mold, said plurality of        3-dimensional micro-features comprising at least one protruding        undercut, said plurality of wall surfaces defining a periphery        of a layer-less volume; wherein:        -   said cast device defines a plurality of wall surfaces, a            wall surface from said plurality of wall surfaces comprising            a plurality of 3-dimensional micro-features that            substantially spatially invertedly replicate an ancestor            mold surface defined by a plurality of layers of a metallic            foil stack lamination ancestor mold, said plurality of            3-dimensional micro-features comprising at least one            protruding undercut, said plurality of wall surfaces            defining a periphery of a layer-less volume.        -   said shaped cast device defines a plurality of wall            surfaces, a wall surface from said plurality of wall            surfaces comprising a plurality of 3-dimensional            micro-features that substantially spatially invertedly            replicate an ancestor mold surface defined by a plurality of            layers of a metallic foil stack lamination ancestor mold,            said plurality of 3-dimensional micro-features comprising at            least one protruding undercut, said plurality of wall            surfaces defining a periphery of a layer-less volume.

Certain exemplary embodiments can provide a system, machine, device,manufacture, circuit, and/or user interface that can comprise:

-   -   a ceramic composition comprising silica;    -   said system, machine, device, manufacture, circuit, and/or user        interface formed via a predetermined stack-lamination-derived        mold, said device defining a plurality of wall surfaces, a wall        surface from said plurality of wall surfaces comprising a        plurality of 3-dimensional micro-features that substantially        spatially invertedly replicate an ancestor mold surface defined        by a plurality of layers of a metallic foil stack lamination        ancestor mold, said plurality of 3-dimensional micro-features        comprising at least one protruding undercut, said plurality of        wall surfaces defining a periphery of a layer-less volume;        and/or    -   a photolithographically-derived foil structure substantially        surrounded by said ceramic composition; wherein:    -   said ceramic composition comprises approximately 1 percent to        approximately 20 percent cristobalite by weight of said ceramic        composition;    -   said ceramic composition comprises zircon;    -   said ceramic composition comprises alumina;    -   said device is an investment casting core;    -   said device is a core for an investment cast product;    -   said device is a core for an investment cast turbomachine        component;    -   said device is a core for an investment cast air foil;    -   said device is a core for an investment cast blade;    -   said device is a core for an investment cast vane;    -   said device is a core for an investment cast nozzle; and/or    -   said device defines a plurality of cooling passages for an        investment cast product.

Certain exemplary embodiments can provide a system, machine, device,manufacture, circuit, and/or user interface that can comprise:

-   -   a ceramic composition comprising silica; and    -   a photolithographically-derived foil structure substantially        surrounded by said ceramic composition; wherein:        -   said system, machine, device, manufacture, circuit, and/or            user interface can be formed via a predetermined            stack-lamination-derived mold, said device defining a            plurality of wall surfaces, a wall surface from said            plurality of wall surfaces comprising a plurality of            3-dimensional micro-features that substantially spatially            invertedly replicate an ancestor mold surface defined by a            plurality of layers of a metallic foil stack lamination            ancestor mold, said plurality of 3-dimensional            micro-features comprising at least one protruding undercut,            said plurality of wall surfaces defining a periphery of a            layer-less volume;        -   said device is a core for an investment cast product;        -   said device is a core for an investment cast turbomachine            component; and/or        -   said device is a core for an investment cast air foil.

Certain exemplary embodiments can provide a composition, system,machine, device, manufacture, circuit, and/or user interface adaptedfor, and/or a method and/or machine-readable medium comprisingmachine-implementable instructions for, activities that can comprise:

-   -   casting investment material around a shaped cast device to form        an investment cast part, said investment cast part defining a        plurality of wall surfaces, a wall surface from said plurality        of wall surfaces comprising a plurality of 3-dimensional        micro-features that substantially spatially invertedly replicate        an ancestor mold surface defined by a plurality of layers of a        metallic foil stack lamination ancestor mold, said plurality of        3-dimensional micro-features comprising at least one protruding        undercut, said plurality of wall surfaces defining a periphery        of a layer-less volume, said shaped cast device formed from a        flat cast device, said flat cast device formed from a molding        composition, said molding composition comprising:        -   a ceramic composition comprising silica;        -   an cycloaliphatic epoxy binder composition, said            cycloaliphatic epoxy binder composition present in said            molding composition in an amount up to 30% by weight of said            molding composition;        -   a silicone composition comprising a siloxane resin, said            silicone composition present in said molding composition in            an amount up to 30% by weight of said molding composition;            and/or        -   a solvent composition adapted to dissolve said            cycloaliphatic epoxy binder composition and said silicone            composition.

Certain exemplary embodiments can provide a composition, system,machine, device, manufacture, circuit, and/or user interface adaptedfor, and/or a method and/or machine-readable medium comprisingmachine-implementable instructions for, activities that can comprise:

-   -   casting investment material around a shaped cast device to form        an investment cast part, said investment cast part defining a        plurality of wall surfaces, a wall surface from said plurality        of wall surfaces comprising a plurality of 3-dimensional        micro-features that substantially spatially invertedly replicate        an ancestor mold surface defined by a plurality of layers of a        metallic foil stack lamination ancestor mold, said plurality of        3-dimensional micro-features comprising at least one protruding        undercut, said plurality of wall surfaces defining a periphery        of a layer-less volume, said shaped cast device formed from a        flat cast device.

Certain exemplary embodiments can provide a composition, system,machine, device, manufacture, circuit, and/or user interface adaptedfor, and/or a method and/or machine-readable medium comprisingmachine-implementable instructions for, activities that can comprise:

-   -   casting investment material around a shaped cast device to form        an investment cast part, said investment cast part defining a        plurality of wall surfaces, a wall surface from said plurality        of wall surfaces comprising a plurality of 3-dimensional        micro-features that substantially spatially invertedly replicate        an ancestor mold surface defined by a plurality of layers of a        metallic foil stack lamination ancestor mold, said plurality of        3-dimensional micro-features comprising at least one protruding        undercut, said plurality of wall surfaces defining a periphery        of a layer-less volume, said shaped cast device comprising:        -   a ceramic composition comprising silica; and/or        -   a silicone composition comprising a siloxane resin, said            silicone composition present in said molding composition in            an amount up to 30% by weight of said shaped cast device.

Certain exemplary embodiments can provide a system, machine, device,manufacture, circuit, and/or user interface that can comprise:

-   -   a first device formed via a predetermined        stack-lamination-derived mold, said first device defining a        plurality of wall surfaces, a wall surface from said plurality        of wall surfaces comprising a plurality of 3-dimensional        micro-features that substantially spatially invertedly replicate        an ancestor mold surface defined by a plurality of layers of a        metallic foil stack lamination ancestor mold, said plurality of        3-dimensional micro-features comprising at least one protruding        undercut, said plurality of wall surfaces defining a periphery        of a layer-less volume; and/or    -   a second device not formed via any stack-lamination-derived        mold, said second device operatively fastened to said first        device.

DEFINITIONS

When the following terms are used substantively herein, the accompanyingdefinitions apply. These terms and definitions are presented withoutprejudice, and, consistent with the application, the right to redefinethese terms via amendment during the prosecution of this application orany application claiming priority hereto is reserved. For the purpose ofinterpreting a claim of any patent that claims priority hereto, eachdefinition in that patent functions as a clear and unambiguous disavowalof the subject matter outside of that definition.

-   -   3-dimensional/three-dimensional—involving or relating to three        mutually orthogonal dimensions and/or definable via coordinates        relative to three mutually perpendicular axes.    -   a—at least one.    -   account—to accommodate, adjust for, and/or take into        consideration.    -   activity—an action, act, step, and/or process or portion        thereof.    -   adapted to—suitable, fit, and/or capable of performing a        specified function.    -   adjacent—in close proximity to, near, next to, and/or adjoining    -   after—subsequent to.    -   air foil—a body, cross-section of a body, and/or surface        designed to develop a desired force by reaction with a fluid        that is flowing across the surface. The cross sections of wings,        propeller blades, windmill blades, compressor and turbine blades        in a jet engine, and hydrofoils on a high-speed ship are        examples of airfoils.    -   align—to place objects such that at least some of their faces        are in line with each other and/or so that their centerlines are        on the same axis.    -   all—an entirety of a set.    -   along—through, on, beside, over, in line with, and/or parallel        to the length and/or direction of; and/or from one end to the        other of    -   alumina—aluminum oxide and/or Al₂O₃.    -   amount—a quantity.    -   ancestor—an entity from which another entity is descended; a        forebear, forerunner, predecessor, and/or progenitor.    -   and/or—either in conjunction with or in alternative to.    -   any—one, some, every, and/or all without specification.    -   aperture—an opening, hole, gap, passage, and/or slit.    -   apparatus—an appliance and/or device for a particular purpose.    -   applying—to put to use for a purpose.    -   approximately—about and/or nearly the same as.    -   around—about, surrounding, and/or on substantially all sides of.    -   associate—to join, connect together, accompany, and/or relate.    -   associated with—related to.    -   at least—not less than, and possibly more than.    -   attach—to fasten, secure, couple, and/or join.    -   automatically—acting or operating in a manner essentially        independent of external influence or control. For example, an        automatic light switch can turn on upon “seeing” a person in its        view, without the person manually operating the light switch.    -   between—in a separating interval and/or intermediate to.    -   bind—to combine chemically or form a chemical bond.    -   binder—a substance and/or something used to bind separate        particles together and/or facilitate adhesion.    -   blade—an arm of a rotating mechanism.    -   Boolean logic—a complete system for logical operations.    -   bound—to limit an extent.    -   can—is capable of, in at least some embodiments.    -   cast—(n) the process and/or act of casting; (adjective) formed        in a mold; (v) to form (e.g., wax, liquid polymer, and/or liquid        metal, etc.) into a particular shape by pouring into a mold and        allowing to solidify within the mold prior to removal from the        mold.    -   cause—to bring about, provoke, precipitate, produce, elicit, be        the reason for, result in, and/or effect.    -   ceramic—any of various hard, brittle, heat-resistant, and        corrosion-resistant materials made by shaping and then firing a        nonmetallic mineral, such as clay, at a high temperature, and/or        the nonmetallic mineral from which such materials can be formed,        such as, for example, silica, silicon carbide, alumina,        zirconium oxide, and/or fused silica, calcium sulfate,        luminescent optical ceramics, bio-ceramics, and/or plaster, etc.    -   change—(v.) to cause to be different; (n.) the act, process,        and/or result of altering or modifying.    -   channel—a defined passage, conduit, and/or groove for conveying        one or more fluids.    -   characterize—to define, describe, classify, and/or constrain the        qualities, characteristics, and/or peculiarities of.    -   circuit—a physical system comprising: an electrically conductive        pathway and/or a communications connection established across a        switching device (such as logic gates); and/or an electrically        conductive pathway and/or a communications connection        established across two or more switching devices comprised by a        network and between corresponding end systems connected to, but        not comprised by the network.    -   circular—round and/or having the shape of a circle.    -   close—to move (a door, for example) so that an opening or        passage is covered and/or obstructed; to shut; and/or to draw        and/or bind together.    -   component—a constituent element and/or part.    -   composition—a composition of matter and/or an aggregate,        mixture, reaction product, and/or result of combining two or        more substances.    -   compressive—pertaining to forces on a body or part of a body        that tend to crush and/or compress the body.    -   comprised—included in; a part of.    -   comprises—includes, but is not limited to, what follows.    -   comprising—including but not limited to.    -   concentration—a measure of the amount of dissolved substance        contained per unit of volume and/or the amount of a specified        substance in a unit amount of another substance.    -   configure—to make suitable or fit for a specific use or        situation.    -   connect—to join and/or fasten together.    -   containing—including but not limited to.    -   convert—to transform, adapt, and/or change.    -   cooling—reducing a temperature of a substance.    -   core—a substantially innermost and/or central, and potentially        removable, object around which another material will be cast.    -   corresponding—related, associated, accompanying, similar in        purpose and/or position, conforming in every respect, and/or        equivalent and/or agreeing in amount, quantity, magnitude,        quality, and/or degree.    -   coupling—(n) a device adapted to join, connect, and/or link. (v)        joining, connecting, and/or linking    -   create—to make, form, produce, generate, bring into being,        and/or cause to exist.    -   cristobalite—a crystalline form of silica that tends to be        stable at high temperatures and/or a polymorph of quartz.    -   cross-link—to join (adjacent chains of a polymer or protein) by        creating covalent bonds.    -   cycloaliphatic—of, relating to, and/or being an organic compound        that contains a ring but is not aromatic.    -   data—distinct pieces of information, usually formatted in a        special or predetermined way and/or organized to express        concepts, and/or represented in a form suitable for processing        by an information device.    -   data structure—an organization of a collection of data that        allows the data to be manipulated effectively and/or a logical        relationship among data elements that is designed to support        specific data manipulation functions. A data structure can        comprise meta data to describe the properties of the data        structure. Examples of data structures can include: array,        dictionary, graph, hash, heap, linked list, matrix, object,        queue, ring, stack, tree, and/or vector.    -   define—to establish the meaning, relationship, outline, form,        and/or structure of; and/or to precisely and/or distinctly        describe and/or specify.    -   demold—to remove from a mold.    -   densify—to increase the density of.    -   derive—to obtain from a source.    -   desired—indicated, expressed, and/or requested.    -   determine—to obtain, calculate, decide, deduce, and/or        ascertain.    -   device—a machine, manufacture, and/or collection thereof.    -   differ—to be unlike, dissimilar, and/or distinct in nature        and/or quality.    -   digital—non-analog and/or discrete.    -   dimension—an extension in a given direction and/or a measurement        in length, width, or thickness.    -   direction—a spatial relation between something and a course        along which it points and/or moves; a distance independent        relationship between two points in space that specifies the        position of either with respect to the other; and/or a        relationship by which the alignment and/or orientation of any        position with respect to any other position is established.    -   dissolve—to cause to pass into solution.    -   each—every one of a group considered individually.    -   embodiment—an implementation and/or a concrete representation of        a concept.    -   epoxy—having the structure of an epoxide; of and/or containing        an oxygen atom joined to two different groups that are        themselves joined to other groups; any of a class of resins        derived by polymerization from epoxides: used chiefly in        adhesives, coatings, electrical insulation, solder mix, and/or        castings; and/or any of various usually thermosetting resins        capable of forming tight cross-linked polymer structures        characterized by toughness, strong adhesion, and low shrinkage,        used especially in surface coatings and adhesives.    -   exemplary—serving as a model.    -   expected—predicted.    -   extending—existing, located, placed, and/or stretched        lengthwise.    -   face—the most significant or prominent surface of an object.    -   facilitate—to encourage and/or allow.    -   fasten—to attach to something else and/or to hold something in        place.    -   feature—a prominent and/or distinctive aspect, structure,        component, quality, and/or characteristic.    -   fill—to supply, introduce into, and/or put into a container,        potentially to the fullest extent of the container.    -   fillet—concave easing of an interior corner of a part design.    -   fire—to bake in a kiln and/or dry by heating.    -   first—an initial entity in an ordering of entities; immediately        preceding the second in an ordering.    -   flat—having a substantially planar major face and/or having a        relatively broad surface in relation to thickness or depth.    -   flatten—to make flat.    -   foil—a very thin, often flexible sheet and/of leaf, typically        formed of metal.    -   form—to make, create, generate, construct, and/or shape.    -   formations—concave and/or convex elements on a surface; dimples;    -   and/or protrusions.    -   from—used to indicate a source.    -   further—in addition.    -   generate—to create, produce, render, give rise to, and/or bring        into existence.    -   handling—of and/or relating to manual (and/or mechanical)        carrying, moving, delivering, and/or working with something.    -   haptic—involving the human sense of kinesthetic movement and/or        the human sense of touch. Among the many potential haptic        experiences are numerous sensations, body-positional differences        in sensations, and time-based changes in sensations that are        perceived at least partially in non-visual, non-audible, and        non-olfactory manners, including the experiences of tactile        touch (being touched), active touch, grasping, pressure,        friction, traction, slip, stretch, force, torque, impact,        puncture, vibration, motion, acceleration, jerk, pulse,        orientation, limb position, gravity, texture, gap, recess,        viscosity, pain, itch, moisture, temperature, thermal        conductivity, and thermal capacity.    -   having—possessing, characterized by, and/or comprising.    -   heating—transferring energy from one substance to another        resulting in an increase in temperature of one substance.    -   human-machine interface—hardware and/or software adapted to        render information to a user and/or receive information from the        user; and/or a user interface.    -   including—having, but not limited to, what follows.    -   incorporating—causing to comprise.    -   information device—any device capable of processing data and/or        information, such as any general purpose and/or special purpose        computer, such as a personal computer, workstation, server,        minicomputer, mainframe, supercomputer, computer terminal,        laptop, wearable computer, and/or Personal Digital Assistant        (PDA), mobile terminal, Bluetooth device, communicator, “smart”        phone (such as an iPhone and/or Treo-like device), messaging        service (e.g., Blackberry) receiver, pager, facsimile, cellular        telephone, a traditional telephone, telephonic device, a        programmed microprocessor or microcontroller and/or peripheral        integrated circuit elements, an ASIC or other integrated        circuit, a hardware electronic logic circuit such as a discrete        element circuit, and/or a programmable logic device such as a        PLD, PLA, FPGA, or PAL, or the like, etc. In general any device        on which resides a finite state machine capable of implementing        at least a portion of a method, structure, and/or or graphical        user interface described herein may be used as an information        device. An information device can comprise components such as        one or more network interfaces, one or more processors, one or        more memories containing instructions, and/or one or more        input/output (I/O) devices, one or more user interfaces coupled        to an I/O device, etc.    -   ingredient—an element and/or component in a mixture, compound,        and/or composition.    -   input/output (I/O) device—any sensory-oriented input and/or        output device, such as an audio, visual, haptic, olfactory,        and/or taste-oriented device, including, for example, a monitor,        display, projector, overhead display, keyboard, keypad, mouse,        trackball, joystick, gamepad, wheel, touchpad, touch panel,        pointing device, microphone, speaker, video camera, camera,        scanner, printer, haptic device, vibrator, tactile simulator,        and/or tactile pad, potentially including a port to which an I/O        device can be attached or connected.    -   insert—to put or introduce into.    -   install—to connect or set in position and prepare for use.    -   instructions—directions, which can be implemented as firmware        and/or software, the directions adapted to perform a particular        operation or function.    -   integral—formed or united into another entity.    -   interact—to act on each other.    -   inter-connecting—joined and/or fastened together reciprocally        and/or with each other.    -   interface—(n) a boundary across which two independent systems        meet and act on and/or communicate with each other. (v) to        connect with and/or interact with by way of an interface.    -   interlock—(v) to fit, connect, unite, lock, and/or join together        and/or closely in a non-destructively and/or destructively        releasable manner; (n) a device for non-destructively and/or        destructively releasably preventing substantial relative motion        between two elements of a structure.    -   intersection—a point and/or line segment defined by the meeting        of two or more items.    -   into—to a condition, state, or form of invert—to reverse the        position, order, condition, nature, and/or effect of        invertedly—in an reversed and/or opposing position, order,        condition, nature, and/or effect.    -   investment casting—a forming technique and/or process that        offers repeatable production of net shape components, typically        with minutely precise details, from a variety of initially        molten metals and/or high-performance alloys.    -   investment material—a material from which investment castings        are formed.    -   isogrid—a structural arrangement formed of a lattice of        intersecting ligaments that define one or more arrays of        triangular spaces.    -   isogrid positioner—a mechanical, optical, and/or magnetic        feature adapted to constrain, locate, and/or align the position        of one isogrid relative to an adjacent isogrid.    -   isogrid stacking positioner—a mechanical, optical, and/or        magnetic feature adapted to constrain, locate, and/or align the        position of a first isogrid relative to an adjacent second        isogrid whose lattice spans in a substantially parallel, but        non-coplanar, flat and/or curved plane as the first isogrid.    -   isogrid tiling positioner—a mechanical, optical, and/or magnetic        feature adapted to constrain, locate, and/or align the position        of a first isogrid relative to an adjacent second isogrid whose        lattice spans in substantially the same flat and/or curved plane        as the first isogrid.    -   laminate—to construct from layers of material bonded together.    -   lamination—a bonded, adhered, and/or attached structure and/or        arrangement, typically formed of thin sheets; and/or a laminated        structure and/or arrangement.    -   layer—a single thickness of a material covering a surface or        forming an overlying part or segment; a ply, strata, and/or        sheet.    -   layer-less—not formed of, and/or lacking a collection and/or        stack of, plies, strata, and/or sheets.    -   less than—having a measurably smaller magnitude and/or degree as        compared to something else.    -   ligament—a connecting member such as a wall, beam, and/or rib.    -   link—(n) a chemical bond, such as a covalent bond; (v) to bond        chemically, such as via covalent bond.    -   located—situated in a particular spot and/or position.    -   logic gate—a physical device adapted to perform a logical        operation on one or more logic inputs and to produce a single        logic output, which is manifested physically. Because the output        is also a logic-level value, an output of one logic gate can        connect to the input of one or more other logic gates, and via        such combinations, complex operations can be performed. The        logic normally performed is Boolean logic and is most commonly        found in digital circuits. The most common implementations of        logic gates are based on electronics using resistors,        transistors, and/or diodes, and such implementations often        appear in large arrays in the form of integrated circuits        (a.k.a., IC's, microcircuits, microchips, silicon chips, and/or        chips). It is possible, however, to create logic gates that        operate based on vacuum tubes, electromagnetics (e.g., relays),        mechanics (e.g., gears), fluidics, optics, chemical reactions,        and/or DNA, including on a molecular scale. Each        electronically-implemented logic gate typically has two inputs        and one output, each having a logic level or state typically        physically represented by a voltage. At any given moment, every        terminal is in one of the two binary logic states (“false”        (a.k.a., “low” or “0”) or “true” (a.k.a., “high” or “1”),        represented by different voltage levels, yet the logic state of        a terminal can, and generally does, change often, as the circuit        processes data. Thus, each electronic logic gate typically        requires power so that it can source and/or sink currents to        achieve the correct output voltage. Typically,        machine-implementable instructions are ultimately encoded into        binary values of “0”s and/or “1”s and, are typically written        into and/or onto a memory device, such as a “register”, which        records the binary value as a change in a physical property of        the memory device, such as a change in voltage, current, charge,        phase, pressure, weight, height, tension, level, gap, position,        velocity, momentum, force, temperature, polarity, magnetic        field, magnetic force, magnetic orientation, reflectivity,        molecular linkage, molecular weight, etc. An exemplary register        might store a value of “01101100”, which encodes a total of 8        “bits” (one byte), where each value of either “0” or “1” is        called a “bit” (and 8 bits are collectively called a “byte”).        Note that because a binary bit can only have one of two        different values (either “0” or “1”), any physical medium        capable of switching between two saturated states can be used to        represent a bit. Therefore, any physical system capable of        representing binary bits is able to represent numerical        quantities, and potentially can manipulate those numbers via        particular encoded machine-implementable instructions. This is        one of the basic concepts underlying digital computing. At the        register and/or gate level, a computer does not treat these “0”s        and “1”s as numbers per se, but typically as voltage levels (in        the case of an electronically-implemented computer), for        example, a high voltage of approximately +3 volts might        represent a “1” or “logical true” and a low voltage of        approximately 0 volts might represent a “0” or “logical false”        (or vice versa, depending on how the circuitry is designed).        These high and low voltages (or other physical properties,        depending on the nature of the implementation) are typically fed        into a series of logic gates, which in turn, through the correct        logic design, produce the physical and logical results specified        by the particular encoded machine-implementable instructions.        For example, if the encoding request a calculation, the logic        gates might add the first two bits of the encoding together,        produce a result “1” (“0”+“1”=“1”), and then write this result        into another register for subsequent retrieval and reading. Or,        if the encoding is a request for some kind of service, the logic        gates might in turn access or write into some other registers        which would in turn trigger other logic gates to initiate the        requested service.    -   logical—a conceptual representation.    -   machine-implementable instructions—directions adapted to cause a        machine, such as an information device, to perform one or more        particular activities, operations, and/or functions. The        directions, which can sometimes form an entity called a        “processor”, “kernel”, “operating system”, “program”,        “application”, “utility”, “subroutine”, “script”, “macro”,        “file”, “project”, “module”, “library”, “class”, and/or        “object”, etc., can be embodied and/or encoded as machine code,        source code, object code, compiled code, assembled code,        interpretable code, and/or executable code, etc., in hardware,        firmware, and/or software.    -   machine-readable medium—a physical structure from which a        machine, such as an information device, computer,        microprocessor, and/or controller, etc., can store and/or obtain        machine-implementable instructions, data, and/or information.        Examples include a memory device, punch cards, etc.    -   major—relatively great in size or extent.    -   make—to create, generate, build, and/or construct.    -   mate—to join closely and/or pair.    -   material—a substance and/or composition.    -   may—is allowed and/or permitted to, in at least some        embodiments.    -   measured—determined, as a dimension, quantification, and/or        capacity, etc. by observation.    -   memory device—an apparatus capable of storing, sometimes        permanently, machine-implementable instructions, data, and/or        information, in analog and/or digital format. Examples include        at least one non-volatile memory, volatile memory, register,        relay, switch, Random Access Memory, RAM, Read Only Memory, ROM,        flash memory, magnetic media, hard disk, floppy disk, magnetic        tape, optical media, optical disk, compact disk, CD, digital        versatile disk, DVD, and/or raid array, etc. The memory device        can be coupled to a processor and/or can store and provide        instructions adapted to be executed by processor, such as        according to an embodiment disclosed herein.    -   metallic—comprising a metal.    -   method—one or more acts that are performed upon subject matter        to be transformed to a different state or thing and/or are tied        to a particular apparatus, said one or more acts not a        fundamental principal and not pre-empting all uses of a        fundamental principal.    -   micro-features—irregularities, such as ridges and/or valleys,        forming a roughness average on a surface of between        approximately 1 microns and approximately 500 microns.    -   misaligned—to place out of alignment and/or to offset.    -   mix—to create and/or form by combining and/or blending        ingredients.    -   model—a mathematical and/or schematic description of an entity        and/or system.    -   mold—(n) a substantially hollow form, cavity, and/or matrix into        and/or on which a molten, liquid, and/or plastic composition is        placed and from which that composition takes form in a reverse        image from that of the mold; (v) to shape and/or form in and/or        on a mold.    -   molecule—the smallest particle of a substance that retains the        chemical and physical properties of the substance and is        composed of two or more atoms; and/or a group of like or        different atoms held together by chemical forces.    -   monolithic—constituting and/or acting as a single, substantially        uniform and/or unbroken, whole.    -   network—a communicatively coupled plurality of nodes,        communication devices, and/or information devices. Via a        network, such nodes and/or devices can be linked, such as via        various wireline and/or wireless media, such as cables,        telephone lines, power lines, optical fibers, radio waves,        and/or light beams, etc., to share resources (such as printers        and/or memory devices), exchange files, and/or allow electronic        communications therebetween. A network can be and/or can utilize        any of a wide variety of sub-networks and/or protocols, such as        a circuit switched, public-switched, packet switched,        connection-less, wireless, virtual, radio, data, telephone,        twisted pair, POTS, non-POTS, DSL, cellular, telecommunications,        video distribution, cable, terrestrial, microwave, broadcast,        satellite, broadband, corporate, global, national, regional,        wide area, backbone, packet-switched TCP/IP, IEEE 802.03,        Ethernet, Fast Ethernet, Token Ring, local area, wide area, IP,        public Internet, intranet, private, ATM, Ultra Wide Band (UWB),        Wi-Fi, BlueTooth, Airport, IEEE 802.11, IEEE 802.11a, IEEE        802.11b, IEEE 802.11g, X-10, electrical power, multi-domain,        and/or multi-zone sub-network and/or protocol, one or more        Internet service providers, one or more network interfaces,        and/or one or more information devices, such as a switch,        router, and/or gateway not directly connected to a local area        network, etc., and/or any equivalents thereof.    -   network interface—any physical and/or logical device, system,        and/or process capable of coupling an information device to a        network. Exemplary network interfaces comprise a telephone,        cellular phone, cellular modem, telephone data modem, fax modem,        wireless transceiver, communications port, ethernet card, cable        modem, digital subscriber line interface, bridge, hub, router,        or other similar device, software to manage such a device,        and/or software to provide a function of such a device.    -   node—a junctions and/or intersection of a plurality of        non-co-linear ligaments.    -   non—not.    -   not—a negation of something.    -   nozzle—a burner structured and/or utilized such that combustible        gas issues therefrom to form a steady flame; a short tube,        usually tapering, forming the vent of a pipe-like structure;        and/or a component that produces thrust by converting the        thermal energy of hot chamber gases into kinetic energy and        directing that energy along the nozzle's longitudinal axis.    -   offsetably—characterized by a misalignment, jog, and/or short        displacement in an otherwise parallel and/or straight        orientation and/or arrangement.    -   open—to release from a closed and/or fastened position, to        remove obstructions from, and/or to clear.    -   orthogonal—perpendicular.    -   output—(n) something produced and/or generated; data produced by        an information device executing machine-readable instructions;        and/or the energy, power, work, signal, and/or information        produced by a system. (v) to provide, produce, manufacture,        and/or generate.    -   overlappingly—characterized by extending over and covering a        part of something else.    -   packet—a generic term for a bundle of data organized in a        specific way for transmission, such as within and/or across a        network, such as a digital packet-switching network, and        comprising the data to be transmitted and certain control        information, such as a destination address.    -   parallel—of, relating to, or designating lines, curves, planes,        and/or or surfaces everywhere equidistant and/or an arrangement        of components in an electrical circuit that splits an electrical        current into two or more paths.    -   parent—an entity from which another is descended; and/or a        source, origin, and/or cause.    -   part—component.    -   particle—a small piece or part. A particle can be and/or be        comprised by a powder, bead, crumb, crystal, dust, grain, grit,        meal, pounce, pulverulence, and/or seed, etc.    -   passage—a path, channel, and/or duct through, over, and/or along        which something may pass.    -   percent—one part in one hundred.    -   perceptible—capable of being perceived by the human senses.    -   periphery—the outer limits, surface, and/or boundary of a        surface, area, and/or object.    -   perpendicular—intersecting at and/or forming substantially right        angles.    -   photolithography—a process whereby metallic foils, fluidic        circuits, and/or printed circuits can be created by exposing a        photosensitive substrate to a pattern, such as a predesigned        structural pattern and/or a circuit pattern, and chemically        etching away either the exposed or unexposed portion of the        substrate.    -   physical—tangible, real, and/or actual.    -   physically—existing, happening, occurring, acting, and/or        operating in a manner that is tangible, real, and/or actual.    -   place—to put in a particular place and/or position.    -   planar—shaped as a substantially flat two-dimensional surface.    -   plane—a substantially flat surface and/or a surface containing        all the straight lines that connect any two points on it.    -   plurality—the state of being plural and/or more than one.    -   portion—a part, component, section, percentage, ratio, and/or        quantity that is less than a larger whole. Can be visually,        physically, and/or virtually distinguishable and/or        non-distinguishable.    -   predetermined—established in advance.    -   present—to introduce, provide, show, display and/or offer for        consideration.    -   prior—before    -   processor—a hardware, firmware, and/or software machine and/or        virtual machine physically adaptable to perform, via boolean        logic operating on a plurality of logic gates, a specific task        defined by a set of machine-implementable instructions. A        processor can utilize mechanical, pneumatic, hydraulic,        electrical, magnetic, optical, informational, chemical, and/or        biological principles, mechanisms, adaptations, signals, inputs,        and/or outputs to perform the task(s). In certain embodiments, a        processor can act upon information by manipulating, analyzing,        modifying, and/or converting it, transmitting the information        for use by machine-implementable instructions and/or an        information device, and/or routing the information to an output        device. A processor can function as a central processing unit,        local controller, remote controller, parallel controller, and/or        distributed controller, etc. Unless stated otherwise, the        processor can be a general-purpose device, such as a        microcontroller and/or a microprocessor, such the Pentium family        of microprocessor manufactured by the Intel Corporation of Santa        Clara, Calif. In certain embodiments, the processor can be        dedicated purpose device, such as an Application Specific        Integrated Circuit (ASIC) or a Field Programmable Gate Array        (FPGA) that has been designed to implement in its hardware        and/or firmware at least a part of an embodiment disclosed        herein. A processor can reside on and use the capabilities of a        controller.    -   product—something produced by human or mechanical effort or by a        natural process.    -   protrude—to bulge, jut, project, and/or extend out and/or into        space.    -   protrusion—that which protrudes.    -   provide—to furnish, supply, give, convey, send, and/or make        available.    -   pull—to remove from a fixed position, to extract, and/or to        apply force to so as to cause and/or tend to cause motion toward        the source of the force.    -   pull-plane—a plane along and/or perpendicular to which a cast        device is adapted to be urged to withdraw the cast device from a        mold without substantial damage to the cast device and/or mold.    -   radius—the length of a line segment between the center and        circumference of a circle or sphere.    -   reduce—to make and/or become lesser and/or smaller.    -   remove—to eliminate, remove, and/or delete, and/or to move from        a place or position occupied.    -   render—to, e.g., physically, chemically, biologically,        electronically, electrically, magnetically, optically,        acoustically, fluidically, and/or mechanically, etc., transform        information into a form perceptible to a human as, for example,        data, commands, text, graphics, audio, video, animation, and/or        hyperlinks, etc., such as via a visual, audio, and/or haptic,        etc., means and/or depiction, such as via a display, monitor,        electric paper, ocular implant, cochlear implant, speaker,        vibrator, shaker, force-feedback device, stylus, joystick,        steering wheel, glove, blower, heater, cooler, pin array,        tactile touchscreen, etc.    -   repeatedly—again and again; repetitively.    -   replicate—to make a substantially identical copy, duplicate,        reproduction, and/or repetition of something.    -   resin—any of numerous physically similar polymerized synthetics        and/or chemically modified natural resins including        thermoplastic materials such as polyvinyl, polystyrene, and        polyethylene, and thermosetting materials such as polyesters,        epoxies, and silicones that are used with fillers, stabilizers,        pigments, and/or other components to form plastics.    -   said—when used in a system or device claim, an article        indicating a subsequent claim term that has been previously        introduced.    -   scale—(n) a progressive classification, such as of size, amount,        importance, and/or rank; (v) to increase or reduce        proportionately in size.    -   second—immediately following the first in an ordering.    -   select—to make a choice or selection from alternatives.    -   separate—(n) distinct; (v) to disunite, space, set, or keep        apart and/or to be positioned intermediate to.    -   server—an information device and/or a process running thereon,        that is adapted to be communicatively coupled to a network and        that is adapted to provide at least one service for at least one        client, i.e., for at least one other information device        communicatively coupled to the network and/or for at least one        process running on another information device communicatively        coupled to the network. One example is a file server, which has        a local drive and services requests from remote clients to read,        write, and/or manage files on that drive. Another example is an        e-mail server, which provides at least one program that accepts,        temporarily stores, relays, and/or delivers e-mail messages.        Still another example is a database server, which processes        database queries. Yet another example is a device server, which        provides networked and/or programmable: access to, and/or        monitoring, management, and/or control of, shared physical        resources and/or devices, such as information devices, printers,        modems, scanners, projectors, displays, lights, cameras,        security equipment, proximity readers, card readers, kiosks,        POS/retail equipment, phone systems, residential equipment, HVAC        equipment, medical equipment, laboratory equipment, industrial        equipment, machine tools, pumps, fans, motor drives, scales,        programmable logic controllers, sensors, data collectors,        actuators, alarms, annunciators, and/or input/output devices,        etc.    -   set—a related plurality of predetermined elements; and/or one or        more distinct items and/or entities having a specific common        property or properties.    -   shape—(v) to apply a characteristic surface, outline, and/or        contour to an entity.    -   shape—a characteristic surface, outline, and/or contour of an        entity.    -   shear—a deformation resulting from stresses that cause        contiguous parts of a body to slide relatively to each other in        a direction parallel to their plane of contact; a deformation of        an object in which parallel planes remain parallel but are        shifted in a direction parallel to themselves; “the shear        changed the quadrilateral into a parallelogram”.    -   sheet—a broad, relatively thin, surface, layer, and/or covering    -   shrinkage—the process of shrinking and/or the amount or        proportion by which something shrinks    -   signal—automatically detectable variations in a physical        variable, such as a pneumatic, hydraulic, acoustic, fluidic,        mechanical, electrical, magnetic, optical, chemical, and/or        biological variable, such as power, energy, pressure, flowrate,        viscosity, density, torque, impact, force, frequency, phase,        voltage, current, resistance, magnetomotive force, magnetic        field intensity, magnetic field flux, magnetic flux density,        reluctance, permeability, index of refraction, optical        wavelength, polarization, reflectance, transmittance, phase        shift, concentration, and/or temperature, etc., that encode        information, such as machine-implementable instructions for        activities and/or one or more letters, words, characters,        symbols, signal flags, visual displays, and/or special sounds,        etc., having prearranged meaning Depending on the context, a        signal and/or the information encoded therein can be        synchronous, asynchronous, hard real-time, soft real-time,        non-real time, continuously generated, continuously varying,        analog, discretely generated, discretely varying, quantized,        digital, broadcast, multicast, unicast, transmitted, conveyed,        received, continuously measured, discretely measured, processed,        encoded, encrypted, multiplexed, modulated, spread, de-spread,        demodulated, detected, de-multiplexed, decrypted, and/or        decoded, etc.    -   silica—silicon dioxide (SiO₂), which is a hard, glossy, white,        and/or colorless crystalline compound and/or mineral, which        occurs naturally and/or abundantly as quartz, quartz, sand,        flint, agate, and many other minerals, and used to manufacture a        wide variety of materials, especially glass and concrete.    -   silicone—any of a class and/or group of chemical compounds        and/or semi-inorganic polymers based on the structural unit        R₂SiO, where R is an organic group and/or radical, such as a        methyl (CH₃) group and/or a phenyl (C₆H₅) group, typically        characterized by wide-range thermal stability, high lubricity,        extreme water repellence, and/or physiological inertness, often        used in adhesives, lubricants, protective coatings, paints,        electrical insulation, synthetic rubber, and/or prosthetic        replacements for body parts.    -   siloxane—any of a class of organic and/or inorganic chemical        compounds of silicon, oxygen, and usually carbon and hydrogen,        based on the structural unit R₂SiO, where R is an alkyl group,        usually methyl.    -   simulated—created as a representation or model of another thing.    -   single—existing alone or consisting of one entity.    -   sinter—to cause (e.g., a ceramic and/or metallic powder) to form        a coherent mass by heating without melting.    -   slice—(n) a thin broad piece cut from a larger three dimensional        object; (v) to cut and/or divide a three dimensional object into        slices.    -   solvent—a substance in which another substance is dissolved,        forming a solution; and/or a substance, usually a liquid,        capable of dissolving another substance.    -   space—an area and/or volume.    -   spatial—relating to an area or volume.    -   spatially—existing or occurring in space.    -   special purpose computer—a computer and/or information device        comprising a processor device having a plurality of logic gates,        whereby at least a portion of those logic gates, via        implementation of specific machine-implementable instructions by        the processor, experience a change in at least one physical and        measurable property, such as a voltage, current, charge, phase,        pressure, weight, height, tension, level, gap, position,        velocity, momentum, force, temperature, polarity, magnetic        field, magnetic force, magnetic orientation, reflectivity,        molecular linkage, molecular weight, etc., thereby directly        tying the specific machine-implementable instructions to the        logic gate's specific configuration and property(ies). In the        context of an electronic computer, each such change in the logic        gates creates a specific electrical circuit, thereby directly        tying the specific machine-implementable instructions to that        specific electrical circuit.    -   special purpose processor—a processor device, having a plurality        of logic gates, whereby at least a portion of those logic gates,        via implementation of specific machine-implementable        instructions by the processor, experience a change in at least        one physical and measurable property, such as a voltage,        current, charge, phase, pressure, weight, height, tension,        level, gap, position, velocity, momentum, force, temperature,        polarity, magnetic field, magnetic force, magnetic orientation,        reflectivity, molecular linkage, molecular weight, etc., thereby        directly tying the specific machine-implementable instructions        to the logic gate's specific configuration and property(ies). In        the context of an electronic computer, each such change in the        logic gates creates a specific electrical circuit, thereby        directly tying the specific machine-implementable instructions        to that specific electrical circuit.    -   split—to break, divide, and/or separate into separate pieces.    -   stack—(n) a substantially orderly pile and/or group, especially        one arranged in and/or defined by layers; (v) to place and/or        arrange in a stack.    -   store—to place, hold, and/or retain data, typically in a memory.    -   strength—a measure of the ability of a material to support a        load; the maximum nominal stress a material can sustain; and/or        a level of stress at which there is a significant change in the        state of the material, e.g., yielding and/or rupture.    -   structure—that which is complexly constructed and/or a manner in        which components are organized and/or form a whole.    -   sub-plurality—a subset.    -   substantially—to a considerable, large, and/or great, but not        necessarily whole and/or entire, extent and/or degree.    -   sufficiently—to a degree necessary to achieve a predetermined        result.    -   support—to bear the weight of, especially from below.    -   surface—any face and/or outer boundary of a body, object, and/or        thing    -   surround—to encircle, enclose, and/or confine on several and/or        all sides.    -   system—a collection of mechanisms, devices, machines, articles        of manufacture, processes, data, and/or instructions, the        collection designed to perform one or more specific functions.    -   tensile—pertaining to forces on a body that tend to stretch, or        elongate, the body. A rope or wire under load is subject to        tensile forces.    -   terminate—to end.    -   thermoform—to shape (especially plastic) by the use of heat and        pressure.    -   thickness—the measure of the smallest dimension of a solid        figure.    -   through—in one side and out the opposite or another side of,        across, among, and/or between.    -   tool—something used to accomplish a task.    -   transform—to change in measurable: form, appearance, nature,        and/or character.    -   transmit—to send as a signal, provide, furnish, and/or supply.    -   triangular—pertaining to or having the form of a triangle;        three-cornered.    -   turbomachine—a device in which energy is transferred to and/or        from a continuously flowing fluid by dynamic interaction of the        fluid with one or more moving and/or rotating blade rows, such        as a turbine (e.g., windmill, water wheel, hydroelectric        turbine, automotive engine turbocharger, and/or gas turbine,        etc.) and/or an impeller (e.g., liquid pump, fan, blower, and/or        compressor, etc.).    -   undercut—a notch, groove, and/or cut beneath.    -   user interface—any device for rendering information to a user        and/or requesting information from the user. A user interface        includes at least one of textual, graphical, audio, video,        animation, and/or haptic elements. A textual element can be        provided, for example, by a printer, monitor, display,        projector, etc. A graphical element can be provided, for        example, via a monitor, display, projector, and/or visual        indication device, such as a light, flag, beacon, etc. An audio        element can be provided, for example, via a speaker, microphone,        and/or other sound generating and/or receiving device. A video        element or animation element can be provided, for example, via a        monitor, display, projector, and/or other visual device. A        haptic element can be provided, for example, via a very low        frequency speaker, vibrator, tactile stimulator, tactile pad,        simulator, keyboard, keypad, mouse, trackball, joystick,        gamepad, wheel, touchpad, touch panel, pointing device, and/or        other haptic device, etc. A user interface can include one or        more textual elements such as, for example, one or more letters,        number, symbols, etc. A user interface can include one or more        graphical elements such as, for example, an image, photograph,        drawing, icon, window, title bar, panel, sheet, tab, drawer,        matrix, table, form, calendar, outline view, frame, dialog box,        static text, text box, list, pick list, pop-up list, pull-down        list, menu, tool bar, dock, check box, radio button, hyperlink,        browser, button, control, palette, preview panel, color wheel,        dial, slider, scroll bar, cursor, status bar, stepper, and/or        progress indicator, etc. A textual and/or graphical element can        be used for selecting, programming, adjusting, changing,        specifying, etc. an appearance, background color, background        style, border style, border thickness, foreground color, font,        font style, font size, alignment, line spacing, indent, maximum        data length, validation, query, cursor type, pointer type,        autosizing, position, and/or dimension, etc. A user interface        can include one or more audio elements such as, for example, a        volume control, pitch control, speed control, voice selector,        and/or one or more elements for controlling audio play, speed,        pause, fast forward, reverse, etc. A user interface can include        one or more video elements such as, for example, elements        controlling video play, speed, pause, fast forward, reverse,        zoom-in, zoom-out, rotate, and/or tilt, etc. A user interface        can include one or more animation elements such as, for example,        elements controlling animation play, pause, fast forward,        reverse, zoom-in, zoom-out, rotate, tilt, color, intensity,        speed, frequency, appearance, etc. A user interface can include        one or more haptic elements such as, for example, elements        utilizing tactile stimulus, force, pressure, vibration, motion,        displacement, temperature, etc.    -   vacuum—a pressure that is significantly lower than atmospheric        pressure and/or approaching 0 psia.    -   vane—any of several usually relatively thin, rigid, flat, and/or        sometimes curved surfaces radially mounted along an axis, as a        blade in a turbine or a sail on a windmill, that is turned by        and/or used to turn a fluid.    -   variance—a measure of variation of a set of observations defined        by a sum of the squares of deviations from a mean, divided by a        number of degrees of freedom in the set of observations.    -   vent—to release from confinement.    -   version—a particular form or variation of an earlier and/or        original type.    -   via—by way of and/or utilizing.    -   vibrate—to move back and forth or to and fro, especially        rhythmically and/or rapidly.    -   volume—a mass and/or a three-dimensional region that an object        and/or substance occupies.    -   wall—a partition, structure, and/or mass that serves to enclose,        divide, separate, segregate, define, and/or protect a volume        and/or to support a floor, ceiling, and/or another wall.    -   weight—a force with which a body is attracted to Earth or        another celestial body, equal to the product of the object's        mass and the acceleration of gravity; and/or a factor assigned        to a number in a computation, such as in determining an average,        to make the number's effect on the computation reflect its        importance.    -   wherein—in regard to which; and; and/or in addition to.    -   while—for as long as, during the time that, and/or at the same        time that.    -   within—inside.    -   zircon—a hard, brown to colorless mineral consisting of        zirconium silicate (ZrSiO₄).    -   zone—a portion of an isogrid containing an array of        substantially identically-dimensioned triangular spaces. Within        such an array, certain physical properties of the isogrid and/or        its ligaments (such as compressive strength, shear strength,        elasticity, density, opacity, and/or thermal conductivity, etc.)        can be substantially isotropic, that is, substantially equal in        all directions.

Note

Various substantially and specifically practical and useful exemplaryembodiments of the claimed subject matter, are described herein,textually and/or graphically, including the best mode, if any, known tothe inventors for carrying out the claimed subject matter. Variations(e.g., modifications and/or enhancements) of one or more embodimentsdescribed herein might become apparent to those of ordinary skill in theart upon reading this application. The inventors expect skilled artisansto employ such variations as appropriate, and the inventors intend forthe claimed subject matter to be practiced other than as specificallydescribed herein. Accordingly, as permitted by law, the claimed subjectmatter includes and covers all equivalents of the claimed subject matterand all improvements to the claimed subject matter. Moreover, everycombination of the above described elements, activities, and allpossible variations thereof are encompassed by the claimed subjectmatter unless otherwise clearly indicated herein, clearly andspecifically disclaimed, or otherwise clearly contradicted by context.

The use of any and all examples, or exemplary language (e.g., “such as”)provided herein, is intended merely to better illuminate one or moreembodiments and does not pose a limitation on the scope of any claimedsubject matter unless otherwise stated. No language in the specificationshould be construed as indicating any non-claimed subject matter asessential to the practice of the claimed subject matter.

Thus, regardless of the content of any portion (e.g., title, field,background, summary, description, abstract, drawing figure, etc.) ofthis application, unless clearly specified to the contrary, such as viaexplicit definition, assertion, or argument, or clearly contradicted bycontext, with respect to any claim, whether of this application and/orany claim of any application claiming priority hereto, and whetheroriginally presented or otherwise:

-   -   there is no requirement for the inclusion of any particular        described or illustrated characteristic, function, activity, or        element, any particular sequence of activities, or any        particular interrelationship of elements;    -   no characteristic, function, activity, or element is        “essential”;    -   any elements can be integrated, segregated, and/or duplicated;    -   any activity can be repeated, any activity can be performed by        multiple entities, and/or any activity can be performed in        multiple jurisdictions; and    -   any activity or element can be specifically excluded, the        sequence of activities can vary, and/or the interrelationship of        elements can vary.

The use of the terms “a”, “an”, “said”, “the”, and/or similar referentsin the context of describing various embodiments (especially in thecontext of the following claims) are to be construed to cover both thesingular and the plural, unless otherwise indicated herein or clearlycontradicted by context. The terms “comprising,” “having,” “including,”and “containing” are to be construed as open-ended terms (i.e., meaning“including, but not limited to,”) unless otherwise noted.

Moreover, when any number or range is described herein, unless clearlystated otherwise, that number or range is approximate. Recitation ofranges of values herein are merely intended to serve as a shorthandmethod of referring individually to each separate value falling withinthe range, unless otherwise indicated herein, and each separate valueand each separate subrange defined by such separate values isincorporated into the specification as if it were individually recitedherein. For example, if a range of 1 to 10 is described, that rangeincludes all values therebetween, such as for example, 1.1, 2.5, 3.335,5, 6.179, 8.9999, etc., and includes all subranges therebetween, such asfor example, 1 to 3.65, 2.8 to 8.14, 1.93 to 9, etc.

When any claim element is followed by a drawing element number, thatdrawing element number is exemplary and non-limiting on claim scope. Noclaim of this application is intended to invoke paragraph six of 35 USC112 unless the precise phrase “means for” is followed by a gerund.

Any information in any material (e.g., a United States patent, UnitedStates patent application, book, article, etc.) that has beenincorporated by reference herein, is incorporated by reference herein inits entirety to its fullest enabling extent permitted by law yet only tothe extent that no conflict exists between such information and theother statements and drawings set forth herein. In the event of suchconflict, including a conflict that would render invalid any claimherein or seeking priority hereto, then any such conflicting informationin such material is specifically not incorporated by reference herein.

Accordingly, every portion (e.g., title, field, background, summary,description, abstract, drawing figure, etc.) of this application, otherthan the claims themselves, is to be regarded as illustrative in nature,and not as restrictive, and the scope of subject matter protected by anypatent that issues based on this application is defined only by theclaims of that patent.

1-13. (canceled)
 14. A molding composition comprising: a ceramiccomposition comprising silica; an cycloaliphatic epoxy bindercomposition, said cycloaliphatic epoxy binder composition present insaid molding composition in an amount up to 30% by weight of saidmolding composition; a silicone composition comprising a siloxane resin,said silicone composition present in said molding composition in anamount up to 30% by weight of said molding composition; and a solventcomposition adapted to dissolve said cycloaliphatic epoxy bindercomposition and said silicone composition.
 15. The molding compositionof claim 14, wherein: said ceramic composition comprises approximately 1percent to approximately 20 percent cristobalite by weight of saidceramic composition
 16. The molding composition of claim 14, wherein:said ceramic composition comprises zircon.
 17. The molding compositionof claim 14, wherein: said ceramic composition comprises alumina. 18.The molding composition of claim 14, wherein: said epoxy bindercomposition and said silicone composition are dissolvable via apredetermined solvent.
 19. A method comprising: causing crosslinking ofat least a portion of a plurality of cross-linkable molecules comprisedby a predetermined molding composition comprising: a ceramic compositioncomprising silica; an cycloaliphatic epoxy binder composition, saidcycloaliphatic epoxy binder composition present in said moldingcomposition in an amount up to 30% by weight of said moldingcomposition; a silicone composition comprising a siloxane resin, saidsilicone composition present in said molding composition in an amount upto 30% by weight of said molding composition; and a solvent compositionadapted to dissolve said cycloaliphatic epoxy binder composition andsaid silicone composition.
 20. A method comprising: causingcross-linking of at least a portion of a plurality of cross-linkablemolecules comprised by said molding composition of claim 14 while saidmolding composition is within a stack-lamination-derived mold.
 21. Themethod of claim 19, further comprising: mixing ingredients of saidmolding composition in said stack-lamination-derived mold.
 22. Themethod of claim 19, further comprising: creating said moldingcomposition in said stack-lamination-derived mold.
 23. (canceled) 24.The method of claim 19, further comprising: placing aphotolithographically-derived foil structure into saidstack-lamination-derived mold such that a first alignment feature ofsaid foil structure interacts with a corresponding second alignmentfeature formed in said stack-lamination-derived mold, said foilstructure comprising a plurality of apertures.
 25. The method of claim19, further comprising: while said molding composition is present withinsaid stack-lamination-derived mold, placing an insert into said moldingcomposition.
 26. The method of claim 19, further comprising: while saidmolding composition is present within said stack-lamination-derivedmold, placing an insert into said molding composition, said insertcomprising an insert alignment feature that aligns with a mold alignmentfeature comprised by said stack-lamination-derived mold.
 27. The methodof claim 19, further comprising: while said molding composition ispresent within said stack-lamination-derived mold, placing aphotolithographically-derived insert into said molding composition. 28.(canceled)
 29. The method of claim 19, further comprising: while saidmolding composition is present within said stack-lamination-derivedmold, densifying particles of said ceramic composition in said moldingcomposition. 30-36. (canceled)
 37. The method of claim 19, furthercomprising: after said causing cross-linking, separating said moldingcomposition from said stack-lamination-derived mold.
 38. The method ofclaim 19, further comprising: after said causing cross-linking,separating a cast device from said stack-lamination-derived mold. 39.The method of claim 19, further comprising: after said causingcross-linking, pulling a cast device from said stack-lamination-derivedmold non-perpendicularly to a pull-plane of saidstack-lamination-derived mold.
 40. The method of claim 19, furthercomprising: after said causing cross-linking, applying a desired shapeto a cast device formed from said molding composition.
 41. The method ofclaim 19, wherein: said crosslinking is caused while said moldingcomposition is located within a stack-lamination-derived mold that isderived from a photolithographically-generated stack-foil laminationmold.
 42. The method of claim 19, wherein: said crosslinking is causedwhile said molding composition is located within a saidstack-lamination-derived mold that defines a plurality of wall surfaces,a wall surface from said plurality of wall surfaces comprising aplurality of 3-dimensional micro-features that substantially spatiallyinvertedly replicate an ancestor mold surface defined by a plurality oflayers of a metallic foil stack lamination ancestor mold, said pluralityof 3-dimensional micro-features comprising at least one protrudingundercut, said plurality of wall surfaces defining a periphery of alayer-less volume. 43-51. (canceled)
 52. A device comprising: a devicecomposition comprising: a ceramic composition comprising silica; ancycloaliphatic epoxy binder composition, said cycloaliphatic epoxybinder composition present in said molding composition in an amount upto 30% by weight of said device composition; and a silicone compositioncomprising a siloxane resin, said silicone composition present in saidmolding composition in an amount up to 30% by weight of said devicecomposition; said device formed via a predetermined mold, said devicedefining a plurality of wall surfaces, a wall surface from saidplurality of wall surfaces comprising a plurality of 3-dimensionalmicro-features that substantially spatially invertedly replicate anancestor mold surface defined by an ancestor mold, said plurality of3-dimensional micro-features comprising at least one protrudingundercut, said plurality of wall surfaces defining a periphery of alayer-less volume.
 53. A method comprising: after removing a cast devicefrom a stack-lamination-derived mold, said cast device formed from amolding composition, applying a desired shape to said cast device toform a shaped cast device, said molding composition comprising: aceramic composition comprising silica; an cycloaliphatic epoxy bindercomposition, said cycloaliphatic epoxy binder composition present insaid molding composition in an amount up to 30% by weight of saidmolding composition; a silicone composition comprising a siloxane resin,said silicone composition present in said molding composition in anamount up to 30% by weight of said molding composition; and a solventcomposition adapted to dissolve said cycloaliphatic epoxy bindercomposition and said silicone composition.
 54. A method comprising:after removing a cast device from a stack-lamination-derived mold, saidcast device comprising a reduced solvent version of said moldingcomposition of claim 14, applying a desired shape to said cast device toform a shaped cast device. 55-58. (canceled)
 59. The method of claim 54,further comprising: firing said shaped cast device.
 60. The method ofclaim 54, further comprising: sintering particles of said ceramiccomposition in said shaped cast device.
 61. The method of claim 54,further comprising: coupling said cast device to a part.
 62. The methodof claim 54, further comprising: coupling said shaped cast device to apart.
 63. The method of claim 54, further comprising: casting investmentmaterial around said shaped cast device.
 64. The method of claim 54,wherein: said cast device defines a plurality of wall surfaces, a wallsurface from said plurality of wall surfaces comprising a plurality of3-dimensional micro-features that substantially spatially invertedlyreplicate an ancestor mold surface defined by a plurality of layers of ametallic foil stack lamination ancestor mold, said plurality of3-dimensional micro-features comprising at least one protrudingundercut, said plurality of wall surfaces defining a periphery of alayer-less volume.
 65. The method of claim 54, wherein: said shaped castdevice defines a plurality of wall surfaces, a wall surface from saidplurality of wall surfaces comprising a plurality of 3-dimensionalmicro-features that substantially spatially invertedly replicate anancestor mold surface defined by a plurality of layers of a metallicfoil stack lamination ancestor mold, said plurality of 3-dimensionalmicro-features comprising at least one protruding undercut, saidplurality of wall surfaces defining a periphery of a layer-less volume.66. The method of claim 54, further comprising: casting investmentmaterial around said shaped cast device to form an investment cast part.67. The method of claim 54, further comprising: after casting investmentmaterial around said shaped cast device to form an investment cast part,removing said shaped cast device from said investment cast part.
 68. Themethod of claim 54, further comprising: casting investment materialaround said shaped cast device to form an investment cast part, saidinvestment cast part defining a plurality of wall surfaces, a wallsurface from said plurality of wall surfaces comprising a plurality of3-dimensional micro-features that substantially spatially invertedlyreplicate an ancestor mold surface defined by a plurality of layers of ametallic foil stack lamination ancestor mold, said plurality of3-dimensional micro-features comprising at least one protrudingundercut, said plurality of wall surfaces defining a periphery of alayer-less volume.
 69. A device comprising: a ceramic compositioncomprising silica; said device formed via a predeterminedstack-lamination-derived mold, said device defining a plurality of wallsurfaces, a wall surface from said plurality of wall surfaces comprisinga plurality of 3-dimensional micro-features that substantially spatiallyinvertedly replicate an ancestor mold surface defined by an ancestormold, said plurality of 3-dimensional micro-features comprising at leastone protruding undercut, said plurality of wall surfaces defining aperiphery of a layer-less volume.
 70. The device of claim 69, wherein:said ceramic composition comprises approximately 1 percent toapproximately 20 percent cristobalite by weight of said ceramiccomposition.
 71. The device of claim 69, wherein: said ceramiccomposition comprises zircon.
 72. The device of claim 69, wherein: saidceramic composition comprises alumina.
 73. The device of claim 69,further comprising: a photolithographically-derived foil structuresubstantially surrounded by said ceramic composition.
 74. The device ofclaim 69, wherein: said device is adapted to serve as an investmentcasting core.
 75. The device of claim 69, wherein: said device isadapted to serve as a core for an investment cast product.
 76. Thedevice of claim 69, wherein: said device is adapted to serve as a corefor an investment cast turbomachine component.
 77. The device of claim69, wherein: said device is adapted to serve as a core for an investmentcast air foil.
 78. The device of claim 69, wherein: said device isadapted to serve as a core for an investment cast blade.
 79. The deviceof claim 69, wherein: said device is adapted to serve as a core for aninvestment cast vane.
 80. The device of claim 69, wherein: said deviceis adapted to serve as a core for an investment cast nozzle.
 81. Thedevice of claim 69, wherein: said device defines a plurality of coolingpassages for an investment cast product.
 82. A device comprising: aceramic composition comprising silica; and aphotolithographically-derived foil structure substantially surrounded bysaid ceramic composition; said device formed via a predeterminedstack-lamination-derived mold, said device defining a plurality of wallsurfaces, a wall surface from said plurality of wall surfaces comprisinga plurality of 3-dimensional micro-features that substantially spatiallyinvertedly replicate an ancestor mold surface defined by an ancestormold, said plurality of 3-dimensional micro-features comprising at leastone protruding undercut, said plurality of wall surfaces defining aperiphery of a layer-less volume.
 83. The device of claim 82, wherein:said device is a core for an investment cast product.
 84. The device ofclaim 82, wherein: said device is a core for an investment castturbomachine component.
 85. The device of claim 82, wherein: said deviceis a core for an investment cast air foil.
 86. A method comprising:casting investment material around a shaped cast device to form aninvestment cast part, said investment cast part defining a plurality ofwall surfaces, a wall surface from said plurality of wall surfacescomprising a plurality of 3-dimensional micro-features thatsubstantially spatially invertedly replicate an ancestor mold surfacedefined by an ancestor mold, said plurality of 3-dimensionalmicro-features comprising at least one protruding undercut, saidplurality of wall surfaces defining a periphery of a layer-less volume,said shaped cast device formed from a molding composition, said moldingcomposition comprising: a ceramic composition comprising silica; ancycloaliphatic epoxy binder composition, said cycloaliphatic epoxybinder composition present in said molding composition in an amount upto 30% by weight of said molding composition; a silicone compositioncomprising a siloxane resin, said silicone composition present in saidmolding composition in an amount up to 30% by weight of said moldingcomposition; and a solvent composition adapted to dissolve saidcycloaliphatic epoxy binder composition and said silicone composition.87. A method comprising: casting investment material around a shapedcast device to form an investment cast part, said investment cast partdefining a plurality of wall surfaces, a wall surface from saidplurality of wall surfaces comprising a plurality of 3-dimensionalmicro-features that substantially spatially invertedly replicate anancestor mold surface defined by an ancestor mold, said plurality of3-dimensional micro-features comprising at least one protrudingundercut, said plurality of wall surfaces defining a periphery of alayer-less volume.
 88. A method comprising: casting investment materialaround a shaped cast device to form an investment cast part, saidinvestment cast part defining a plurality of wall surfaces, a wallsurface from said plurality of wall surfaces comprising a plurality of3-dimensional micro-features that substantially spatially invertedlyreplicate an ancestor mold surface defined by an ancestor mold, saidplurality of 3-dimensional micro-features comprising at least oneprotruding undercut, said plurality of wall surfaces defining aperiphery of a layer-less volume, said shaped cast device comprising: aceramic composition comprising silica; and a silicone compositioncomprising a siloxane resin, said silicone composition present in saidmolding composition in an amount up to 30% by weight of said shaped castdevice.
 89. An apparatus comprising: a first device formed via apredetermined stack-lamination-derived mold, said first device defininga plurality of wall surfaces, a wall surface from said plurality of wallsurfaces comprising a plurality of 3-dimensional micro-features thatsubstantially spatially invertedly replicate an ancestor mold surfacedefined by an ancestor mold, said plurality of 3-dimensionalmicro-features comprising at least one protruding undercut, saidplurality of wall surfaces defining a periphery of a layer-less volume;and a second device not formed via any stack-lamination-derived mold,said second device operatively fastened to said first device.
 90. Themethod of claim 19, wherein: said crosslinking is caused while saidmolding composition is located within a stack-lamination-derived mold,said molding composition.
 91. The method of claim 19, furthercomprising: after said causing cross-linking, sintering a combination ofa first cast device formed from said molding composition and a secondcast device.
 92. The device of claim 52, wherein: said predeterminedmold is a stack-lamination-derived mold.
 93. The device of claim 52,wherein: said ancestor mold is a metallic foil stack lamination mold.94. The device of claim 52, wherein: said device comprises a firstplanar surface adapted to be transformed into a non-planar surface viathermoforming said composition.
 95. The device of claim 52, wherein:said device composition comprises approximately 1 percent toapproximately 20 percent cristobalite by weight of said ceramiccomposition.
 96. The device of claim 52, wherein: said devicecomposition comprises zircon.
 97. The device of claim 52, wherein: saiddevice composition comprises alumina.
 98. The device of claim 52,wherein: said epoxy binder composition and said silicone composition aredissolvable via a predetermined solvent.
 99. The device of claim 69,wherein: said ancestor mold is a metallic foil stack lamination. 100.The device of claim 69, wherein: said ancestor mold surface is definedby a plurality of layers of said ancestor mold, said ancestor mold ametallic foil stack lamination.
 101. The device of claim 69, wherein:said device is removable from said ancestor mold without damage to saiddevice and without damage to said ancestor mold.
 102. The device ofclaim 82, wherein: said ancestor mold is a metallic foil stacklamination.
 103. The device of claim 82, wherein: said ancestor moldsurface is defined by a plurality of layers of said ancestor mold, saidancestor mold a metallic foil stack lamination.
 104. The device of claim86, wherein: said ancestor mold is a metallic foil stack lamination.105. The device of claim 86, wherein: said ancestor mold surface isdefined by a plurality of layers of said ancestor mold, said ancestormold a metallic foil stack lamination.
 106. The device of claim 87,wherein: said ancestor mold is a metallic foil stack lamination. 107.The device of claim 87, wherein: said ancestor mold surface is definedby a plurality of layers of said ancestor mold, said ancestor mold ametallic foil stack lamination.
 108. The device of claim 87, wherein:said shaped cast device is removable from said ancestor mold withoutdamage to said shaped cast device and without damage to said ancestormold.
 109. The device of claim 88, wherein: said ancestor mold is ametallic foil stack lamination.
 110. The device of claim 88, wherein:said ancestor mold surface is defined by a plurality of layers of saidancestor mold, said ancestor mold a metallic foil stack lamination. 111.The device of claim 88, wherein: said shaped cast device is removablefrom said ancestor mold without damage to said shaped cast device andwithout damage to said ancestor mold.
 112. The device of claim 89,wherein: said ancestor mold is a metallic foil stack lamination. 113.The device of claim 89, wherein: said ancestor mold surface is definedby a plurality of layers of said ancestor mold, said ancestor mold ametallic foil stack lamination.
 114. The device of claim 89, wherein:said first device is removable from said ancestor mold without damage tosaid first device and without damage to said ancestor mold.